• 제목/요약/키워드: camera module

검색결과 500건 처리시간 0.03초

Camera Imaging Lens Fabrication using Wafer-Scale UV Embossing Process

  • Jeong, Ho-Seop;Kim, Sung-Hwa;Shin, Dong-Ik;Lee, Seok-Cheon;Jin, Young-Su;Noh, Jung-Eun;Oh, Hye-Ran;Lee, Ki-Un;Song, Seok-Ho;Park, Woo-Je
    • Journal of the Optical Society of Korea
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    • 제10권3호
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    • pp.124-129
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    • 2006
  • We have developed a compact and cost-effective camera module on the basis of wafer-scale-replica processing. A multiple-layered structure of several aspheric lenses in a mobile-phone camera module is first assembled by bonding multiple glass-wafers on which 2-dimensional replica arrays of identical aspheric lenses are UV-embossed, followed by dicing the stacked wafers and packaging them with image sensor chips. This wafer-scale processing leads to at least 95% yield in mass-production, and potentially to a very slim phone with camera-module less than 2 mm in thickness. We have demonstrated a VGA camera module fabricated by the wafer-scale-replica processing with various UV-curable polymers having refractive indices between 1.4 and 1.6, and with three different glass-wafers of which both surfaces are embossed as aspheric lenses having $230{\mu}m$ sag-height and aspheric-coefficients of lens polynomials up to tenth-order. We have found that precise compensation in material shrinkage of the polymer materials is one of the most technical challenges, in orderto achieve a higher resolution in wafer-scaled lenses for mobile-phone camera modules.

Flip Chip Interconnection Method Applied to Small Camera Module

  • Segawa, Masao;Ono, Michiko;Karasawa, Jun;Hirohata, Kenji;Aoki, Makoto;Ohashi, Akihiro;Sasaki, Tomoaki;Kishimoto, Yasukazu
    • 한국마이크로전자및패키징학회:학술대회논문집
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    • 한국마이크로전자및패키징학회 2000년도 2nd Korea-Japan Advanceed Semiconductor Packaging Technology Seminar
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    • pp.39-45
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    • 2000
  • A small camera module fabricated by including bare chip bonding methods is utilized to realize advanced mobile devices. One of the driving forces is the TOG (Tape On Glass) bonding method which reduces the packaging size of the image sensor clip. The TOG module is a new thinner and smaller image sensor module, using flip chip interconnection method with the ACP (Anisotropic Conductive Paste). The TOG production process was established by determining the optimum bonding conditions for both optical glass bonding and image sensor clip bonding lo the flexible PCB. The bonding conditions, including sufficient bonding margins, were studied. Another bonding method is the flip chip bonding method for DSP (Digital Signal Processor) chip. A new AC\ulcorner was developed to enable the short resin curing time of 10 sec. The bonding mechanism of the resin curing method was evaluated using FEM analysis. By using these flip chip bonding techniques, small camera module was realized.

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Auto-Focusing 미세부품 Yoke 조립 자동화 모듈 개발 (Development of automatic assembly module for yoke parts in auto-focusing actuator)

  • 하석재;박정연;박규섭;윤길상
    • Design & Manufacturing
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    • 제13권1호
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    • pp.55-60
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    • 2019
  • Smart-phone in the recently released high-end applied to the camera module is equipped with the most features auto focusing camera module. Also, auto focusing camera module is divided into voice coil motor, encoder, and piezo according to type of motion mechanism. Auto focusing camera module is composed of voice coil motor (VCM) as an actuator and leaf spring as a guide and suspension. VCM actuator is made of magnet, yoke as a metal, and coil as a copper wire. Recently, the assembly as yoke and magnet is made by human resources. These process has a long process time and it is difficult to secure quality. Also, These process is not economical in cost, and productivity is reduced. Therefore, an automatic assembly as yoke and magnet is needed in the present process. In this paper, we have developed an automatic assembly device that can automatically assemble yoke and magnet, and performed verifying performance. Therefore, by using the developed automatic assembly device, it is possible to increase the productivity and reduce the production cost.

폰 카메라 렌즈모듈의 Cluster Type 조립시스템 설계 (Design of Cluster Type Assembly System for Lens Module of Phone Camera)

  • 송준엽;이창우;정연욱;김영규
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2005년도 춘계학술대회 논문집
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    • pp.974-977
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    • 2005
  • Automatic lens assembly system is used for automatically assembling the lens module of phone camera. In this paper, we are trying to develop the cluster type automatic lens assembly with standard tray for applying for assembly field directly. This paper proposes the principle of cluster type lens assembly system and the related assembly production line concept for optimal automatic lens production line.

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카메라 모듈 부품 및 금형 코어 측정 시스템 개발 (Development of the inspection system for injection molding core and mobile camera module parts)

  • 신봉철;김건희;김재철;조명우
    • 한국산학기술학회논문지
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    • 제10권1호
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    • pp.12-18
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    • 2009
  • 본 논문에서는 고품질 고기능성이 요구되는 카메라폰용 카메라 모들의 주요 부품인 초소형 플라스틱 barrel, base의 조립 토크 편차 저감을 위하여 금형 코어, 전극 및 사출성형품의 나사 형상의 주요 기하를 정밀하게 측정할 수 있는 시스템을 개발하였다. 해당 공정을 실현하기 위하여 품질 평가의 주요 측정 파라메터를 선정하고 측정 방법을 개발하였으며, 최종적으로 현장 적용이 가능한 전용 측정 시스템을 개발하였다.

