• 한국레이저가공학회지
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• 제14권1호
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• pp.14-18
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• 2011

Semiconductor industry demands decrease in line/space dimensions of IC substrates. Particularly for IC substrates for CPU, line/space dimensions below $10{\mu}m/10{\mu}m$ are expected to be used in production since 2014. Conventional production technologies (SAP, etc.) based on photolithography are widely agreed to be reaching capability limits. To address this limitation, the embedded circuit fabrication technology using laser ablation has been recently developed. In this paper, we used a nanosecond UV laser and a picosecond UV laser to fabricate embedded circuit patterns into a buildup film with $SiO_2$ powders for IC substrate. We conducted SEM and EDS analysis to investigate surface quality of the embedded circuit patterns. Experimental results showed that due to higher recoil pressure, picosecond UV laser ablation of the buildup film generated a better surface roughness.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2013년도 춘계학술대회 논문집
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• pp.607-608
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• 2013

• 한국레이저가공학회지
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• 제17권3호
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• pp.19-23
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• 2014

To directly engrave circuit-line patterns as wide as $6{\mu}m$ in a buildup film to be used as an IC substrate, we applied a projection ablation technique in which an 8 inch dielectric ($ZrO_2/SiO_2$) mask, a DPSS 355nm laser instead of an excimer laser, a ${\pi}$-shaper and a galvo scanner are used. With the ${\pi}$-shaper and a square aperture, the Gaussian beam from the laser is shaped into a square flap-top beam. The galvo scanner before the $f-{\theta}$ lens moves the flat-top beam ($115{\mu}m{\times}105{\mu}m$) across the 8 inch dielectric mask whose patterned area is $120mm{\times}120mm$. Based on the results of the previous research by the authors, the projection ratio was set at 3:1. Experiments showed that the average width and depth of the engraved patterns are $5.41{\mu}m$ and $7.30{\mu}m$, respectively.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2012년도 춘계학술대회 논문집
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• pp.171-172
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• 2012

• 한국레이저가공학회지
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• 제16권3호
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• pp.27-31
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• 2013

To engrave high-density circuit-line patterns in IC substrates, we applied a projection ablation technique in which a dielectric ($ZrO_2/SiO_2$) mask, a DPSS UV laser instead of an excimer laser, a refractive beam shaping optics and a galvo scanner are used. The line/space dimension of line patterns of the dielectric mask is $10{\mu}m/10{\mu}m$. Using a ${\pi}$ -shaper and a square aperture, the Gaussian beam from the laser is shaped into a square flap-top beam; and a telecentric f-${\theta}$ lens focuses it to a $115{\mu}m{\times}105{\mu}m$ flat-top beam on the mask. The galvo scanner before the f-${\theta}$ lens moves the beam across the scan area of $40mm{\times}40mm$. An 1:1 projection lens was used. Experiments showed that the widths of the engraved patterns in a buildup film ranges from $8.1{\mu}m$ to $10.2{\mu}m$ and the depths from $8.8{\mu}m$ to $11.7{\mu}m$. Results indicates that it is required to increase the projection ratio to enhance profiles of the engraved patterns.

• 폴리머
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• 제29권4호
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• pp.392-398
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• 2005

Layer-by-layer(LbL) 흡착에 의한 poly(ethylene-alt-m미? anhydride) (PEMAh)/poly(4-vinyl pyridine) (P4VP) 자기조립 다층박막을 제조하였다. 자기조립 다층막을 이루는 PEMAh/P4VP 두 고분자 사이의 수소 결합과 정전기적 인력이 다층막을 이루는 원동력이라는 것이 푸리에 변환 적외선(FT-IR) 분광분석에 의해서 확인되었다. 다층막의 균일한 자기조립 과정은 PEMAh/P4VP 이중층막의 적층 수 증가에 따른 UV-vis 스펙트럼의 256 nm에서 나타나는 P4VP 특성 흡수 피크의 선형적 증가에 의해서 확인할 수 있었다. 다층막을 이루는 고분자 전해질 담지 용액의 조건 변화가 다층막 형성에 미치는 영향을 살펴보기 위하여 두 고분자 용액의 농도 및 PEMAh 담지용액의 pH를 변화시키면서 다층막을 제조하였다. 다층막의 두께, 흡착된 고분자 전해질 질량 및 표면 거칠기의 변화를 UV-vis 분광 분석, 수정진동자 미량저울(quartz crystal microbalance;QCM) 및 원자 힘 현미경(atomic force microscopy;AFM)을 이용하여 측정하였다.

