• Proceedings of the KSME Conference
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• 2008.11a
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• pp.234-238
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• 2008

The efficiency of fiber reinforced CMC(ceramic matrix composite) on the SiC materials have been investigated, in conjunction with the fabrication process by liquid phase sintering and the characterization. LPS-$SiC_f$/SiC composites was studied with the detailed analysis such as the microstructure, sintered density, flexural strength and fracture behavior. The applicability of carbon interfacial layer has been also investigated in the LPS process. Submicron SiC powder with the constant total amount and composition ratio of $Al_2O_3,\;Y_2O_3$ as sintering additives was used in order to promote the performance of the SiC matrix material. LPS-$SiC_f$/SiC composites were fabricated with hot press under the sintering temperature and applied pressure of $1820^{\circ}C$ and 20MPa for 1hr. The typical property of monolithic LPS-SiC materials was compared with LPS-$SiC_f$/SiC composites.

• Journal of the Korean Ceramic Society
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• v.29 no.8
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• pp.587-592
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• 1992

Sheets of SiC-SiC whisker maxed matrix were prepared from the mixed slurry of SiC whisker and SiC matrix by the rolling method. With the increase of SiC whisker, the pore size, the porosity and the phosphoric acid absorbency of the matrix were increased, while the bubble pressure was decreased. The activation energy for the transfer of H+ ion was decreased with the increase of mixing ratio of SiC whisker to the SiC matrix from the measurement of hydrogen ion conductivity. The activation energy was evaluated as 0.25 eV when the mixing ratio of SiC whisker to the SiC matrix was 1 : 2 and the activation energy was 0.16 eV for the 2 : 1 matrix. It means that SiC whisker matrix contributes to attain a better microstructure for the diffusion of hydrogen ion. From the measurement of single cell performance of matrix with various mixing ratio, it is concluded that if SiC-SiC whisker maxed matrix has a sufficient bubble pressure to prevent the crossover of H2 gas, the current density of a fuel cell is increased with the increase of acid absorbency of the matrix. Current density was improved from 140 mA/$\textrm{cm}^2$ for 0.25 mm thickness of matrix to 170 mA/$\textrm{cm}^2$ for the 0.20 mm one at 700 mV.

• Journal of Sensor Science and Technology
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• v.16 no.4
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• pp.319-323
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• 2007

This paper describes the mechanical characteristics of poly 3C-SiC thin films grown on Si wafers with thermal oxide. In this work, the poly 3C-SiC thin film was deposited by APCVD method using only Ar carrier gas and single precursor HMDS at $1100^{\circ}C$. The elastic modulus and hardness of poly 3C-SiC thin films were measured using nanoindentation. Also, the roughness of surface was investigated by AFM. The resulting values of elastic modulus E, hardness H and the roughness of the poly 3C-SiC film are 305 GPa, 26 GPa and 49.35 nm respectively. The mechanical properties of the grown poly 3C-SiC film are better than bulk Si wafers. Therefore, the poly 3C-SiC thin film is suitable for abrasion, high frequency and MEMS applications.

• Journal of the Korean Ceramic Society
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• v.38 no.4
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• pp.314-318
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• 2001

SiC-TiC composites have been fabricated by using a mechanochemical processing of a mixture of Si, Ti, and C at room temperature and subsequent hot pressing. TiC powders have been obtained by the mechanochemical processing of a mixture of Ti and C whereas SiC powders has not been obtained from a mixture of Si and C. By using the exothermic reaction between Ti and C, SiC-TiC powder could be obtained from the mixture of Si, Ti, and C using the mechanochemical processing for more than 12h. The X-ray diffraction analysis has shown that the powder subjected to the mechanochemical processing consisted of the particles having crystallite size below 10nm. Fully densified SiC-TiC composites have been obtained by hot-pressing of the powder at 1850$\^{C}$ for 3h and it has shown comparable mechanical properties to those of the SiC-TiC composites prepared from the commercially available SiC and TiC powders. Flexural strength of 560 MPa and fracture toughness of 4.8 MP$.$am$\_$1/2/ have been shown for the SiC-TiC composites with composition corresponding to 0.75:0.25:1 mole ratio of Si:Ti:C.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.6
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• pp.454-459
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• 2003

We investigate the structure and properties of SiC (Silicon Carbide) nanotubes using molecular dynamics simulation based on the Tersoff bond-order potential. For small diameter tubes, the Si-C bond distance of SiC nanotubes decreases as the nanotube diameter is decreased, due to curvature of the nanotube surface. We find that Young's modulus of SiC nanotubes is somewhat smaller than that of the other nanotubes considered so far. However, Young's modulus for SiC nanotubes is larger than that of ${\beta}$-SiC and almost equal to the experimental value for SiC nanorod and SiC whisker. The strain energy of the SiC nanotubes is also lower than that of the other nanotubes. The lower strain energy of SiC nanotubes raises the possibility of synthesis of SiC nanotubes.

