• Title/Summary/Keyword: calibration circuit

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Implementation of 1.5Gbps Serial ATA (1.5Gbps 직렬 에이티에이 전송 칩 구현)

  • 박상봉;허정화;신영호;홍성혁;박노경
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.41 no.7
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    • pp.63-70
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    • 2004
  • This paper describes the link layer and physical layer of the Serial ATA which is the next generation for parallel ATA specification that defines data transfer between PC and peripheral storage devices. The link layer consists of CRC generation/error detection, 8b/10b decoding/encoding, primitive generation/detection block. For the physical layer, it includes CDR(Cock Data Recovery), transmission PLL, serializer/de-serializer. It also includes generation and receipt of OOB(Out-Of-Band) signal, impedance calibration, squelch circuit and comma detection/generation. Additionally, this chip includes TCB(Test Control Block) and BIST(Built-In Selt Test) block to ease debugging and verification. It is fabricated with 0.18${\mu}{\textrm}{m}$ standard CMOS cell library. All the function of the link layer operate properly. For the physical layer, all the blocks operate properly but the data transfer is limited to the 1.28Gbps. This is doe to the affection or parasitic elements and is verified with SPICE simulation.

Development of Contact-Type Thickness Measurement Machine using LVDT Sensors (LVDT센서를 이용한 접촉식 두께자동측정기 개발)

  • Shin, Ki-Yeol;Hwang, Seon
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.14 no.4
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    • pp.151-159
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    • 2015
  • In this study, we developed an automated contact-type thickness measurement machine that continuously and precisely measures the thickness of a PCB module product using multi-LVDT sensors. The system contains a measurement part to automatically measure the thickness in real time according to the set conditions with an alignment supply unit and unloading unit to separate OK and NG products. The sensors were calibrated before assembly in the measuring machine, and precision and accuracy performance tests were also performed to reduce uncertainty errors in the measurement machine. In the calibration test, the precision errors of the LVDT sensor were determined to be $1-3{\mu}m$ as 0.1% at the measuring range. A measurement error of 0.8 mm and 1.0 mm thickness test standards were found to be $1{\mu}m$ and $4{\mu}m$, and the standard deviations of two 1.0 mm products were measured as $14{\mu}m$ and $8{\mu}m$, respectively. In the measurement system analysis, the accuracies of test PCB standards were found to be $2{\mu}m$ and $3{\mu}m$, respectively. From the results of gage repeatability and reproducibility (R & R) crossed, we found that the machine is suitable for the measurement and process control in the mass production line as 7.92% of total gage R & R and in seven distinct categories. The maximum operating speed was limited at 13 pcs/min, showing a value good enough to measure.

Measurement of Dynamic Strains on Composite T-Joint Subjected to Hydrodynamic Ram Using PVDF Sensors (PVDF 센서를 이용한 수압램 하중을 받는 복합재 T-Joint의 동적 변형률 측정)

  • Go, Eun-Su;Kim, Dong-Geon;Kim, In-Gul;Woo, Kyeongsik;Kim, Jong-Heon
    • Composites Research
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    • v.31 no.5
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    • pp.238-245
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    • 2018
  • The hydrodynamic ram (HRAM) phenomenon is one of the main types of ballistic battle damages of a military aircraft and has great importance to airframe survivability design. The HRAM effect occurs due to the interaction between the fluid and structure, and damage can be investigated by measuring the pressure of the fluid and the dynamic strains on the structure. In this paper, HRAM test of a composite T-Joint was performed using a ram simulator which can generate HRAM pressure. In addition, calibration tests of PVDF sensor were performed to determine the circuit capacitance and time constant of the measurement system. The failure behavior of the composite T-Joint due to HRAM pressure was examined using the strain gauges and a PVDF sensor which were attached to the surface of the composite T-Joint.

Measurement and Analysis of Electric Filed Distributions under 154[kV] Overhead Tranamission Lines (154[KV] 가공송전선로 아래에서 전장분포의 측정과 분석)

  • 이복희;이정기;안창환;이경옥;박동화;곽희로;송진호
    • The Proceedings of the Korean Institute of Illuminating and Electrical Installation Engineers
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    • v.11 no.1
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    • pp.92-98
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    • 1997
  • In this paper, the results of the measurement and analysis of extremely low freqency(ELF) eletric field in the vicinity of 154[kV] overhad transmission lines have been described. The planar-type electric field sensor has been fabricated by three dimensional structure with special consideration of taking the power frequency and lower components. The calibration experiments have been carried out according to the procedures of IEEE recommendation. The electric field measuring system has the frequency bandwidth of 7[Hz] to 2.7[MHz] and the response sensitivity of 0.094[mV/V/m]. Also the practical measurements of electric field under an 154[kV] double corcuit overhead transmission lines have been made abd abalyzed. It was known that the lateral electric field profiles under an 154[kV] double circuit overhead transmission lines show the asymmetrical distributions owing to the environmental metal frame structures and their maximum electric field magnitude is less than 3[kV/m]. It can be concluded that the measured results of the electric fields satisfy with all limits or guide -lines of the various authorized international institutes' recommendations.