• Transactions on Electrical and Electronic Materials
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• 제15권5호
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• pp.257-261
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• 2014

Multilayered CdTe/PSS films were prepared by the electrostatic self-assembly method in an aqueous medium. Positively-charged cadmium telluride (CdTe) nanoparticles and anionic polyelectrolyte, poly (sodium 4-styrene sulfonate) (PSS) were assembled alternately in order to build up a multilayered film structure. A linear proportion of absorbance to the number of bilayers suggests that an equal amount of CdTe was adsorbed after each dipping cycle, which resulted in the buildup of a homogenous film. The binding energies of elements (Cd and Te) in multilayered CdTe/PSS film shifted from those of the CdTe nanoparticles in the pure state. This result indicates that the interfacial electron densities were redistributed by the strong electrostatic interaction between the oppositely-charged CdTe and PSS. Electrochemical properties of the multilayered CdTe/PSS films were studied in detail by cyclic voltammetry (CV).

• 한국레이저가공학회지
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• 제15권4호
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• pp.16-19
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• 2012

Due to the fact that the dimensions of circuit lines of IC substrates have been forecast to reduce rapidly, engraving the circuit line patterns with laser has emerged as a promising alternative. To engrave circuit line patterns in an IC substrate, we used a projection ablation technique in which a metal (INVAR) mask and a DPSS UV laser instead of an excimer laser are used. Results showed that the circuit line patterns engraved in the IC substrate have a width of about 15um and a depth of $13{\mu}m$. This indicates that the projection ablation with a metal mask and a DPSS UV laser could feasibly replace the semi-additive process (SAP).

• 한국포장학회지
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• 제18권1_2호
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• pp.1-8
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• 2012

한국고유 발효채소인 김치는 살균공정이 없이 미생물이 살아있는 상태로 유통되고 있다. 이로 인하여 저장 유통 중에 젖산과 이산화탄소가 생성되어 문제를 야기한다. $CO_2$ 생산은 두 단계로 이루어지는데, 처음에 빠르고 나중에 낮으며, $CO_2$ 생산속도는 김치 종류, 염도 및 저장온도에 따라 다르다. 김치로부터 생산되는 $CO_2$ 기체는 포장 내에 축적되어 부피팽창과 압력발생을 야기한다. 염도와 저장온도에 따른 $CO_2$ 생산속도의 함수적 의존관계는 문헌에서 발표된 바가 있으며, 이를 이용하여 여러 저장조건에서의 부피 및 압력의 변화를 예측하는 것이 가능하다. $CO_2$ 발생의 문제를 해결하는 방법으로서 기체확산 핀홀, 고 $CO_2$ 투과 필름, $CO_2$ 흡수제 등의 이용이 검토되고 연구되어 왔다. 이러한 기법을 적절히 도입하여 설계된 포장은 김치에 높은 용존 $CO_2$와 함께 높은 탄산미의 관능적 품질을 하면서도 부피팽창과 압력발생을 완화할 수 있었다. 각 방법의 장점과 함께 한계를 검토 고찰하였다.

• Radiation Oncology Journal
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• 제7권1호
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• pp.101-112
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• 1989

The treatment planning and dosimetry of small fields for stereotactic radiosurgery with 10 MV x-ray isocentrically mounted linear accelerator is presented. Special consideration in this study was given to the variation of absorbed dose with field size, the central axis percent depth doses and the combined moving beam dose distribution. The collimator scatter correction factors of small fields $(1\times1\~3\times3cm^2)$ were measured with ion chamber at a target chamber distance of 300cm where the projected fields were larger than the polystyrene buildup caps and it was calibrated with the tissue equivalent solid state detectors of small size (TLD, PLD, ESR and semiconductors). The central axis percent depth doses for $1\timesl\;and\;3\times3cm^2$ fields could be derived with the same acuracy by interpolating between measured values for larger fields and calculated zero area data, and it was also calibrated with semiconductor detectors. The agreement between experimental and calculated data was found to be under $2\%$ within the fields. The three dimensional dose planning of stereotactic focusing irradiation on small size tumor regions was performed with dose planning computer system (Therac 2300) and was verified with film dosimetry. The more the number of strips and the wider the angle of arc rotation, the larger were the dose delivered on tumor and the less the dose to surrounding the normal tissues. The circular cone, we designed, improves the alignment, minimizes the penumbra of the beam and formats ball shape of treatment area without stellate patterns. These dosimetric techniques can provide adequate physics background for stereotactic radiosurgery with small radiation fields and 10MV x-ray beam.