Proceedings of the Korean Powder Metallurgy Institute Conference (한국분말야금학회:학술대회논문집)
- 2006.09b
- /
- Pages.922-923
- /
- 2006
Ultra High Conductivity Diamond Composites
Abstract
Thermal management is one of the critical aspects in the design of highly integrated microelectronic devices. The reliability of electronic components is limited not only to operating temperature but also by the thermal stresses caused during the operation. The need for higher power densities calls for use of advanced heat spreader materials. A copper diamond composite has been developed with high thermal conductivity
Keywords