• Proceedings of the Korean Vacuum Society Conference
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• 2011.08a
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• pp.290-290
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• 2011

In this study Diamond-like carbon (DLC) films were deposited on p-type Si substrates using a Radio-Frequency magnetron Sputtering system. The DLC film was deposited by bombarding graphite target with a N2/Ar plasma mixture with various conditions: substrate, pressure, deposition time, temperature of substrate, power and ratio of gas mixture. The effect on the conduction and hardness of DLC thin films were investigated. The conduction of DLC films were measured by I-V measurement. In addition, Raman analysis was performed to study the chemical bonding structure. The hardness was measured by Nano indentation. Atomic Force Microscopy was used for determined surface morphology of DLC film.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2005.05a
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• pp.79-83
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• 2005

IT 기술, 반도체 산업 등의 급격한 발전에 힘입어 최근의 첨단 전자, 통신제품은 초경량 초소형화와 동시에 고기능 복합화의 발전 추세를 보이고 있다. 이런 추세에 발맞추어 전자제품, 통신제품의 핵심적인 부품인 IC chip도 소형화되고 있다. IC chip 패키징 기술의 하나인 Filp Chip Package는 Module Substrate 위에 Chip Surface를 Bumping 시킴으로서 최단의 접속길이와 저열저항, 저유전율의 특성도 가지면서 초소형에 높은 수율의 저 원가생산성을 갖는 첨단의 패키징 기술이다. 이런 패키징 기술은 수요증가와 더불어 폭발적으로 늘어나고 있으나 까다로운 공정기술에 의해 아직 여러 회사에서 장비가 출시되고 있지 못한 상태이다. 이에 본 연구에서는 최근 수요가 증가하는 LCD Driver IC용 COF 장비를 위한 Flip chip Bonding 장비 및 시스템을 설계, 제작하였다.

• Proceedings of the KWS Conference
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• 1995.04a
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• pp.155-159
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• 1995

A16061 alloy reinforced with 10 vol% $\delta$-A1$_2$O$_3$ short fiber have been fabricated by Rheo-compocasting and squeeze casting and extruded at high temperature using conical shape die and curved shape die with various extrusion ratios.. Tensile and hardness tests were carried out to examine mechanical properties of extruded materials and SEM observation of fractured surface was capable of accounting for fracture mechanism and bonding state of fiber and matrix.

• Journal of Welding and Joining
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• v.29 no.5
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• pp.90-94
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• 2011

Ag metallic particles from nano-scale to submicron-scale are combined with organic solvent to provide fine circuits and interconnection. Ink-jet printing with Ag nano particle inks demonstrated the potentials of the new printed electronics technology. The bonding at the interface between the Ag wiring layer and the various substrates is very important. In this study, the details of interfaces in Ag wiring are investigated primarily by microstructure observation. By adjusting the materials and sintering conditions, nicely formed interfaces between Ag wiring and Cu, Au or organic substrates are achieved. In contrast, transmission electron microscope (TEM) image clearly shows interface debonding between Ag wiring and Sn substrate. Sn oxides are formed on the surface of the Sn plating. The formation of these is a root cause of the interface debonding.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09b
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• pp.1138-1139
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• 2006

The present study has shown that the effect of boron and phosphorus in Ni-Cr-Si-X alloy to interfacial reactions and bonding strength of diamond-steel substrate, and the influence of various construction parameters on the formation of the topography of the tool. And these factors are required to making a good brazed tool. The microstructures and phase change of the brazed region were analyzed into SEM, EDS. According to the electron probe microanalysis, while brazing, the chromium present in the brazing alloy segregated preferentially to the surface of the diamond to form a chromium rich reaction product, which was readily wetted by the alloy.

• Journal of Korea Foundry Society
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• v.9 no.5
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• pp.403-412
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• 1989

This study has been carried out to investigate into the properties of molding sands containing various core sands, $CO_2$, Shell, Furan, Pep Set and Cold Box, in the system sands using domestic active bentonite. The properties of system sands with 5% bentonite and 3% moistures containing baked core sands and no-baked core sands were varied by the ratio of core sands. The system sand containing no-baked core sands had been the poor bonding force and rough grain surface than those of the baked core sands. The L. O. I of system sand containing 30% organic binders core sands were more than inorganic binders core sands. It has been found that the no-baked core sands were necessary have to reclaim for using molding sand.

• ETRI Journal
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• v.35 no.2
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• pp.340-343
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• 2013

A novel bumping process using solder bump maker is developed for the maskless low-volume solder on pad (SoP) technology of fine-pitch flip chip bonding. The process includes two main steps: one is the aggregation of powdered solder on the metal pads on a substrate via an increase in temperature, and the other is the reflow of the deposited powder to form a low-volume SoP. Since the surface tension that exists when the solder is below its melting point is the major driving force of the solder deposit, only a small quantity of powdered solder adjacent to the pads can join the aggregation process to obtain a uniform, low-volume SoP array on the substrate, regardless of the pad configurations. Through this process, an SoP array on an organic substrate with a pitch of $130{\mu}m$ is successfully formed.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.23 no.2
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• pp.67-75
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• 2013

In order to improve osseo-integration of a dental implant with bone crystal we studied an implant with holes inside its body to deliver bioactive materials based on a proposed patent. After bioactive material is absorbed, bone crystal can grow into holes to increase implant bonding in addition to surface integration. The larger cross section area of outlet holes showed the less values of the maximum stress, and the stress concentrations near the uppermost outlet holes were also reduced with an increasing number of outlet holes. The conclusion, that the uppermost outlet design improvement was most effective to reduce the stress concentration and improve the growth rate of bone crystal, could be drawn. After the design optimizations, Type 6-C had provided the best results in this study. The overall shape optimization studies on the shape, location, number, and so on, of the outlet holes, should be carried out further.

• Journal of Environmental Science International
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• v.8 no.1
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• pp.61-67
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• 1999

Silicone oil has organic and inorganic properties, and its skeleton is polysiloxane bonding that silicon is bonded hydrogen or organic group. Silicone compounds are very smooth and lubricant properties by low surface tension, low temperature dependence, and nonadhesive properties. Because of these properties, silicone compounds are used as many parts of chemicals, softener, smooth and libricant agents, water-repellent agent, and defoaming agent, etc. Emulsion was prepared with the inversion emulsification method which adopted the agent-in-oil method dissolving the polyoxyethylene(7) tridecyl ether(HLB 12.2) into methoxy terminated poly(dimethyl-co-methyl amino) siloxane and hydroxy terminated poly(dimethyl-co-methyl amino) siloxane in water. At this time, processed emulsion was almost microemulsion. When ratio of emulsifier increases, emulsion is stable bacuause microemulsion is solubilized by emulsion drop size and zeta-potential are decreased. But, when amount of electrolyte is increase, emulsion became unstable because emulsion drop size is increased.

• Journal of the Korean Ceramic Society
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• v.43 no.8 s.291
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• pp.469-471
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• 2006

The effects of $Cr_2O_3$ on the microstructural evolution and mechanical properties of $Al_2O_3$ polycrystalline were investigated. The microstructure of $Al_2O_3-Cr_2O_3$ composites (ruby) was carefully controlled in order to obtain dense and fine-grained ceramics, thereby improving their properties and reliability with respect to numerous applications related to semiconductor bonding technology. Ruby composites were produced by Ceramic Injection Molding (CIM) technology. Room temperature strength, hardness, Young's modulus and toughness were determined, as well as surface strengthening induced by thermal treatment and production of a fine-grained homogenous microstructure.