• 지식경영연구
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• 제9권4호
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• pp.65-75
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• 2008

Knowledge workers' workload to register knowledge can cause quality defects in the quality as well as the quantity of knowledge that must be accumulated in a knowledge management system(KMS). To enhance the availability of a KMS by acquiring more quality-guaranteed knowledge, autonomous knowledge acquisition which outdoes the automated acquisition must be initiated. Adopting the capabilities of context-awareness and inference in the field of context-aware computing, this paper intends to autonomously identify and acquire knowledge from knowledge workers' daily lives. Based on knowledge workers' context information, such as location, identification, schedule, etc, a methodology to monitor, sense, and gather knowledge that resides in their ordinary discussions is proposed. Also, a prototype systems of the context-based knowledge acquisition system(CKAS), which autonomously dictates, analyzes, and stores dialogue-based knowledge is introduced to prove the validity of the proposed concepts. This paper's methodology and prototype system can support relieving knowledge workers' burden to manually register knowledge, and hence provide a way to accomplish the goal of knowledge management, efficient and effective management of qualified knowledge.

• 열처리공학회지
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• 제18권2호
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• pp.105-111
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• 2005

In sheet metal forming, drawbeads are often used to control uneven material flow, which may cause defects such as wrinkles, fractures, surface distortion and springback. Appropriate setting and adjusting of the drawbead force is one of the most important parameters in sheet forming process control. Therefore in this study, drawbead test was performed at various bead surface treatment conditions to clarify the frictional characteristics between sheet and drawbead. Furthermore, the differences in drawing force between circular and rectangular shape beads have also been measured to estimate the effectiveness of bead shape on the material flow control. The results show that drawing and friction characteristic were strongly influenced by surface treatments of bead and bead shapes.

• 전기학회논문지P
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• 제59권3호
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• pp.253-257
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• 2010

The frequency is an important operation parameter for the control, protection, and stability of a power system. The frequency as a key index of power quality can be indicative of system abnormal conditions and disturbances. Due to the sudden change in generation and loads or faults in power system, the frequency is supposed to deviate from its nominal value. It is essential that the frequency must be maintained very close to its nominal frequency. An accurate monitoring of the power frequency is essential to optimal operation and prevention for wide area blackout. As most conventional frequency estimation schemes are based on DFT filter, it has been pointed out that the gain error could cause defects when the frequency is deviated from nominal value. This paper presents an advanced frequency estimation technique using gain compensation to improve the performance of DFT filter based techniques. To evaluate performance of the proposed algorithm, the 765kV T/L system in Korea is simulated by EMTP-RV software. The proposed technique can reduce the gain error caused when the power system frequency deviates from nominal value.

• 한국건축시공학회:학술대회논문집
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• 한국건축시공학회 2017년도 추계 학술논문 발표대회
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• pp.118-119
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• 2017

The combined waterproofing method is an excellent method to overcome the disadvantages of the single waterproofing method by composing two or more materials to complement each other, but it is a method that can cause defects such as separation and peeling between materials due to the heterogeneity of the applied two materials. In order to improve this, in this study, we aimed to develop a technology for inducing chemical unification between materials through a urea reaction with a coating material applied on the lower side by laminating a nonwoven fabric treated with a modified amine on the back surface of the sheet material, The adhesion performance test was carried out with the presence or absence of denatured amine treated nonwovens as variables. As a result of the test, it was confirmed that the adhesion performance of the specimen to which the modified amin - treated nonwoven fabric was applied was improved by about 60% or more as compared with the specimens not having the denatured amine treated specimen.

• E2M - 전기 전자와 첨단 소재
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• 제9권7호
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• pp.719-726
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• 1996

DLTS measurements were performed to study the annealing induced changes of the trap centers in MOV and to shed more light on the stability mechanism of the MOV. Two electron traps, Ec-0.26[eV] and Ec-(O.2-0.3)[eV], were observed in the unannealed samples in large quantities(7-9 X 1014[CM 3]), whereas the three electron traps Ec-0.17 [eV], Ec-0.26[eV] and Ec-(O.2-0.3)[eV] were observed far less in the annealed samples. The minima in the Ec-0.26[eV] trap density, coupled with the presented results that unannealed devices are unstable whereas 600.deg. C annealed devices are most stable, suggests that the instability of the MOV under long term electrical stressing is related to the Ec-0.26[eV] trap. This results support that the ion migration model for the device instability where the Ec-0.26[eV] defects may be the interstitial zinc or the migrating ions. The interstitial zinc originated as a result of the nonstoichiometric nature of ZnO might cause the degradation of the I-V characteristics of the MOV with long term electrical stressing.

