• 한국정밀공학회지
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• 제26권12호
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• pp.18-22
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• 2009

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2016년도 추계학술대회 논문집
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• pp.113-113
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• 2016

반도체 웨이퍼 패키지 공정에는 솔더 범프용으로 주석-은 합금 도금액이 사용되어 왔다. 최근, 주석-은 도금 피막중의 은 함량의 불균일성, 불용성 양극의 사용에 의한 전압 상승. 은의 도금 치구에의 석출, 리플로 후의 보이드의 형성 등의 문제로 인하여 주석 단독 금속 도금에 의한 범프 형성이 실용화되었다. 본 연구에서는, 범프용 주석 도금액에서의 전류밀도, 금속이온의 농도, 유리산의 농도 및 첨가제의 농도가 범프 두께 균일성에 미치는 영향을 조사하였다.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2015년도 춘계학술대회 논문집
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• pp.184-184
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• 2015

주석-은 합금 도금액은 반도체 웨이퍼 패키지 공정에 사용되어지고 있으며, 기존의 저속 주석-은 합금 도금액 대비 개발된 고속 주석-은 합금 도금액은 10ASD 이상에서 안정된 사용이 가능하고 기존의 주석-은 합금에 비해 생산효율을 증가의 목표를 가지고 개발을 진행하게 되었다. 웨이퍼 도금 평가를 통해 범프 두께가 균일하고, 표면 형상이 균일한 약품임을 검증하였으며, 액관리가 편하고, Sn과 Ag의 석출 비율도 관리 가능한 제품을 개발하였다.

• 한국학교ㆍ지역보건교육학회지
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• 제13권2호
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• pp.107-118
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• 2012

Backgrounds: In order to prevent dental injuries that often occur in child and adolescent, it is intended to investigate and assess actual state of the injury development, present epidemiological background, and consider and discuss for preparing preventive means against the injury development. Purpose: It was attempted to understand major features of dental injuries developing in child and adolescent and indentify high risk factors of dental injuries in child and adolescent. Methods: In this study, 523 cases of computerized data collected as disease entities of dental injuries among 1-18 years old patient visiting S university hospital located in Seoul in 2009 were analyzed and following results were obtained. Results: It was found that the ratio of dental injuries by genders in child and adolescent was 66.14% of male and 33.86% of female. It was shown also that causes of dental injuries by ages were more in order of falling, bumping, chewing, traffic accident, sports, violence, and crash. In addition places where dental injuries occur by ages were home in less than 5 year old group, park, playground, and play yard in 6-11 year old group, park, playground, and play yard also in 12-14 year old group, and stairs, road, and outdoor places such as mountain climbing, beach, and camping in 15-18 year old group. It was found that time rages when dental injuries in child and adolescent often develop were 15-19 o'clock for falling, 15-19 o'clock for crash, 15-19 o'clock for bumping, 19-03 o'clock for violence, 15-19 o'clock for traffic accident, 15-19 o'clock for sports activity, and 15-19 o'clock for chewing. Conclusion: Background of dental injury inducing factors are very complicated and diversified, so deep study and analysis are required for its prediction. Therefore, it seems necessary to identify risk factors by phases such as before, at, and after accident, establish strategies to reduce injury development, and develop and utilize necessary programs.

• 수산해양기술연구
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• 제56권2호
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• pp.138-146
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• 2020

Stow net fishery is one of the fishery with high fishing work accidents in southwestern sea of Korea. We conducted to serve as basic data for improving the healthy and safe working environment of fisher using risk assessment process (ISO45001) with fishermen's occupational accidents of the National Federation of Fisheries Cooperative (NFFC) from 2016 to 2018. The average occurrence rate of victim in this fishery was 9.04%, 16.7 times more than such rate in all industries. In addition, the average fatality rate was found to have a very serious level management to 31.06‱, 27.7 times more than such rate in all industries. The safety hazards of stow net fishery was more likely to occur by other general industrial groups, with more severe consequences after the accident. According to 4M analysis, 58.6% of all accidents were caused by human factors, 24.0% by environmental factors, 16.0% by mechanical factors, and 1.5% by managerial factors, respectively. The occurrence frequency by accident type was the highest in 187 cases (32.2%) for struck by object, 158 cases (27.2%) for slipping, and 94 cases (16.2%) for being in contact with machinery. Severity is the highest for others such as diseases etc., in the order of being struck by object, being in contact with machinery, falling from above slipping, collapsing, bumping, and burning. Being struck by object, being in contact with machinery, and slipping are high-risk groups, falling from above others, bumping, and burning are medium-risk groups based on the risk assessment using the occurrence frequency and severity of accident. The obtained results are expected to contribute to the safe operation environment subsidy for fishing crews on the stow net fishing vessel.

