• Journal of Korea Technical Association of The Pulp and Paper Industry
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• v.29 no.4
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• pp.53-63
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• 1997

Most cellulose resources come from the higher plants, but bacteria also synthesize same cellulose as in plants. Many scientists have been widely studied on the bacterial cellulose, the process development, manufacturing, even marketing of cellulose fibers. The bacterial celluloses are very different in its physical and morphological structures. These fibers have many unique properties that are potentially and commercially beneficial. The fine fibers can produce a smooth paper with enchanced its strength property. But there gave been few reports on the mechanical properties of the processing of bacterial cellulose into structural materials. This study were performed to elucidate the mechanical properties of sheets prepared from bacterial cellulose. Also reinforcing effect of bacterial cellulose on the conventional pulp paper as well as surface structures by scanning electron microscopy were discussed. Paper made from bacterial cellulose is 10 times much stronger than ordinary chemical pulp sheet, and the mixing of bacterial cellulose has a remarkable reinforcing effect on the papers. Mechanical strengthes were increased with the increase of bacterial cellulose content in the sheet. This strength increase corresponds to the increasing water retention value and sheet density with the increase of bacterial cellulose content. Scanning electron micrographs were shown that fine microfibrills of bacterial celluloses covered on the surfaces of hardwood pulp fibers, and enhanced sheet strength by its intimate fiber bonding.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2018.06a
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• pp.80-80
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• 2018

실리콘 관통전극 (Through Silicon Via, TSV)는 메모리 칩을 적층하여 고밀도의 집적회로를 구현하는 기술로, 기존의 와이어 본딩 (Wire bonding) 기술보다 낮은 소비전력과 빠른 속도가 특징인 3차원 집적기술 중 하나이다. TSV는 일반적으로 도금 공정을 통하여 충전되는데, 고종횡비의 TSV에 결함 없이 구리를 충전하기 위해서 3종의 유기첨가제(억제제, 가속제, 평탄제)가 도금액에 첨가되어야 한다. 이러한 첨가제 중 결함 발생유무에 가장 큰 영향을 주는 첨가제는 평탄제이기 때문에, 본 연구에서는 이미다졸(imidazole) 계열, 이민(imine) 계열, 디아조늄(diazonium) 계열 및 피롤리돈(pyrrolidone) 계열과 같은 평탄제(leveler)의 작용기에 따라 TSV 충전 성능을 조사하였다. TSV 충전 시 관능기의 거동을 규명하기 위해 QCM (quartz crystal microbalance) 및 EQCM (electrochemical QCM)을 사용하여 흡착 정도를 측정하였다. 실험 결과, 디아조늄 계열의 평탄제는 TSV를 결함 없이 충전하였지만 다른 작용기를 갖는 평탄제는 TSV 내 결함이 발생하였다. QCM 분석에서 디아조늄 계열의 평탄제는 낮은 흡착률을 보이지만 EQCM 분석에서는 높은 흡착률을 나타내었다. 즉, 디아조늄 계열의 평탄제는 전기 도금 동안 전류밀도가 집중되는 TSV의 상부 모서리에서 국부적인 흡착을 선호하며 이로 인하여 무결함 충전이 달성된다고 추론할 수 있다.

• Journal of Surface Science and Engineering
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• v.44 no.5
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• pp.190-195
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• 2011

Diamond-like carbon (DLC) has many outstanding properties such as low friction, high wear resistance and corrosion resistance. However, it is difficult to achieve enough adhesion on the metal substrates because of weak bonding between DLC film and the metal substrate. The purpose of this study is to enhance an adhesion of DLC film. For improving adhesion, the substrate was treated by active screen plasma nitriding before DLC film deposing. Nitrided substrates were investigated by Glow Discharge Spectrometer (GDS), Micro-Vickers Hardness. DLC films were deposited on several metals by linear ion source, and characteristics of the films were investigated using nano-indentation, Field Emission Scanning Electron Microscope (FESEM). The adhesion was measured by scratch tester. The adhesion of DLC films was increased when nitriding layer was formed before DLC deposition. Therefore, the adhesion of DLC film can be enhanced as increasing the hardness of materials.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.20 no.8
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• pp.701-705
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• 2007

The incorporation of N in a-C film is able to improve the friction coefficient and the adhesion to various substrates. In this study, a-C:N films were deposited on Si and steel substrates by closed-field unbalanced magnetron (CFUBM) sputtering system in $Ar/N_2$ plasma. The lubricant characteristics was investigated for a-C:N deposited with total working pressure from 4 to 7 mTorr. We obtained high hardness up to 24GPa, friction coefficient lower than 0.1 and the smooth surface of having the extremely low roughness (0.16 nm). The physcial properties of a-C:N thin film are related to the increase of cross-linked $sp^2$ bonding clusters in the film. However, the decrease of hardness, elastic modulus and the increase of surface roughness, friction coefficient with the increase of $N_2$ partial pressrue might be due to the effect of energetic ions as a result of the increase of ion bombardment with the increase of ion density in the plasma.

• Environmental Engineering Research
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• v.24 no.4
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• pp.608-617
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• 2019

The adsorption of sulfamethoxazole (SMX) onto a NaOH-activated pine wood-derived biochar was investigated via batch experiments and models. Surprisingly, the maximum adsorption capacity of activated biochar for SMX (397.29 mg/g) was superior than those of pristine biochars from various feedstock, but comparable to those of commercially available activated carbons. Elovich kinetic and Freundlich isotherm models revealed the best fitted ones for the adsorption of SMX onto the activated biochar indicating chemisorptive interaction occurred on surface of the activated biochar. In addition, the intraparticle diffusion limitation was thought to be the major barrier for the adsorption of SMX on the activated biochar. The main mechanisms for the activated biochar would include hydrophobic, π-π interactions and hydrogen bonding. This was consistent with the changes in physicochemical properties of the activated biochar (e.g., increase in sp² and surface area, but decrease in the ratios of O/C and H/C).

