• Journal of Institute of Control, Robotics and Systems
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• v.3 no.6
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• pp.639-643
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• 1997

This paper presents how nonlinear PID control algorithms can be applied on chemical processes for a more stable operation and perfect automation. A pass balance controller is designed to balance the exiting temperatures of a heater and a heat exchange network. The proposed controller has gain-varying integral action and deals with the operational constraints in an efficient manner. Also, the use of a PID gap controller is proposed to maximize energy saving and operation stability and to minimize operator intervention in operation of air fan coolers. The proposed controller adjusts the opening of a louver automatically in such a way that it keeps the air fan pitch position within the desired range. All these nonlinear PID controllers have been implemented on the distributed control system (DCS) for good reliability and operability. Operator acceptance was very high and the implemented controllers have shown good performance and high service factor still now on. The proposed methodology can be directly applied to similar processes without any modification.

• 제어로봇시스템학회:학술대회논문집
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• 1987.10b
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• pp.674-679
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• 1987

Process failures can occur at any time during operation, so a continuous effort of fault detection, diagsis, and correction is required. Expert system paridigm has been regarded as a promising approach to real time process supervisory control especially to fault diagnosis. The most important aspects of fault diagnostic expert systems(FDES) are the problem-solving inference strategy and knowledge organizations. The necessity of FDES, the nature of diagnostic knowledge, the representation of knowledge, and the inference mechanism of FDES, et al. are described, which are announced by previous researchers. And the existing FDES are categorized and critically reviewed in this work.

• Journal of Institute of Control, Robotics and Systems
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• v.20 no.7
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• pp.750-755
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• 2014

Product shortage which causes backordering and/or lost sales cost is very popular in chemical industries, especially in commodity polymer business. This study deals with backordering cost in the supply chain optimization model under the framework of process-inventory network. Classical economic order quantity model with backordering cost suggested optimal time delay and lot size of the final product delivery. Backordering can be compensated by advancing production/transportation of it or purchasing substitute product from third party as well as product delivery delay in supply chain network. Optimal solutions considering all means to recover shortage are more complicated than the classical one. We found three different solutions depending on parametric range and variable bounds. Optimal capacity of production/transportation processes associated with the product in backordering can be different from that when the product is not in backordering. The product shipping cycle time computed in this study was smaller than that optimized by the classical EOQ model.

• 제어로봇시스템학회:학술대회논문집
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• 1988.10a
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• pp.482-487
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• 1988

A sequential-clustered integrator based on GEAR method is developed for the purpose of dynamic simulation of chemical processes. And a single simulator structure capable of employing various integration approaches is designed and its efficiency and flexiblity is evaluated. Sequential integration method is superior to simultaneous method for the process without recycle, but simultaneous method is very powerful for the coupled process with recycle.

• Korean Chemical Engineering Research
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• v.45 no.1
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• pp.87-92
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• 2007

Recently, developments of process monitoring system in order to detect and diagnose process abnormalities has got the spotlight in process systems engineering. Normal data obtained from processes provide available information of process characteristics to be used for modeling, monitoring, and control. Since modern chemical and environmental processes have high dimensionality, strong correlation, severe dynamics and nonlinearity, it is not easy to analyze a process through model-based approach. To overcome limitations of model-based approach, lots of system engineers and academic researchers have focused on statistical approach combined with multivariable analysis such as principal component analysis (PCA), partial least squares (PLS), and so on. Several multivariate analysis methods have been modified to apply it to a chemical process with specific characteristics such as dynamics, nonlinearity, and so on.This paper discusses about missing value estimation and sensor fault identification based on process variable reconstruction using dynamic PCA and canonical variate analysis.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.07a
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• pp.25-28
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• 2001

Recently, STI(Shallow Trench Isolation) process has attracted attention for high density of semiconductor device as a essential isolation technology. Without applying the conventional complex reverse moat process, CMP(Chemical Mechanical Polishing) has established the Process simplification. However, STI-CMP process have various defects such as nitride residue, torn oxide defect, damage of silicon active region, etc. To solve this problem, in this paper, we discussed to determine the control limit of process, which can entirely remove oxide on nitride from the moat area of high density as reducing the damage of moat area and minimizing dishing effect in the large field area. We, also, evaluated the reliability and reproducibility of STI-CMP process through the optimal process conditions.

• 제어로봇시스템학회:학술대회논문집
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• 1991.10a
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• pp.105-107
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• 1991

A chemical process model represented by partial differential equations was studied as one of nonlinear distributed parameter control problems. Using an optimal control theory in the form of maximum principles based on nonlinear integral equations, an algorithm to solve the problem was developed and coded into a computer program.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.05c
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• pp.223-227
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• 2002

As the channel length of device shrinks below $0.13{\mu}m$, CMP(chemical mechanical polishing) process got into key process for global planarization in the chip manufacturing process. The removal rate and non-uniformity of the CMP characteristics occupy an important position to CMP process control. Especially, the post-CMP thickness variation depends on the device yield as well as the stability of subsequent process. In this paper, every wafer polished two times for the improvement of oxide CMP process characteristics. Then, we discussed the removal rate and non-uniformity characteristics of post-CMP process. As a result of CMP experiment, we have obtained within-wafer non-uniformity (WIWNU) below 4 [%], and wafer-to-wafer non-uniformity (WTWNU) within 3.5 [%]. It is very good result, because the reliable non-uniformity of CMP process is within 5 [%].

• Korean Journal of Materials Research
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• v.27 no.9
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• pp.501-506
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• 2017

Surface morphology and optical properties such as transmittance and haze effect of glass etched by physical and chemical etching processes were investigated. The physical etching process was carried out by pen type sandblasting process with $15{\sim}20{\mu}m$ dia. of $Al_2O_3$ media; the chemical etching process was conducted using HF-based mixed etchant. Sandblasting was performed in terms of variables such as the distance of 8 cm between the gun nozzle and the glass substrate, the fixed air pressure of 0.5bar, and the constant speed control of the specimen stage. The chemical etching process was conducted with mixed etching solution prepared by combination of BHF (Buffered Hydrofluoric Acid), HCl, and distilled water. The morphology of the glass surface after sandblasting process displayed sharp collision vestiges with nonuniform shapes that could initiate fractures. The haze values of the sandblasted glass were quantitatively acceptable. However, based on visual observation, the desirable Anti-Glare effect was not achieved. On the other hand, irregularly shaped and sharp vestiges transformed into enlarged and smooth micro-spherical craters with the subsequent chemical etching process. The curvature of the spherical crater increased distinctly by 60 minutes and decreased gradually with increasing etching time. Further, the spherical craters with reduced curvature were uniformly distributed over the etched glass surface. The haze value increased sharply up to 55 % and the transmittance decreased by 90 % at 60 minutes of etching time. The ideal haze value range of 3~7 % and transmittance value range of above 90 % were achieved in the period of 240 to 720 minutes of etching time for the selected concentration of the chemical etchant.

• 제어로봇시스템학회:학술대회논문집
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• 1990.10a
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• pp.131-134
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• 1990

A back-propagation neural network based system for a fault diagnosis of a chemical process is developed. Training data are acquired from FCD(Fault-Consequence Digraph) model. To improve the resolution of a diagnosis, the system is decomposed into 6 subsystems and the training data are composed of 0, 1 and intermediate values. The feasibility of this approach is tested through case studies in a real plant, a naphtha furnace, which has been used to develop a knowledge based expert system, OASYS (Operation Aiding expert SYStem).