• Journal of Institute of Control, Robotics and Systems
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• v.18 no.4
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• pp.359-364
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• 2012

Real-Time Traversability should be analyzed from the equiped sensors' data in real time for autonomous outdoor navigation. However, it is difficult to find out such traversability that considers the terrain roughness and the vehicle dynamics especially in case of skid type vehicle. The traversability based on real time dynamic analysis was proposed to solve such problem but in navigation with strait driving path. To adapt the method into the navigation with curved driving path, a path following controller should be incorporated into the dynamic model even though it cause the real time problem. In this paper, a dynamic model is proposed to solve the real time problem in the traversability analysis based on real time dynamic simualtion. The dynamic model contains the control dummy which is connected to the vehicle body with a universal joint to follow the curved path without controller. Simulation and experimental results on $6{\times}6$ articulated unmanned ground vehicle demonstrate the method's effectiveness and applicability into the traversability analysis on terrain with bumps.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.2
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• pp.5-9
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• 2015

Thermal management becomes serious in 3D stacked IC because of higher heat flux, increased power generation, extreme hot spot, etc. In this paper, we reviewed the recent developments of thermal management for 3D stacked IC which is a promising candidate to keep Moore's law continue. According to experimental and numerical simulation results, Cu TSV affected heat dissipation in a thin chip due to its high thermal conductivity and could be used as an efficient heat dissipation path. Other parameters like bumps, gap filling material also had effects on heat transfer between stacked ICs. Thermal aware circuit design was briefly discussed as well.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.4
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• pp.71-78
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• 2012

This paper describes trends in conventional scaling compared with advanced technologies such as 3D integration (3DI) and bumpless through-silicon via (TSV) processes, as well as the characteristics of CMOS (Complementary Metal Oxide Semiconductor) Logic device after thinning the wafers to less than $10{\mu}m$. Each module process including thinning, stacking, and TSV, is optimized for 3D Wafer-on-Wafer (WOW) application. Optimization results are discussed with valuable data in detail. Since vertical wiring of bumpless TSV can be connected directly to the upper and lower substrates by self-alignment, bumps are not necessary when TSV interconnects are used.

• The Bulletin of The Korean Astronomical Society
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• v.41 no.2
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• pp.40.2-40.2
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• 2016

The attenuation of starlight by dust in galactic environments is investigated through models of radiative transfer in a spherical, clumpy interstellar medium (ISM). We show that the attenuation curves are primarily determined by the wavelength dependence of absorption rather than by the underlying extinction (absorption+scattering) curve; the observationally derived attenuation curves cannot constrain a unique extinction curve unless the absorption or scattering efficiency is specified. Attenuation curves consistent with the Calzetti curve are found by assuming the silicate-carbonaceous dust model for the Milky Way (MW), but with the $2175{\AA}$ bump suppressed or absent. The discrepancy between our results and previous work that claimed the Small Magellanic Cloud dust to be the origin of the Calzetti curve is ascribed to the difference in adopted albedos; we use the theoretically calculated albedos whereas the previous ones adopted empirically derived albedos from observations of reflection nebulae. It is found that the model attenuation curves calculated with the MW dust are well represented by a modified Calzetti curve with a varying slope and UV bump strength. The strong correlation between the slope and UV bump strength, as found in star-forming galaxies at 0.5 < z < 2.0, is well reproduced if the abundance of the UV bump carriers is assumed to be 30-40% of that of the MW-dust; radiative transfer effects lead to shallower attenuation curves with weaker UV bumps as the ISM is more clumpy and dustier. We also argue that some of local starburst galaxies have a UV bump in their attenuation curves, albeit very weak.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.24 no.5
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• pp.576-582
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• 2015

Generally, the fuel economy of hybrid electric vehicle (HEV) is effected by the size of each component. In this study the fuel economy for HEV of our own making is evaluated using backward simulator, where dynamic programming is applied. In a competition, the vehicle is running through the road course that includes many speed bumps and steep grade. Therefore, the new driving cycle including road grade is developed for the simulation. The backward simulator is also developed through modeling each component. A performance map of engine and motor for component sizing is made from the existing engine map and motor map adapted to the HEV of our own making. For optimal component sizing, the feasible region is defined by restricting the power range of power sources. Optimal component size for best fuel economy is obtained within the feasible region through the backward simulation.

