• Title/Summary/Keyword: capacitance density

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Comparison of retention characteristics of ferroelectric capacitors with $Pb(Zr, Ti)O_3$ films deposited by various methods for high-density non-volatile memory.

  • Sangmin Shin;Mirko Hofmann;Lee, Yong-Kyun;Koo, June-Mo;Cho, Choong-Rae;Lee, June-Key;Park, Youngsoo;Lee, Kyu-Mann;Song, Yoon-Jong
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.3 no.3
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    • pp.132-138
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    • 2003
  • We investigated the polarization retention characteristics of ferroelectric capacitors with $Pb(Zr,Ti)O_3$ (PZT) thin films which were fabricated by different deposition methods. In thermally-accelerated retention tests, PZT films which were prepared by a chemical solution deposition (CSD) method showed rapid decay of retained polarization charges as the thickness of the films decreased down to 100 nm, while the films which were grown by metal organic chemical vapor deposition (MOCVD) retained relatively large non-volatile charges at the corresponding thickness. We concluded that in the CSD-grown films, the thicker interfacial passive layer compared with the MOCVD-grown films had an unfavorable effect on retention behavior. We observed the existence of such interfacial layers by extrapolation of the total capacitance with thickness of the films and the capacitance of these layers was larger in MOCVD-grown films than in CSD-grown films. Due to incomplete compensation of surface polarization charges by the free charges in the metal electrodes, the interfacial field activated the space charges inside the interfacial layers and deposited them at the boundary between the ferroelectric layer and the interfacial layer. Such space charges built up an internal field inside the films, which interfered with domain wall motion, so that retention property at last became degraded. We observed less imprint which was a result of less internal field in MOCVD-grown films while large imprint was observed in CSD-grown films.

Synthesis and Electrochemical Characteristics of Spherical Li4Ti5O12/CNT Composite Materials for Hybrid Capacitors

  • Yang, Joeng-Jin;Kim, Yu-Ri;Jeong, Moon-Gook;Yuk, Yong-Jae;Kim, Han-Joo;Park, Soo-Gil
    • Journal of Electrochemical Science and Technology
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    • v.6 no.2
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    • pp.59-64
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    • 2015
  • Spherical Li4Ti5O12 and Li4Ti5O12 carbon nanotube (CNT) composites were synthesized using a colloid system. The electrochemical properties of the composites were thoroughly examined to determine their applicability as hybrid capacitor anodes. The electrical conductivity of the spherical Li4Ti5O12-CNT composite was improved over that of the spherical Li4Ti5O12 composite. The synthesized composites were utilized as the anode of a hybrid capacitor, which was assembled with an activated carbon (AC) positive electrode. The CNTs attached on the spherical Li4Ti5O12 particles contributed to a 51% reduction of the equivalent series of resistance of the Li4Ti5O12-CNTs/AC hybrid capacitor compared to the Li4Ti5O12/AC hybrid capacitor. Moreover, the Li4Ti5O12-CNTs/AC hybrid capacitor showed a larger capacitance than the Li4Ti5O12/AC hybrid capacitor; specifically, the Li4Ti5O12-CNT/AC hybrid capacitor showed 1.6 times greater capacitance at 40 cycles with a 10 mA cm−2 loading current density.