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.10 no.1
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• pp.1-4
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• 2000

Thin films of hydrogenated amorphous silicon carbide compounds ($a-Si_{x}C_{1-x}:H$) of different compositions were deposited on Si substrate by RF plasma-enhanced chemical vapor deposition (PECVD). Experiments were carried out using silane (SiH$_4$) and methane ($CH_4$) as the gas precursors at 1 Torr and at a low substrate temperature ($250^{\circ}C$). The gas flow rate was changed with the other parameters (pressure, temperature, RF power) fixed. The substrate was Si(100) wafer and all of the films obtained were amorphous. The bonding structure of $a-Si_{x}C_{1-x}:H$films deposited was investigated by X-ray photoelectron spectroscopy (XPS) for the film compositions. In addition, the surface morphology of films was investigated by atomic force microscopy (AFM).

• Carbon letters
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• v.3 no.3
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• pp.127-132
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• 2002

Unidirectional polymer composites were prepared using high-strength carbon fibers as reinforcement and phenolic resin as matrix precursor with keeping fiber volume fraction at 30, 40, 50 and 60% respectively. These composites were carbonized at $1000^{\circ}C$ and graphitised at $2600^{\circ}C$ in the inert atmosphere. The carbonized and graphitised composites were characterized for mechanical properties as well as microstructure. Microscopic studies were carried out of the polished surface of carbonized and graphitised composites after etching by chromic acid, to understand the effect of fiber volume fraction on oxidation at fiber-matrix interface. It is found that the flexural strength in polymer composites increases with fiber volume fraction and so does for the carbonised composites. However, the trend was found to be reversed in graphitised composites. In all the carbonized composites anisotropic region has been observed at fiber-matrix interface which transforms into columnar type microstructure upon graphitisation. The extension of strong and weak columnar type microstructure is function of fiber volume fraction. SEM microscopy of the etched surface of the sample reveal that composites containing 40% fiber volume has minimum oxidation at the interface, revealing a strong interfacial bonding.

• Journal of Surface Science and Engineering
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• v.29 no.5
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• pp.379-385
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• 1996

Adhesion of Cu/Cr and Cu/$Cu_xCr_{1-x}$ thin films onto polyimide substrates has been studied. For an adhesion layer, Cr or Cu-Cr alloy films were deposited onto polyimide using DC magnetron sputtering machine. Then Cu was sputter-deposited and finally, Cu was electroplated. Adhesion was evaluated using $90^{\circ}C$ peel test or T-peel test. Plastic deformation of the peeled metal layer was qualitatively measured using XRD technique. It is confirmed that high interfacial fracture energy and large plastic deformation are important to enhance the peel adhesion strength. High peel strength is obtained when the interface is strongly bonded. More ductile film has higher peel strength. In Cu-Cr alloy films, opposite effects of the Cr addition in the alloy film on the peel strength are operative: a beneficial effect of strong interfacial bonding and a negative effect of smaller plastic deformation.

• Journal of Surface Science and Engineering
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• v.29 no.5
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• pp.563-569
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• 1996

Degradation of $Zn_3N_2$ films is studied by using several analytical techniques. Polycrystalline $Zn_3N_2$ films prepared by reactie rf magnetron sputtering are kept in the air. Electrical and optical properties are measured by using van der Pauw technique and double-beam spectrometry. Structure and chemical bonding states are studied by X-ray diffraction(XRD), Fourier transfer infrared ray spectroscopy(FT-IR) and X-ray photoelectron specroscopy (XPS). Significant differences are observed in optical properties between the degraded film and the ZnO film. XRD analysis reveals that the degraded film contains very small ZnO grains because very weak and broad ZnO peaks are observed. XPS and FT-IR measurements reveal the formation of $Zn(OH)_2$ in the degraded film. The existence of N-H bonds in degraded films is exhibited from the N 1s spectra. $Zn_3N_2$ change into the mixture of ZnO, $Zn(OH)_2$ and an ammonium salt.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.356-356
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• 2007

Plasma immersion ion beam deposition (PIIBD) technique is a cost-effective process for the deposition of diamond like carbon thin film, the possible solid lubricant on large surface and a complex shape. We used PIIB process for the preparation of DLC thin film on $Al_2O_3$ with deposition conditions of deposition temperature range $200^{\circ}C$, working gas pressure of 1.310-1Pa. DLC thin films were coated by $C_2H_2$ ion beam deposition on $Al_2O_3$ after the ion bombardment of SiH4 as the bonding layer. Energetic bombardment of $C_2H_2$ ions during the DLC deposition to ceramic materials generated mixed layers at the DLC-Si interface which enhanced the interface to be highly bonded. Wear test showed that the low coefficient of friction of around 0.05 with normal load 2.9N and proved the advantage of the low energy ion bombardment in PIIBD process which improved the tribological properties of DLC thin film coated alumina ceramic. Furthermore, PIIBD was recognized as a useful surface modification technique for the deposition of DLC thin film on the irregular shape components, such as molds, and for the improvement of wear and adhesion problems of the DLC thin film, high temperature solid lubricant.