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A Study on the Development of Digital Output Load Cell (계량설비용 디지탈 출력 로드셀의 개발에 관한 연구)

  • Park, Chan-Won;An, Kwang-Hee
    • The Proceedings of the Korean Institute of Illuminating and Electrical Installation Engineers
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    • v.11 no.1
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    • pp.114-122
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    • 1997
  • This paper describes the design and development of a smart digital load cell used forweighing installations. Sice the load cell sensor to be used is very sensitive for weight cariation, the load cell must have the temperature stability, low-drift and the high-resolution of the A/D conversion for accuracy. A new analog circuit which is controlled by one chip micro-processer has been developed to reduce the offset voltage and the drift characteristics of operational amplifiers, and has been adapted into the digital load cell. Also, a software algorithm has been developed to obtain the stable and accurate A/D conversion. This software includes a RS-485 communication program to control the digital load cell, which gives a capability of backing-up the calibration data and transferring control data. The simulation and evaluation of the designed digital load cell has been shown as having the good performance. which will give useful application to the weighing installations as a remote weighing sensor.

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ECG simulator design with Spartan-3 FPGA (Spartan-3 FPGA를 이용한 ECG 시뮬레이터 설계)

  • Woo, Sung-hee;Lee, Won-pyo;Ryu, Geun-teak
    • Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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    • 2015.10a
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    • pp.834-837
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    • 2015
  • In this paper, we designed the FPGA hardware-based real-time ECG simulator, which generates an analog ECG signal within the range of 0 to 5 volts and described function. The ECG signal generated by the simulator can be applied to laboratory tests, the medical device, and the calibration study in various ways. ECG signals generated by simulator are obtained with conventional 24bit quantization to generate the signal data, and they are sampled and quantized to 1kHz of the 8-bit resolution when used as actual data. The proposed simulator is implemented using xilix Spartan-3 and data are transmitted through an RS-232 between the PC and the FPGA simulator. The transmitted data are stored in the memory and the stored data are printed out with the analog ECG signal through DAC (0808). It can also control the heart rate (HR) via the two buttons level UP-DOWN. We used existing ECG input rating for the evaluation of the designed system and evaluated differential circuit for obtaining QRS waveform and the output signal. We finally could obtained proper the result.

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A Study on the Improvement of Voltage Measuring Method of 22.9 kV-y Distribution Lines (22.9 kV-y 배전선로의 전압계측방법 개선에 관한 연구)

  • Kil, Gyung-Suk;Song, Jae-Yong
    • Journal of Sensor Science and Technology
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    • v.7 no.4
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    • pp.293-299
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    • 1998
  • An objective of this study is to develop a voltage measuring device that uses a gas-filled switch (GS) on 22.9 kV-y extra-high voltage distribution lines. The voltage measuring device proposed in this paper is a kind of capacitive divider which consists of a detecting electrode attached outside of the bushing of GS, an impedance matching circuit, and a voltage buffer. It can be easily installed in an established GS without changing the structure. For the calibration and application investigations, the voltage measuring device was set up in the 25.8 kV 400 A GS, and a step pulse generator having 5 ns rise time is used. As a result, it was found that the frequency bandwidth of the voltage measuring device ranges from 1.35 Hz to about 13 MHz. The error of voltage dividing ratio which is evaluated by the commercial frequency voltage of 60 Hz was less than 0.2%. In addition, voltage dividing ratio in the commercial frequency voltage and in a non-oscillating impulse voltage were compared, and their deviation were less than 0.7%.

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Development of Frequency Weighing Sensor and Single Crystal Growth (새로운 무게센서 재발과 단결정성장(1))

  • Jang Y.N.;Sung N.H.;Chae S.C.;Bae I.K.;Kim I.J.
    • Korean Journal of Crystallography
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    • v.8 no.1
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    • pp.38-47
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    • 1997
  • A new weighing sensor for the automatic diameter control system of the crystal growth is developed in this study. This weighing sensor measures the frequency of the vibrating element which is lineally changing with respect to weight. The signal and the power of this system are transmitted without any physical contact, so that this sensor offers high accuracy and resolution. This system consists of a string, a sinusoidal wave generator, an automatic amplification adjusting circuit, signal transformers and a PCB. 4 kinds of programs are developed for checking DAC, weight calibration and controlling growth process. The measurements of the standard deviation and the resolution show $\pm0.10g$(measured at every second) and $5{\times}10^{-5}$, respectively, This weighing sensor is effective under high pres-sure of 200 atm, high temperature and vacuum condition. The weighing system can control the temperature in the accuracy of $\pm0.025^{\circ}C$ with the 'signal divider'. The optical quality single crystals of $(YGd)_3Sc_2Ga_3O_{12},\;Er-Y_3Sc_2Al_3O_{12},\;and\;Bi_{12}GeO_{20}$ have been grown by Czo-chralski method using this auto-diameter control system.

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A Study on the Compensation of Thermal Errors for Phase Measuring Profilometry (PMP 형상 측정법의 열 변위 보정에 관한 연구)

  • Kim, Gi-Seung;Park, Yoon-Chang
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.20 no.6
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    • pp.598-603
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    • 2019
  • Three-dimensional shape measurement technology is used in various industries. Among them, optical three-dimensional shape measurement techniques based on the optical trigonometry are mainly used in the field of semiconductor product inspection, where large quantities of three-dimensional shape measurements are made daily in factories and fine measurements are also required. The light source and the drive circuit, which are components of three-dimensional measurement equipment based on this optical trigonometry, produce heat generated by prolonged operation, and may be exposed to conditions where the ambient temperature is not constant, resulting in temperature-induced measurement errors. In this study, the compensation method of the Thermal Errors for Phase Measuring Profilometry is proposed. Three-Dimensional Shape Measurement Equipment based on Phase Measuring Profilometry is implemented to measure the height of an object and ambient temperature for 10 Hours, and a regression line was obtained line by making simple linear regression using measured temperature and height values. This regression line was used to correct the error of the height measurement according to the temperature, and thermal error was from 139.88 um(Micrometer) to 13.12 um.