Advanced Low-k Materials for Cu/Low-k Chips

  • Choi, Chi-Kyu
    • Proceedings of the Korean Vacuum Society Conference
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    • 2012.02a
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    • pp.71-71
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    • 2012
  • As the critical dimensions of integrated circuits are scaled down, the line width and spacing between the metal interconnects are made smaller. The dielectric film used as insulation between the metal lines contributes to the resistance-capacitance (RC) time constant that governs the device speed. If the RC time delay, cross talk and lowering the power dissipation are to be reduced, the intermetal dielectric (IMD) films should have a low dielectric constant. The introduction of Cu and low-k dielectrics has incrementally improved the situation as compared to the conventional $Al/SiO_2$ technology by reducing both the resistivity and the capacitance between interconnects. Some of the potential candidate materials to be used as an ILD are organic and inorganic precursors such as hydrogensilsequioxane (HSQ), silsesquioxane (SSQ), methylsilsisequioxane (MSQ) and carbon doped silicon oxide (SiOCH), It has been shown that organic functional groups can dramatically decrease dielectric constant by increasing the free volume of films. Recently, various inorganic precursors have been used to prepare the SiOCH films. The k value of the material depends on the number of $CH_3$ groups built into the structure since they lower both polarity and density of the material by steric hindrance, which the replacement of Si-O bonds with Si-$CH_3$ (methyl group) bonds causes bulk porosity due to the formation of nano-sized voids within the silicon oxide matrix. In this talk, we will be introduce some properties of SiOC(-H) thin films deposited with the dimethyldimethoxysilane (DMDMS: $C_4H_{12}O_2Si$) and oxygen as precursors by using plasma-enhanced chemical vapor deposition with and without ultraviolet (UV) irradiation.

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Effect of Microstructure on Electrical Properties of Thin Film Alumina Capacitor with Metal Electrode (금속 전극 알루미나 박막 캐패시터의 전기적 특성에 미치는 미세구조의 영향)

  • Jeong, Myung-Sun;Ju, Byeong-Kwon;Oh, Young-Jei;Lee, Jeon-Kook
    • Korean Journal of Materials Research
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    • v.21 no.6
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    • pp.309-313
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    • 2011
  • The power capacitors used as vehicle inverters must have a small size, high capacitance, high voltage, fast response and wide operating temperature. Our thin film capacitor was fabricated by alumina layers as a dielectric material and a metal electrode instead of a liquid electrolyte in an aluminum electrolytic capacitor. We analyzed the micro structures and the electrical properties of the thin film capacitors fabricated by nano-channel alumina and metal electrodes. The metal electrode was filled into the alumina nano-channel by electroless nickel plating with polyethylene glycol and a palladium catalyst. The spherical metals were formed inside the alumina nano pores. The breakdown voltage and leakage current increased by the chemical reaction of the alumina layer and $PdCl_2$ solution. The thickness of the electroless plated nickel layer was 300 nm. We observed the nano pores in the interface between the alumina layer and the metal electrode. The alumina capacitors with nickel electrodes had a capacitance density of 100 $nF/cm^2$, dielectric loss of 0.01, breakdown voltage of 0.7MV/cm and leakage current of $10^4{\mu}A$.

Modified Modular Multilevel Converter with Submodule Voltage Fluctuation Suppression

  • Huang, Xin;Zhang, Kai;Kan, Jingbo;Xiong, Jian
    • Journal of Power Electronics
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    • v.17 no.4
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    • pp.942-952
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    • 2017
  • Modular multilevel converters (MMCs) have been receiving extensive research interest in high/medium-voltage applications due to its modularity, scalability, reliability, high-voltage capability, and excellent harmonic performance. Submodule capacitors are usually rather bulky because they have to withstand fundamental frequency voltage fluctuations. To reduce the capacitance of these capacitors, this study proposes a modified MMC with an active power decoupling circuit within each submodule. The modified submodule contains an auxiliary half bridge, with its capacitor split in two. Also, the midpoints of the half bridge and the split capacitors are connected by an inductor. With this modified submodule, the fundamental frequency voltage fluctuation can be suppressed to a great extent. The second-order voltage fluctuation, which is the second most significant component in submodule voltage fluctuations, is removed by the proper control of the second-order circulating current. Consequently, the submodule capacitance is significantly reduced. The viability and effectiveness of the proposed new MMC are confirmed by the simulation and experimental results. The proposed MMC is best suited for medium-voltage applications where power density is given a high priority.

