• Title/Summary/Keyword: chip form

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Implementation of Position Control of PMSM with FPGA

  • Reaugepattanawiwat, Chalermpol;Eawsakul, Nitipat;Watjanatepin, Napat;Pinprathomrat, Prasert;Desyoo, Phayung
    • 제어로봇시스템학회:학술대회논문집
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    • 2004.08a
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    • pp.1254-1258
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    • 2004
  • This paper presents of position control of Permanent Magnet Synchronous Motor (PMSM) the implementation with Field Programmable Gate Array (FPGA) is proposed. Cascade control with inner loop as a current control and an outer loop as a position control is chosen for simplicity and fast response. FPGA is a single chip (single processing unit), which will perform the following tasks: receive and convert control signal, create a reference current signal, control current and create switch signal and act as position controller in a addition of zero form. The 10 kHz sampling frequency and 25 bit of floating point data are defined in this implementation.The experimental results show that the performance of FPGA based position control is comparable with the hardware based position control, with the advantage of control algorithm flexibility

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FPGA Implementation of Resolver-based Absolute Position Sensor Driver (레졸버 기반의 절대위치 검출 센서 드라이버의 FPGA 구현)

  • Jeon, Ji-Hye;Shin, Dong-Yun;Yang, Yoon-Gi;Hwang, Jin-Kwon;Lee, Chang-Su
    • Journal of Institute of Control, Robotics and Systems
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    • v.13 no.10
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    • pp.970-977
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    • 2007
  • Absolute position detector which is one of the major equipment in the field of factory automation, not only perceives the absolute position of the rotary machine but also outputs switch data according to the given angle. Absolute position detector is composed of sensor module and its controller. In this paper, a sensor driver is implemented using FPGA with VHDL. This chip has a less form factor than conventional circuit. A test shows reliable precision within THD(total harmonic distortion) of 0.2% which can be applicable commercially. Also, FPGA-based phase error compensation methods were newly discussed. In the future, more research will be conducted to enhance the precision by the introduction of 3-phase transformer.

Advances in Package-on-Package Technology for Logic + Memory Integration

  • Scanlan Christopher
    • Proceedings of the International Microelectronics And Packaging Society Conference
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    • 2005.09a
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    • pp.111-129
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    • 2005
  • Pop provides OEMs and EMS with a platform to cost effectively expand options for logic + memory 3D integration - Expands device options by simplifying business logistics of stacking - Integration controlled at the system level to best match stacked combinations with system requirements - Eliminates margin stacking and expands technology reuse - Helps manage the huge cost impacts associated with increasing demand for multi media processing and memory. PoP is well timed to enable and leverage: - Mass customization of systems for different use (form, fit and function) requirements o Bband and apps processor + memory stack platforms - Logic transition to flip chip enables PoP size reduction o Area and height reduction. Industry standardization is progressing. Amkor provides full turn-key support for base package, memory package and full system integration.

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The Destruction Effects of Semiconductors by High Power Electromagnetic Wave (고출력 과도전자파에 의한 반도체 소자의 파괴효과)

  • Hwang, Sun-Mook;Hong, Joo-Il;Huh, Chang-Su
    • The Transactions of The Korean Institute of Electrical Engineers
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    • v.56 no.9
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    • pp.1638-1642
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    • 2007
  • This paper investigated the destruction effect of the semiconductors by impact of high power electromagnetic wave. The experiments is employed as an open-ended waveguide to study the destruction effects on semiconductor using a 2.45 GHz 600 W Magnetron as a high power electromagnetic wave. The semiconductors are located at a distance of $31cm\sim40cm$ from the open-ended waveguide and are composed of a LED drive circuit for visual discernment. Also the chip condition of semiconductor is observed by SEM(Scanning Electron Microscope) analysis. The semiconductor are damaged by high power electromagnetic wave at about 860 V/m. The SEM analysis of the destructed devices showed onchipwire and bondwire destructions. Based on the result, semiconductor devices should have plan to protect the semiconductor devices form high power electromagnetic wave. And the database from this experiment provides the basis for future investigation.

Trend of AI Neuromorphic Semiconductor Technology (인공지능 뉴로모픽 반도체 기술 동향)

  • Oh, K.I.;Kim, S.E.;Bae, Y.H.;Park, K.H.;Kwon, Y.S.
    • Electronics and Telecommunications Trends
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    • v.35 no.3
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    • pp.76-84
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    • 2020
  • Neuromorphic hardware refers to brain-inspired computers or components that model an artificial neural network comprising densely connected parallel neurons and synapses. The major element in the widespread deployment of neural networks in embedded devices are efficient architecture for neuromorphic hardware with regard to performance, power consumption, and chip area. Spiking neural networks (SiNNs) are brain-inspired in which the communication among neurons is modeled in the form of spikes. Owing to brainlike operating modes, SNNs can be power efficient. However, issues still exist with research and actual application of SNNs. In this issue, we focus on the technology development cases and market trends of two typical tracks, which are listed above, from the point of view of artificial intelligence neuromorphic circuits and subsequently describe their future development prospects.

