• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09a
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• pp.377-378
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• 2006

Thermal management technology is a critical element in all new chip generations, caused by a power multiplication combined with a size reduction. A heat sink, mounted on a base plate, requires the use of special materials possessing both high thermal conductivity (TC) and a coefficient of thermal expansion (CTE) that matches semiconductor materials as well as certain packaging ceramics. In this study, nano tungsten coated copper powder has been developed with a wide range of compositions, 90W-10Cu to 10W-90Cu. Powder technologies were used to make samples to evaluate density, TC, and CTE. Measured TC lies among theoretical values predicted by several existing models.

• Journal of the Computational Structural Engineering Institute of Korea
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• v.27 no.5
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• pp.393-401
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• 2014

In this paper, we propose an evaluation scheme of the coefficients of thermal expansion (CTE) of constituents in composite materials using an inverse analysis. The size of constituents typically is about a few micrometers, which makes the identification of material properties difficult as well as the measurement results inaccurate. The proposed inverse analysis scheme, which is combined with the Mori-Tanaka method for predicting an equivalent CTE of composite materials, provides the CTE of the constituents in a straightforward manner by minimizing the cost function defined in lamina scale with the steepest descent method. To demonstrate the effectiveness and accuracy of the proposed scheme, the CTEs of several fibers (glass fiber, P75, P100, and M55J) embedded in matrix are evaluated and compared with experimental results. Furthermore, we discuss the effects of uncertainty of laminar and matrix properties on the prediction of fiber properties.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.65 no.9
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• pp.1504-1510
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• 2016

The aim of this study is to improve properties both glass transition temperature($T_g$) and coefficient of thermal expansion(CTE) using epoxy/micro-nano alumina composites with adding glycerol diglycidyl ether (GDE:1,2,3,5g). This paper deals with the effects of GDE addition for epoxy/micro alumina contents (40, 50, 60wt%)+surface modified nano alumina(1_phr) composites. 20 kinds specimen were prepared with containing micro, nano alumina and GDE as a micro composites(10, 20, 30, 40, 50, 60, 70wt%) or a nano/micro alumina composites(1phr/40, 50, 60wt%). Average particle size of nano and micro alumina used were 30nm and $1{\sim}2{\mu}m$, respectively. The micro alumina used were alpha phase with Heterogeneous and nano alumina were gamma phase particles of spherical shape. The glass transition temperature and coefficients of thermal expansion was evaluated by DSC and TMA. The glass transition temperature decreased and coefficients of thermal expansion become smaller with filled contents of epoxy/micro alumina composites. On the other hand, $T_g$ and CTE as GDE addition variation(1,2,3,5g) of epoxy/micro-nano alumina composites decreased and increased respectively.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.25 no.10
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• pp.798-804
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• 2012

This paper focuses on thermal properties of a newly prepared composite material by nano-silica and micro-silica mixture. Nano-silica and micro-silica mixture composites were made by dispersing surface treated nano-silica(average radius: 10 nm) and micro-size silica in epoxy resin. To investigate the effects of nano-silica and micro-size silica mixture(ENMC), the glass transition temperature (Tg), coefficients of thermal expansion(CTE) and elastic modulus of DMA properties by DSC, TMA and DMA devices were measured for the ENMC according to increase nano-silica addition contents and EMC. All properties of the neat epoxy were improved by the addition of micro-silica, which was improved much further by the addition of surface treated nano-silica to the EMC system.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.28 no.11
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• pp.1646-1655
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• 2004

A description of the basic principles of moire interferometry leads to the design of a eight-mirror four-beam interferometer for obtaining fringe patterns representing contour-maps of in-Plane displacements. The technique is implemented by the optical system using an environmental chamber for submicro-displacement mesurement. In order to estimate the reliability and applicabili쇼 of the system developed, the measurement of coefficient of thermal expansion (CTE) for a aluminium block is performed. Consequently, the system is applied to the measurement of thermal deformation of a WB-PBGA package assembly. Temperature dependent analyses of global and local deformations are presented to study the effect of the mismatch of CTE between materials composed of the package assemblies. Bending displacements of the packages and average strains of solder balls are documented. Thermal induced displacements calculated by FEM agree quantitatively with experimental results.