Microstructures and Electrical Properties of Zr Modified $({Ba_{1-x}},{Sr_x})TiO_3$ Thin Films (Zr이 첨가된 $({Ba_{1-x}},{Sr_x})TiO_3$ 박막의 미세구조와 전기적 성질)

  • Park, Sang-Sik
    • Korean Journal of Materials Research
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    • v.10 no.9
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    • pp.607-611
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    • 2000
  • Zr modified $(Ba_{1-x},Sr_x)TiO_3$ thin films as capacitor for high density DRAM were deposited by r.f. magnetron sputtering. The films deposited at various chamber pressure exhibited a polycrystalline structure. The Zr/Ti ratio of the films increased significantly with decreasing the chamber pressure and this variation affected the microstructure and surface roughness of films When chamber pressure increased dielectric constant of the films effected due to decrease of Zr. The thin films prepared in this study show dielectric constant of 380 to 525 at 100KHz. The variation of capacitance and polarization measured as a function of bias voltage suggested that all films were paraelectric phases. Leakage current exhibited smaller value as chamber pressure decrease and the leakage current density of the films deposited above 10mTorr was $10^{-7}~10^{-8}A/cm^2$ order at 200kV/cm. $(Ba_{1-x},Sr_x)(Ti_{1-y},Zr_y)O_3$ thin films in this study appeared to be potential thin film capacitor for high density DRAM.

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Rapid and Accurate Measurement of Diffusion Length of Minority Carriers of CIGS Solar Cells (CIGS 태양전지의 소수캐리어 확산 거리에 대한 새로운 측정 방안 연구)

  • Lee, Don Hwan;Kim, Young Su;Mo, Chan Bin;Nam, Jung Gyu;Lee, Dong Ho;Park, Sung Chan;Kim, Byoung June;Kim, Dong Seop
    • Current Photovoltaic Research
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    • v.2 no.2
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    • pp.59-62
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    • 2014
  • Minority carrier diffusion length is one of the most important parameters of solar cells, especially for short circuit current density (Jsc). In this report, we proposed the calculating method of the minority carrier diffusion length ($L_n$) in CIGS solar cells through biased quantum efficiency (QE). To verify this method's reliability, we chose two CIGS samples which have different grain size and calculated $L_n$ for each sample. First of all, we calculated out that $L_n$ was 56nm and 97nm for small and large grain sized-cell through this method, respectively. Second, we found out the large grain sized-cell has about 7 times lower defect density than the small grain sized-cell using drive level capacitance profiling (DLCP) method. Consequently, we confirmed that $L_n$ was mainly affected by the micro-structure and defect density of CIGS layer, and could explain the cause of Jsc difference between two samples having same band gap.

Properties of TiO2 Thin Films Deposited on PET Substrate for High Energy Density Capacitor (고에너지밀도 캐패시터를 위해 PET 기판에 증착한 TiO2 박막의 특성)

  • Park, Sang-Shik
    • Korean Journal of Materials Research
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    • v.22 no.8
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    • pp.409-415
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    • 2012
  • $TiO_2$ thin films for high energy density capacitors were prepared by r.f. magnetron sputtering at room temperature. Flexible PET (Polyethylene terephtalate) substrate was used to maintain the structure of the commercial film capacitors. The effects of deposition pressure on the crystallization and electrical properties of $TiO_2$ films were investigated. The crystal structure of $TiO_2$ films deposited on PET substrate at room temperature was unrelated to deposition pressure and showed an amorphous structure unlike that of films on Si substrate. The grain size and surface roughness of films decreased with increasing deposition pressure due to the difference of mean free path. X-ray photoelectron spectroscopy (XPS) analysis revealed the formation of chemically stable $TiO_2$ films. The dielectric constant of $TiO_2$ films was significantly changed with deposition pressure. $TiO_2$ films deposited at low pressure showed high dissipation factor due to the surface microstructure. The dielectric constant and dissipation factor of films deposited at 70 mTorr were found to be 100~120 and 0.83 at 1 kHz, respectively. The temperature dependence of the capacitance of $TiO_2$ films showed the properties of class I ceramic capacitors. $TiO_2$ films deposited at 10~30 mTorr showed dielectric breakdown at applied voltage of 7 V. However, the films of 500~300 nm thickness deposited at 50 and 70 mTorr showed a leakage current of ${\sim}10^{-8}{\sim}10^{-9}$ A at 100 V.

