• Fisheries and Aquatic Sciences
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• v.5 no.1
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• pp.36-42
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• 2002

Microarrayer is used to make DNA chip and microarray that contain hundreds to thousands of immobilized DNA probes on surface of a microscope slide. This paper shows the develop-ment results for a printing type of microarrayer. It realizes a typical, low-cost and efficient microarrayer for generating low density micro array. The microarrayer is developed by using a prependicular type robot with three axes. It is composed of a computer-controlled three-axes robot and a pen tip assembly. The key component of the arrayer is the print-head containing the tips to immobilize cDNA, genomic DNA or similar biological material on glass surface. The robot is designed to automatically collect probes from two 96-well plates with up to 12 pens at the same time. To prove the performance of the developed microarrayer, we use the general water types of inks such as black, blue and red. The inks are distributed at proper positions of 96 well plates and the three color inks are immobilized on the slide glass under the operation procedure. As the result of the test, we can see that it has sufficient performance for the production of low integrated DNA chip consisted of 96 spots within $1cm^2$ area.

• Journal of the Korean Society for Precision Engineering
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• v.31 no.9
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• pp.831-838
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• 2014

Chip on glass (COG) bonding using anisotropic conductive film (ACF) is a key technology to assemble a driver IC onto a LCD glass panel. In this paper, an experimental investigation was conducted to investigate the correlation between contact resistance and characteristics of image taken by machine vision based inspection system. The results show that the contact resistance was strongly influenced by the contrast ratio of conductive particle rather than the number of conductive particles. Also, number of conductive particles whose contrast ratio is below 0.75 is crucial for determining the quality of the assembled samples. On the other hand, in the result of high temperature high humidity storage test, the contrast ratio of samples was increased. However, in the case of open-circuit samples after temperature humidity storage test, the number of conductive particles whose contrast ratio is above 0.75 was more than that of the closed-circuit samples.

• Proceedings of the Korean Society of Laser Processing Conference
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• 2006.11a
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• pp.53-81
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• 2006

A COG(Chip on Glass) bonding process that is one of display packaging technology and bonds between driver IC chip and a glass panel using ACF(Anisotropic Conductive Film)has been investigated by using diode laser. This method is possible to raise cure temperature of ACF within one second and can reduce the total process time for COG bonding by a conventional method such as a hot plate. Also we can get good pressure mark on the surface of electrodes and higher bonding strength than that by convention method. Results show that laser COG bonding can give low pressure bonding and decrease a warpage of panel. We believe that it can be applied to fine pitch module.

• Journal of Sensor Science and Technology
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• v.18 no.1
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• pp.42-47
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• 2009

In this paper we propose a microfluidic chip that measures the mechanical stiffness of cell membrane using impedance measurement. The microfluidic chip is composed of PDMS channel and a glass substrate with electrode. The proposed device uses patch-clamp technique to capture and deform a target cell and measures impedance of deformed cells. We demonstrated that the impedance increased after the membrane stretched and blocked the channel.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.11a
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• pp.69-69
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• 2004

• Journal of the Microelectronics and Packaging Society
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• v.21 no.2
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• pp.53-57
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• 2014

Thin glass (< 100 microns) is a promising material from which advanced interposers for high density electrical interconnects for 2.5D chip packaging can be produced. But thin glass is extremely brittle, so mechanical micromachining to create through glass vias (TGVs) is particularly challenging. In this article we show how laser processing using deep UV excimer lasers at a wavelength of 193 nm provides a viable solution capable of drilling dense patterns of TGVs with high hole counts. Based on mask illumination, this method supports parallel drilling of up over 1,000 through vias in 30 to $100{\mu}m$ thin glass sheets. (We also briefly discuss that ultrafast lasers are an excellent alternative for laser drilling of TGVs at lower pattern densities.) We present data showing that this process can deliver the requisite hole quality and can readily achieve future-proof TGV diameters as small $10{\mu}m$ together with a corresponding reduction in pitch size.

• International Journal of Precision Engineering and Manufacturing
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• v.8 no.1
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• pp.11-15
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• 2007

Composite materials are widely used to make all kinds of machine parts, internal and structural materials of cars, aerospace components, building structures, ship materials, sporting goods and others, It is worth while to use composite space substitute material in various applications when compared with others. But the use of composite material is limited in the field of the mechanical processing because of the difficulties in processing. Thus, it is proved that the surface is rough at the in and out sections of the hole processing when the GFRP is machined with HSS drill in the vertical machining center. And it is observed that the more it is processed, the more the fluid type long chip is changed into the powdered chip.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.38 no.6
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• pp.412-419
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• 2001

In accordance with the PON(passive optical network) could be setup, effective connections with light sources, optical detectors, and optical fibers are the best sensitive points to represent the efficiency of network. Therefore, in this paper we designed and fabricated optical transceiver connection chip that was consisted of channel waveguide, Y-branch, and CWDM on the 2" BK7 glass substrate. This chip can be used for 1.31/1.55${\mu}{\textrm}{m}$ CWDM network and 1.55${\mu}{\textrm}{m}$ region dense WDM network.work.

• Journal of the Korean Ceramic Society
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• v.36 no.5
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• pp.490-496
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• 1999

The sintering behavior of LTCC (low temperature cofired ceramics) chip couplers was investigated in relation with Ag diffusion at the interface of glass ceramic substrate-Ag electrode. Sintering temperature was in the range of 825$^{\circ}C$-975$^{\circ}C$. The commercial green sheet and silver electrode were used. Below 875$^{\circ}C$ the diffusion of the Ag ion into the substrate and the penetration of glassy phases into the electrode occurred due to an increase of fluidity. Thus the lectrode line was severely deformed and damaged. At 975$^{\circ}C$ the transformation of crystalline phases into glassy phases and the melting of the Ag electrode resulted in the diffusion of the considerable amount of Ag ions.

• KSBB Journal
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• v.24 no.5
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• pp.432-438
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• 2009

Here, we demonstrated simple nucleic acid, RNA, concentration method using polymer micro chip containing glass bead ($100\;{\mu}m$). Polymer micro chip was fabricated by PDMS ($1.5\;cm\;{\times}\;1.5\;cm$, $100\;{\mu}m$ in the height) including pillar structure ($160\;{\mu}m\;(I)\;{\times}\;80\;{\mu}m\;(w)\;{\times}\;100\;{\mu}m\;(h)$, gap size $50\;{\mu}m$) for blocking micro bead. RNA could be adsorbed on micro glass bead at low pH by hydrogen bonding whereas RNA was released at high pH by electrostatic force between silica surface and RNA. Amount of glass beads and flow rate were optimized in aspects of adsorption and desorption of RNA. Adsorption and desorption rate was measured with real time PCR. This concentrated RNA was applied to amplification micro chip in which NASBA (Nucleic Acid Sequence Based Amplification) was performed. As a result, E.coli O157 : H7 in the concentration of 10 c.f.u./10 mL was successfully detected by these serial processes (concentration and amplification) with polymer micro chips. It implies this simple concentration method using polymer micro chip can be directly applied to ultra sensitive method to measure viable bacteria and virus in clinical samples as well as environmental samples.