• 지능정보연구
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• 제19권2호
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• pp.39-54
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• 2013

전자상거래의 폭발적 증가는 소비자에게 더 유리한 많은 구매 선택의 기회를 제공한다. 이러한 상황에서 자신의 구매의사결정에 대한 확신이 부족한 소비자들은 의사결정 절차를 간소화하고 효과적인 의사결정을 위해 추천을 받아들인다. 온라인 상점의 상품추천시스템은 일대일 마케팅의 대표적 실현수단으로써의 가치를 인정받고 있다. 그러나 사용자의 기호를 제대로 반영하지 못하는 추천시스템은 사용자의 실망과 시간낭비를 발생시킨다. 본 연구에서는 정확한 사용자의 기호 반영을 통한 추천기법의 정교화를 위해 데이터마이닝과 다중모형조합기법을 이용한 상품추천시스템 모형을 제안하고자 한다. 본 연구에서 제안하는 모형은 크게 두 개의 단계로 이루어져 있으며, 첫 번째 단계에서는 상품군 별 우량고객 선정 규칙을 도출하기 위해서 로지스틱 회귀분석 모형, 의사결정나무 모형, 인공신경망 모형을 구축한 후 다중모형조합기법인 Bagging과 Bumping의 개념을 이용하여 세 가지 모형의 결과를 조합한다. 두 번째 단계에서는 상품군 별 연관관계에 관한 규칙을 추출하기 위하여 장바구니분석을 활용한다. 상기의 두 단계를 통하여 상품군 별로 구매가능성이 높은 우량고객을 선정하여 그 고객에게 관심을 가질만한 같은 상품군 또는 다른 상품군 내의 다른 상품을 추천하게 된다. 제안하는 상품추천시스템은 실제 운영 중인 온라인 상점인 'I아트샵'의 데이터를 이용하여 프로토타입을 구축하였고 실제 소비자에 대한 적용가능성을 확인하였다. 제안하는 모형의 유용성을 검증하기 위하여 제안 상품추천시스템의 추천과 임의 추천을 통한 추천의 결과를 사용자에게 제시하고 제안된 추천에 대한 만족도를 조사한 후 대응표본 T검정을 수행하였으며, 그 결과 사용자의 만족도를 유의하게 향상시키는 것으로 나타났다.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2005년도 추계종합학술대회
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• pp.667-670
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• 2005

본 논문은 100um와 80um의 텅스텐 와이어를 이용하여 세라믹(Ceramic)기판에 홀(Hole)을 뚫어 텅스텐 와이어를 수직으로 세우는 방식으로 수직형의 마이크로 스프링을 제작하였다. 마이크로 스프링의 설계를 위해 제한된 실험 결과와 신경회로망을 이용하여 텅스텐 와이어의 두께와 높이, 쉬프트(Shift)의 양을 변화시키면서 장력(Tension force)을 모델링하였고 제작을 통해 검증하였다. 이는 기존의 수평형 프로브카드의 한계를 대체할 수 있는 수직형 프로브카드의 핵심 모듈로서 멀티다이(Multi Die) 뿐만 아니라 범핑(Bumping)타입의 칩 테스트도 가능하다.

• 한국표면공학회지
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• 제50권3호
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• pp.155-163
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• 2017

In this study, the effects of the concentration of metal ions and the applied current density in the Sn-Ag plating solutions were examined in regards to the resulting composition and morphology of the solder bumps' surface. Furthermore the effect of any impurities present in the methanesulfonic acid used as a base acid in the Sn-Ag solder plating solution on the stability of plating solution as well as the characteristics of the Sn-Ag alloys films was also explored. As expected, the uniform bump was obtained by means of removing impurities in the plating solution. Consequently the resultant solder bump was obtained in an optimal current density of the range of $1A/dm^2$ to $15A/dm^2$, which has acceptable bump shape and surface roughness with 12inch wafer trial results.

• 산업경영시스템학회지
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• 제25권1호
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• pp.49-55
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• 2002

For making a lead terminal(condenser, resistor etc.), it is the matter that lead wire have to be supplied smooth without twisting and curving when it is supplied to the further processing (cutting, forming, attach process) after it being forwarded. The purpose of this study is to solve the winding claims of lead wire through the structural expansion of winding equipment to which the improvement of packing equipment to forward safely and supply the lead wire and QFD method are applied. The results of this study is available to solve the technical problem caused by the installation of the existing flyer system for the prevention of twisting and can expect the quality assurance as it prevents the claim(surface fault) caused by the bumping among lead wire which are involved in the packing equipment in its moving stage.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2003년도 기술심포지움 논문집
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• pp.169-173
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• 2003

We demonstrated the applicability of dry film photoresist (DFR) in photolithography process for fine pitch solder bumping on the polytetrafluoroethylene (PTFE/Teflon) printed circuit board (PCB). The copper lines were formed with $100\;{\mu}m$ width and $18\;{\mu}m$ thickness on the PTFE test board, and varying the gaps between two copper lines in a range of $100-200\;{\mu}m$. The DFRs of $15\;{\mu}m$ thickness were laminated by hot roll laminator, by varying laminating temperature from $100^{\circ}C\;to\;150^{\circ}C$ and laminating speed. We found the optimum process of DFR lamination on PTFE PCB and accomplished the formation of indium solder bumps. The optimum lamination condition was temperature of $150^{\circ}C$ and speed of about 0.63 cm/s. And the smallest size of indium solder bump was diameter of $50\;{\mu}m$ with pitch of $100\;{\mu}m$.