Electrical properties and ATP-sensitive K+ channel density of the rat substantia nigra pars compacta neurons (랫드 흑질 신경세포의 전기적 특성과 ATP-sensitive K+채널의 전류밀도)

  • Han, Seong-kyu;Park, Jin-bong;Ryu, Pan-dong
    • Korean Journal of Veterinary Research
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    • v.40 no.2
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    • pp.275-282
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    • 2000
  • Substantia nigra is known to highly express glibenclamide binding site, a protein associated to ATP-sensitive $K^{+}$ ($K_{ATP}$) channel in the brain. However, the functional expression of $K_{ATP}$ channels in the area is not yet known. In this work, we attempted to estimate the functional expression of $K_{ATP}$ channels in neurons of the substantia nigra pars compacta (SNC) in young rats using slice patch clamp technique. Membrane properties and whole cell currents attributable to $K_{ATP}$ channel were examined by the current and voltage clamp method, respectively. In SNC, two sub-populations of neurons were identified. Type I (rhythmic) neurons had low frequency rebound action potentials ($4.5{\pm}0.25Hz$, n=75) with rhythmic pattern. Type II (phasic) neurons were characterized by faster firing ($22.7{\pm}3.16Hz$, n=12). Both time constants and membrane capacitance in rhythmic neurons ($34.0{\pm}1.27$ ms, $270.0{\pm}11.83$ pF) and phasic neurons ($23.7{\pm}4.16$ ms, $184{\pm}35.2$ pF) were also significantly different. The current density of $K_{ATP}$ channels was $6.1{\pm}1.47$ pA/pF (2.44~15.43 pA/pF, n=8) at rhythmic neurons of young rats. Our data show that in SNC there are two types of neurons with different electrical properties and the density of $K_{ATP}$, channel of rhythmic neuron is about 600 channels per neuron.

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Sintering and Electrical Properties of Mn-doped ZnO-TeO2 Ceramics (Mn을 첨가한 ZnO-TeO2 세라믹스의 소결과 전기적 특성)

  • Hong, Youn-Woo;Shin, Hyo-Soon;Yeo, Dong-Hun;Kim, Jong-Hee;Kim, Jin-Ho
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.22 no.1
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    • pp.22-28
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    • 2009
  • We investigated the sintering and electric properties of ZnO-1.0 at% $TeO_2$ (ZT1) and 1.0 at% Mn-doped ZT1(ZT1M1) system. $TeO_2$ itself melts at $732^{\circ}C$ in air but forms the $ZnTeO_3$ or $Zn_2Te_3O_8$ phase with ZnO as increasing temperature and therefore retards the densification of ZnO to $1000^{\circ}C$. In ZT1M1 system, also, the densification of ZnO was retarded up to $1000^{\circ}C$ and then reached > 90% of theoretical density above $1100^{\circ}C$. It was found that a good varistor characteristics(nonlinear coefficient $a{\sim}60$) were developed in ZT1M1 system sintered at $1100^{\circ}C$ due to Mn which known as improving the nonlinearity of ZnO varistors. The results of C-V characteristics such as barrier height (${\Phi}_b$), donor density ($N_D$), depletion layer (W), and interface state density ($N_t$) in ZT1M1 ceramics were $1.8{\times}10^{17}cm^{-3}$, 1.6 V, 93 nm, and $1.7{\times}10^{12}cm^{-2}$, respectively. Also we measured the resistance and capacitance of grain boundaries with temperature using impedance and electric modulus spectroscopy. It will be discussed about the stability and homogeneity of grain boundaries using distribution parameter ($\alpha$) simulated with the Z(T)"-logf plots.