• Korean Journal of Materials Research
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• v.11 no.10
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• pp.863-868
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• 2001

The present study was carried out to investigate the effect of MA processing variables on the microstructural properties of composite powders and the coefficient of thermal expansion of pulse electric current sintered AlN-Cu powder compacts. The AlN-Cu powders had a size of less than 15 $\mu\textrm{m}$ with 25 nm size of copper crystallite after MA 32 hours. The finely distributed AlN-Cu powder compacts were completely achieved after PECS. The residual oxygen was considerably removed after hydrogen reduction treatment. The residual carbon was completely removed to 97%. The CTE of AlN-Cu powder compacts showed a good consistency with Kingery-Tuner model when the volume fraction of copper was less than 60%. When it was more than 60%, the CTE had a good agreement with Series model.

• Polymer(Korea)
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• v.33 no.6
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• pp.530-536
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• 2009

A cycloaliphatic epoxy/acidic anhydride system incorporating short carbon fibers (SCF) and short glass fibers (SGF) was fabricated and thermal/mechanical properties were characterized. At low filler content both SCF- and SGF-reinforced composites showed a similar decrease in coefficient of thermal expansion (CTE), measured by a thermomechanical analyzer, with increasing loadings, above which SCF became more effective than SGF at reducing the CTE. Experimental CTE data for the SCF-reinforced composites is best described by the rule of mixtures at lower SCF contents and by the Craft-Christensen model at higher SCF contents. Storage modulus (E') at $30^{\circ}C$ and $180^{\circ}C$ was greatly enhanced for short fiber-filled composites compared to unfilled specimens, Scanning electron microscopy of the fracture surfaces indicated that the decreased CTE and the increased E' of the short fiber-reinforced composites resulted from good interfacial adhesion between the fibers and epoxy matrix.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.36 no.9
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• pp.916-922
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• 2008

Structures being used in space environment, should be designed to have minimum CTE(coefficient of thermal expansion) for the dimensional stability. Accurate CTE data of the materials are required to design the space structures consisting of various materials. There are uncertainties in the characteristics of materials even though the same manufacturing processes are applied. Therefore, it is needed to measure the thermal deformation of not only the material specimen but also substructures in simulated space environment, such as high vacuum condition. In this research, therefore, precise CTE measurement system using displacement measuring interferometer and vacuum chamber has been designed with uncertainty analysis of the measurements. This system can be used to measure the CTE of the specimen or thermal expansion of the substructure with varying size up to 50cm in length. To measure the low CTE material, overall uncertainty of this system is expected under 0.01ppm/K.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.3
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• pp.37-44
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• 2013

It is well known that thermal deformation of electronic packages with Pb-Sn solder and with lead-free solder is significantly affected by material properties consisting the package, as well as those of the solder itself. In this paper, the method for determining coefficient of thermal expansion(CTE) of new material is established by using temperature characteristic of strain gages, and the CTE of molding compound are obtained experimentally. The temperature-dependent CTE of molding compound for Pb-Sn solder and that for lead-free solder are obtained by using strain measurements with well known steel specimen and aluminium specimen as reference specimens, and the CTE's are also measured non-contactly by using moire interferometry. Those results are compared, and the agreement between the two types of strain gage experiment and the moire experiment show the strain gage method used in this paper to be reliable. In the case of the molding compound for Pb-Sn solder, the CTE is measured as approximately $15.8ppm/^{\circ}C$ regardless of the temperature. In the case for the lead-free solder, the CTE is measured as of approximately $9.9ppm/^{\circ}C$ below the temperature of $100^{\circ}C$, and then the CTE is increased sharply depending on the temperature, and reaches to $15.0ppm/^{\circ}C$ at $130^{\circ}C$.

• Journal of Powder Materials
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• v.1 no.1
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• pp.52-59
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• 1994

Since the coefficient of thermal expansion (CTE) of matrix phase is larger about 4 times than that of W particle in tungsten heavy alloy, the thermal stresses due to the CTE difference between the two phases are induced in the alloy during heating and cooling processes. In the present study, a series of W heavy alloy containing various W particle volumes of 0 to 90% is made to investigate the residual stress taking place during cooling process. The CTE and residual stress of the series of alloy are measured by dilatometer and X-ray diffractometer. The residual stress of W particle is in compressive stress irrespective of W particle vol% and tends to increase with decreasing W particle vol% while that of the matrix phase is in tensile stress. The measured residual stress of W particle is about a third of calculated thermal stress. The influence of W particle vol% on the residual stress of W heavy alloy is discussed in terms of the deformation behaviors of W particle and matrix phase.