Cryogenic Machining of Open-Cell Silicone Foam (액화질소를 이용한 오픈 셀 실리콘 폼의 냉동 절삭조건 최적화)

  • Hwang, Jihong;Cho, Kwang-Hee;Park, Min-Soo
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.23 no.1
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    • pp.32-37
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    • 2014
  • Open-cell silicon foam is difficult to cut using conventional machining processes because of its low stiffness. That is, open-cell silicon foam is easily pressed down when the tool is engaged, which makes it difficult to remove the material in the form of chip. This study proposes an advanced method of machining open-cell silicon foam by freezing the material using liquid nitrogen. Furthermore, the machining conditions are optimized to maximize the efficiency of material removal and minimize the usage of liquid nitrogen by conducting experiments under various machining conditions. The results show that open-cell silicone foam products with free surface can be successfully machined by employing the proposed method.

Scratchpad Memory Architectures and Allocation Algorithms for Hard Real-Time Multicore Processors

  • Liu, Yu;Zhang, Wei
    • Journal of Computing Science and Engineering
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    • v.9 no.2
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    • pp.51-72
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    • 2015
  • Time predictability is crucial in hard real-time and safety-critical systems. Cache memories, while useful for improving the average-case memory performance, are not time predictable, especially when they are shared in multicore processors. To achieve time predictability while minimizing the impact on performance, this paper explores several time-predictable scratch-pad memory (SPM) based architectures for multicore processors. To support these architectures, we propose the dynamic memory objects allocation based partition, the static allocation based partition, and the static allocation based priority L2 SPM strategy to retain the characteristic of time predictability while attempting to maximize the performance and energy efficiency. The SPM based multicore architectural design and the related allocation methods thus form a comprehensive solution to hard real-time multicore based computing. Our experimental results indicate the strengths and weaknesses of each proposed architecture and the allocation method, which offers interesting on-chip memory design options to enable multicore platforms for hard real-time systems.

3D Packaging Technology Using Femto Laser (팸토초 레이저를 이용한 3차원 패키징 기술)

  • Kim, Ju-Seok;Sin, Yeong-Ui;Kim, Jong-Min;Han, Seong-Won
    • Proceedings of the KWS Conference
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    • 2006.10a
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    • pp.190-192
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    • 2006
  • The 3-dimensional(3D) chip stacking technology is one of the leading technologies to realize a high density and high performance system in package(SIP). It could be found that it is the advanced process of through-hole via formation with the minimum damaged on the Si-wafer. Laser ablation is very effective method to penetrate through hole on the Si-wafer because it has the advantage that formed under $100{\mu}m$ diameter through-hole via without using a mask. In this paper, we studied the optimum method for a formation of through-hole via using femto-second laser heat sources. Furthermore, the processing parameters of the specimens were several conditions such as power of output, pulse repetition rate as well as irradiation method and time. And also the through-hole via form could be investigated and analyzed by microscope and analyzer.

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Maximum Current Estimation Method for the Backup of Current Sensor Faults

  • Kim, Jae-Yeon;Park, Si-Hyun;Suh, Young-Suk
    • Journal of information and communication convergence engineering
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    • v.18 no.3
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    • pp.201-206
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    • 2020
  • This paper presents a new method for controlling the current of lighting LEDs without current sensors. This method can be used as backup against LED current sensor faults. LED lighting requires a circuit with a constant current in order to maintain the same brightness when the ambient temperature changes. Therefore, we propose a new current estimation method to provide backup in case of current sensor faults based on the calculation of the inductor current. In the fabricated circuit, the average current changes from 144.03 mA to 155.97 mA when the ambient temperature changes from 0℃ to 60℃. The application of this study can enable the fabrication of a driving IC for LEDs in the form of a single chip without sensing resistors. This is expected to reduce the complexity of the peripheral circuit and enable precise feedback control.

BER Performance of Cooperative Transmission for the Uplink of TDD-CDMA Systems

  • Van, Khuong Ho;Kong, Hyung-Yun
    • ETRI Journal
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    • v.28 no.1
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    • pp.17-30
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    • 2006
  • In time division duplex (TDD) code division multiple access (CDMA) systems, chip-synchronous transmission in the uplink is obtainable, thus leading to free multiple access interference in flat Rayleigh fading channels plus additive white Gaussian noise. This motivates us to develop a novel cooperative transmission strategy that allows single-antenna devices to benefit from spatial diversity using orthogonal signature sequences. The proposed cooperation is applicable to many digital modulation methods and achieves the fullest diversity level, low implementation complexity, and a full data rate. Closed-form bit-error-rate expressions were also derived and compared to simulation results in order to evaluate its validity. A variety of numerical results demonstrated the cooperation's superiority over single transmission under the same transmit power constraint.

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