• Journal of the Microelectronics and Packaging Society
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• v.5 no.1
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• pp.7-18
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• 1998

In the flip chip interconnection on organic substrates using eutectic Pb/Sn solder bumps highly reliable Under Bump Metallurgy (UBM) is required to maintain adhesion and solder wettability. Various UBM systems such as 1$\mu$m Al/0.2$\mu$m Pd/1$\mu$m Cu, laid under eutectic Pb/Sn solder were investigated with regard to their interfacial reactions and adhesion proper-ties. The effects of numbers of solder reflow and aging time on the growth of intermetallic compounds (IMCs) and on the solder ball shear strength were investigated. Good ball shear strength was obtained with 1$\mu$m Al/0.2$\mu$m Ti/5$\mu$m Cu and 1$\mu$m Al/0.2$\mu$m ni/1$\mu$m Cu even after 4 solder reflows or 7 day aging at 15$0^{\circ}C$. In contrast 1$\mu$m Al/0.2$\mu$m Ti/1$\mu$m Cu and 1$\mu$mAl/0.2$\mu$m Pd/1$\mu$m 쳐 show poor ball shear strength. The decrease of the shear strength was mainly due to the direct contact between solder and nonwettable metal such as Ti and Al resulting in a delamination. In this case thin 1$\mu$m Cu and 0.2$\mu$m Pd diffusion barrier layer were completely consumed by Cu-Sn and pd-Sn reaction.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.74-79
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• 2000

In an attempt to estimate the wetting properties of wettable metal layers by wetting balance method, an analysis of wetting curves of the coating layer was performed. Based on the analysis, wetting properties of UBM-coated Si-plate were estimated by the new wettability indices. The wetting curves of the one and both sides-coated UBM layers have the similar shape and show the similar tendency to the temperature. So the wetting property estimation of one side coating is possible with wetting balance method. For UBM of Si-chip, Cr/Cu/Au UBM is better than Ti/Ni/Au in the point of wetting time. At general reflow temperature, the wettability of high melting point solders(Sn-Sb, Sn-Ag) is better than that of few melting point ones(Sn-Bi, Sn-In).The contact angle of the one side coated plate to the solder can be calculated from the farce balance equation by measuring the static state force and the tilt angle.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.3
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• pp.57-64
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• 2007

New Chip-on-glass technology to attach an Si chip directly on the glass substrate of LCD panel was studied with local heating method of the Si chip by using thin film heater fabricated on the Si chip. Square-shaped Cu thin film heater with the width of $150\;{\mu}m$, thickness of $0.8\;{\mu}m$, and total length of 12.15 mm was sputter-deposited on the $5\;mm{\times}5\;mm$ Si chip. With applying current of 0.9A for 60 sec to the Cu thin film heater, COG bonding of a Si chip to a glass substrate was successfully accomplished with reflowing the Sn-3.5Ag solder bumps on the Si chip.

• Journal of Advanced Marine Engineering and Technology
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• v.31 no.8
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• pp.998-1004
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• 2007

Connecting a synchronous generator to a power system is a dynamic process, requiring the coordinated operation of many components and systems. The goal is to connect the oncoming generator to the system smoothly i.e without causing any significant bumps, surges, or power swings, by closing the ACB when the oncoming generator matches the power system in voltage magnitude, phase angle, and frequency. If oncoming generator voltage is not matched to the power system voltage, reactive power will flow either into or out of the system at the instant of ACB closure. If this voltage difference is too great, the reactive power flow may result in high transient stresses that could damage the windings of the generator. Also, if oncoming generator frequency is not matched to the power system frequency, transient power will flow between generator and power system. If the frequency difference is too great, the transient power flow is reflected into the prime mover shaft, and this may result in excessive shaft or coupling stress. This paper tries to prove the necessity of correct synchronization for ship generators through a transient phenomenon analysis.

• Journal of the Korean Vacuum Society
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• v.17 no.1
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• pp.1-8
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• 2008

We analyzed the characteristics of water leakage from cooling components of the storage ring in the Pohang Light Source. The water leaks led localized pressure bumps and abnormal pressure changes. The leakage also changed the residual gas compositions depending not only on the position between leakage place to gas analyzer but also on on/off switching of ion pump and electron beam. We found that the residual gas analysis of $CH_4$, CO, NO was useful in determining water leaks.