Bluetooth Module을 이용한 실시간 영상감시 시스템 (Using Bluetooth Module for Real-time Image Surveillance System)

  • 서윤석;곽재혁;임준홍
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2005년도 학술대회 논문집 정보 및 제어부문
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    • pp.337-339
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    • 2005
  • The demand for a real-time image surveillance system using network camera server is increasing as the network infra has been grown and digital video compression techniques have been developed. The image surveillance system using network camera server has several merits compared to existing real-time image surveillance system using CCTV. It would be more convenient if wireless realtime image transmission were possible. In this paper, a bluetooth module is designed and implemented for a real-time image surveillance system to send and receive informations wirelessly. It may simplify the system development procedures and increase the productivity by low power consumption, low cost, and simple wireless installation. A scatter-net formation is proposed using dynamic and distributed algorithm so that the network connection is reliable.

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Development of Analysis Module for Marine Traffic Information Using PC Camera

  • Moon Serng-Bae;Lee Geun-Sil;Jun Seung-Hwan
    • 한국항해항만학회지
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    • 제29권4호
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    • pp.313-318
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    • 2005
  • Usually marine traffic survey has been conducted by some methods like an ocular observation using portable RADAR, a questionnaire, etc. But these should have expended a lot of manpower and expenses. In this paper, we have developed new observation module which could capture the RADAR image using PC camera simply, and allowed as to track targets on the PC monitor directly. And it has been programmed to make a database of RADAR image, target's track and information, and analyze the marine traffic tendency in various ways like vessel number crossed over gate line, vessel's velocity distribution in gate line, traffic density distribution, etc. We have confirmed that this module could observe and analyze the marine traffic efficiently and economically through several on-the-spot experiments.

모듈 단위 열화조건을 고려한 자동차용 칵핏 모듈 이음(BSR Noise)에 대한 시험적 고찰 (Experimental Study of being vehicle cockpit module BSR Noise considering the deterioration condition of the module unit)

  • 이철현;양정민;조진호;이원구;우창수
    • 한국소음진동공학회:학술대회논문집
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    • 한국소음진동공학회 2014년도 추계학술대회 논문집
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    • pp.791-795
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    • 2014
  • In this paper, in order to impart the aging condition of the parts, by configuring the cycle of temperature from low temperature was performed by applying the aging conditions for vehicle cockpit module. The reason for the selected modules of the cockpit vehicle parts, because the joint occurrence typical components of the room component is a first module and ceiling cockpit module. After setting the excitation profile using the BSR exciter only that this is for the module degradation after the initial and grasp the change in the dynamic characteristics of the modules based on the before and after deterioration may be made in the module, grasp the noise generating position I measured the noise and proximity. Was also visualized on the position of the joint is generated using a sound camera to objective results occurring where the joint is selected through subjective evaluation.

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Design of a Reorganization and Non-Uniformity Correction Module for CCD Pixels in MSC(Multispectral Camera)

  • Kong, Jon-Pil;Yong, Sang-Soon;Heo, Haeng-Pal;Kim, Young-Sun;Paik, Hong-Yul
    • 제어로봇시스템학회:학술대회논문집
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    • 제어로봇시스템학회 2001년도 ICCAS
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    • pp.177.1-177
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    • 2001
  • This paper describes the design of a NUC(Non-uniformity Correction) module in MSC(Multispectral Camera) which will be a payload on KOMPSAT. This module is required inside a system with data compression module like MSC to minimize the loss of imagery due to non-uniform characteristics between CCD pixels when the imagery is received and processed on a ground station. It comprises Hotlink input/output for imagery data, RS-422 interface with main controller in MSC, a number of SRAMS for storing imagery data and parameters, FPGA controllers which control the entire NUC module under the control of main controller, etc. It inputs 8-channel imagery pixel data which consist of 2-channel MS(Multispectral) band and ...

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강교량 재도장 로봇의 모니터링 모듈 시제품 개발 (Development of a Prototype Monitoring Module for Steel Bridge Repainting Robots)

  • 서명국;이호연;박일환;장병하
    • 드라이브 ㆍ 컨트롤
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    • 제17권4호
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    • pp.15-22
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    • 2020
  • With the need for efficient maintenance technology to reduce maintenance costs for steel bridges, repainting robots are being developed to automate the work in narrow and poor bridge spaces. The repainting robot is equipped with a blasting module to remove paint layers and contaminants. This study developed a prototype monitoring module to be mounted on the repainting robot. The monitoring module analyzes the condition of the painting surface through a camera installed in the front, guides the direction of movement of the robot, and provides the operator with a video to check the working status after blasting through a camera installed in the back. Various image visibility enhancement technologies were applied to the monitoring module to overcome worksite challenges where incomplete lighting and dust occurs.