• Journal of the Korean Ceramic Society
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• v.45 no.4
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• pp.204-207
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• 2008

This paper presents a new process for producing SiC fiber-SiC matrix(SiC/SiC) composites by reaction sintering. The processing strategy for the fabrication of the SiC/SiC composites involves the following: (1) infiltration of the SiC fiber fabric using a slurry consisting of Si and C precursors, (2) stacking the slurry-infiltrated SiC fiber fabric at room temperature, (3) cross-linking the stacked composites, (4) pyrolysis of the stacked composites, and (5) hot-pressing of the pyrolyzed composites. It was possible to obtain dense SiC/SiC composites with relative densities of >96% and a typical flexural strength of ${\sim}400$ MPa.

• Journal of Sensor Science and Technology
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• v.16 no.4
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• pp.259-262
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• 2007

This paper describes the electrical characteristics of polycrystalline (poly) 3C-SiC thin film diodes, in which poly 3C-SiC thin films on n-type and p-type Si wafers, respectively, were deposited by APCVD using HMDS, $H_{2}$, and Ar gas at $1150^{\circ}C$ for 3 hr. The schottky diode with Au/poly 3C-SiC/Si (n-type) structure was fabricated. Its threshold voltage ($V_{bi}$), breakdown voltage, thickness of depletion layer, and doping concentration ($N_{D}$) value were measured as 0.84 V, over 140 V, 61 nm, and $2.7{\times}10^{19}cm^{-3}$, respectively. Moreover, for the good ohmic contact, Al/poly 3C-SiC/Si (n-type) structure was annealed at 300, 400, and $500^{\circ}C$, respectively for 30 min under the vacuum condition of $5.0{\times}10^{-6}$ Torr. Finally, the p-n junction diodes fabricated on the poly 3C-Si/Si (p-type) were obtained like characteristics of single 3CSiC p-n junction diode. Therefore, poly 3C-SiC thin film diodes will be suitable for microsensors in conjunction with Si fabrication technology.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.8 no.2
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• pp.233-239
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• 1998

SiC thin films were deposited by chemical vapor deposition method using tetramethylsilane (TMS) and hexamethyldisilane (HMDS). The chamber pressure during the deposition was kept at about 1 torr. Precursor was transported to the reaction chamber by $H_2$gas and SiC deposition was carried out at the reaction temperature of $1200^{\circ}C$. Si-wafer masked with tantalum and MgO single crystal covered with platinum and molybdenum were used as substrates. The selectivity of SiC deposition was observed by comparing the microstructure between metal (Ta, Pt, and Mo) surfaces and substrate surfaces (Si and MgO). The deposited films were identified as the $\beta-SiC$ phase by X-ray diffraction pattern. Also, the deposition -behavior of SiC on each surface was investigated by the scanning electron microscope analysis.

• 한국신재생에너지학회:학술대회논문집
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• 2010.06a
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• pp.100.1-100.1
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• 2010

고효율 실리콘 양자점 태양전지를 제작하기 위해 Si과 C target을 co-sputtering 방식으로 제조한 SiC matrix를 열처리하여 박막 내에 Si nanocrystal들을 생성하였다. Si nanocrystal의 특성은 다양한 요인에 영향을 받는 데 barrier 물질인 SiC matrix가 가장 큰 영향을 준다. SiC는 900도 이상에서 열처리하는 동안 Si과 C과 SiC으로 재배열 혹은 재결합하는 데 이 때 가장 작은 carbon이 빠르게 diffusion하는 현상에 의해 Si nanocrystal의 성장과 특성에 영향을 주게 된다. 이 현상을 연구하기 위해 stoichiometric SiC/Si-rich SiC/stoichiometric SiC의 3층 구조로 시료를 제작하여 이를 SIMS의 depth profiling을 통하여 열처리 전보다 열처리 후에 Si-rich SiC layer내에 carbon이 약 2~3%정도 증가한 것으로 carbon이 diffusion된 것을 확인하였다. 이 시료를 UV-VIS-NIR spectroscopy, Raman, GIXRD 등의 다양한 측정을 통하여 carbon diffusion에 의한 Si nanocrystal의 특성변화를 연구하였다.

• The Journal of Korea Institute of Information, Electronics, and Communication Technology
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• v.12 no.5
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• pp.499-506
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• 2019

This paper is concerned with the operating stability of 7kW inverter using SIC hybrid module and verifies the validity of the simulation results by comparing the result of the loss equation and the simulation result, Simulation results using Si module and SiC hybrid module are compared to compare switch loss and diode loss. Through the loss equation calculation, the conduction loss of SiC Hybrid module is 168W, switching loss is 9.3W, diode loss is 10.5nW, When compared with the simulation results, similar values were shown. As a result of comparing the simulation results of the Si module and the SiC Hybrid module, The total device loss of the Si module was 246.2W, and the total device loss of the SiC Hybrid module was 189.9W. The loss difference was 56.3W, which was about 0.8W. thereby verifying the reverse recovery characteristics of the SiC SBD. In addition, temperature saturation test was conducted to confirm the stability of SiC Hybrid module and Si module under high temperature saturation, In the case of the Si module, the output power was stopped at 4kW, and the SiC Hybrid module was confirmed to operate at 7kW. Based on this, an efficiency graph and a temperature graph are presented, and the Si module is graphed up to 4kW and the SiC Hybrid module is graphed up to 7kW.