• 한국전자통신학회논문지
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• 제9권3호
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• pp.273-278
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• 2014

다결정 및 단결정 Cu 시편에 CVD를 이용하여 그래핀을 합성 하였으며, 광학현미경 조직사진을 이미지 조절 및 분석 가능한 소프트웨어를 활용하여 광학현미경 조직사진 상에서는 구분이 어려운 그래핀 합성에 따른 미세한 특성들을 이미지 분석을 통하여 구현하였다. 그래핀이 Cu 시편의 결정입계에서 핵 생성하여 Cu 입내로 성장하는 거동을 보이고, 그래핀 성장 시 그래핀 입계의 이동이 Cu 입계 및 기공과 상호작용하는 현상들에 대하여 설명하고, 결과적으로 야기되는 문제들의 원인과 결과를 논하였다.

• 한국정밀공학회지
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• 제31권1호
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• pp.9-13
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• 2014

The molding process can be divided into five separate steps: plastification, injection, holding, cooling, and finally ejection. In the plastic injection molding, the effect factor such as mold temperature, injection speed, packing pressure and inhomogeneous cooling under packing process affects both the article dimension and physical characteristics. Especially, the packing pressure is the most critical factor to affect molded articles quality among the packing parameters. In this paper, the CAE simulation considering the molding condition is performed to predict the faulty cause which appears in the packing process between cavities of injection molding machine. From the results of CAE simulation, the packing phenomena according to the product form and the gate position was investigated to improve the article quality and minimize the various molding defects. The effect of packing pressure and gate number on the injection molding was discussed.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 하계학술대회 논문집 Vol.4 No.1
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• pp.335-338
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• 2003

Chemical mechanical polishing (CMP) process has been widely used to planarize dielectric layers, which can be applied to the integrated circuits for sub-micron technology. Despite the increased use of CMP process, it is difficult to accomplish the global planarization of in the defect-free inter-layer dielectrics (ILD). Especially, defects such as micro-scratch lead to severe circuit failure which affect yield. CMP slurries can contain particles exceeding $1\;{\mu}m$ in size, which could cause micro-scratch on the wafer surface. In this paper, we have studied aging effect the of CMP sin as a function of particle size. We prepared and compared the self-developed silica slurry by adding of abrasives before and after annealing. As our preliminary experiment results, we could be obtained the relatively stable slurry characteristics comparable to original silica slurry in the slurry aging effect.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 하계학술대회 논문집 Vol.9
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• pp.119-120
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• 2008

ILD CMP process has been well accepted for the planarization of the dielectric oxide film and becomes a critical process in ULSI manufacturing due to the rapid shrinkage of the design rule for the device. In total manufacturing process steps for a device, the proportion of ILD CMP process has been gradually increased. Ever since ILD CMP has been introduced, the scratches have been a major defects on polished surfaces which cause the electrical shorts between vias or metal lines [1,2]. It was reported that micro-scratches are caused by large, irregularly shaped particles during CMP process. Therefore, most of the CMP users have used < 5 m POU filter to remove and reduce the scratch source from the slurry. However, the scratch has always been the biggest concern in ILD polishing whatever preventive actions are taken. Silica and ceria slurries are widely used for ILD CMP process. There are not much differences in generated scratches and their formation mechanism. In this study, the scratches were investigated as a function of polishing conditions with possible explanation on formation mechanism in ILD CMP.

• 한국레이저가공학회지
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• 제14권4호
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• pp.14-20
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• 2011

The advantage of using lasers for through silicon via (TSV) drilling is that they allow higher flexibility during manufacturing because vacuums, lithography, and masks are not required; furthermore, the lasers can be applied to metal and dielectric layers other than silicon. However, conventional nanosecond lasers have disadvantages including that they can cause heat affection around the target area. In contrast, the use of a picosecond laser enables the precise generation of TSVs with a smaller heat affected zone. In this study, a comparison of the thermal and crystallographic defect around laser-drilled holes when using a picosecond laser beam with varing a fluence and repetition rate was conducted. Notably, the higher fluence and repetition rate picosecond laser process increased the experimentally recast layer, surface debris, and dislocation around the hole better than the high fluence and repetition rate. These findings suggest that even the picosecond laser has a heat accumulation effect under high fluence and short pulse interval conditions. To eliminate these defects under the high speed process, the CDE (chemical downstream etching) process was employed and it can prove the possibility to applicate to the TSV industry.