• Progress in Superconductivity and Cryogenics
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• v.24 no.4
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• pp.16-24
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• 2022

Applications of REBa₂Cu₃O_7-δ tapes require joints with a simple manufacturing process, low resistance and good mechanical properties. In the present study, we successfully developed a copper diffusion joint between Cu-stabilized REBa₂Cu₃O_7-δ tapes that meets the above requirements without solder simply by applying flux, heat and pressurization. After a 3 min thermocompression process at approximately 150 δ and 336 MPa in air, two tapes were directly connected between Cu stabilizers by copper diffusion, which was proven by microstructure analysis. The specific resistivity of the copper diffusion joint reached 5.8 nΩ·cm² (resistance of 0.4 nΩ for a 306 mm splicing length) at 77 K in the self-field. The axial tensile stress reached 200 N without critical current degradation. The results show promise for the preparation of copper diffusion joints to be used in coils, attached tapes, and wire/cable terminals.

• Steel and Composite Structures
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• v.45 no.4
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• pp.591-603
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• 2022

The flexural strengthening of reinforced concrete beams by external bonding of composite materials has proved to be an efficient and practical technique. This paper presents a study on the flexural performance of reinforced concrete continuous beams with three spans (one span and two cantilevered) strengthened by bonding carbon fiber fabric (CFRP). The model is based on equilibrium and deformations compatibility requirements in and all parts of the strengthened continuous beam, i.e., the continuous concrete beam, the FRP plate and the adhesive layer. The adherend shear deformations have been included in the present theoretical analyses by assuming a linear shear stress through the thickness of the adherends. Remarkable effect of shear deformations of adherends has been noted in the results. The theoretical predictions are compared with other existing solutions that shows good agreement, and It shows the effectiveness of CFRP strips in enhancing shear capacity of continuous beam. It is shown that both the normal and shear stresses at the interface are influenced by the material and geometry parameters of the composite beam.

• Journal of Sensor Science and Technology
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• v.3 no.2
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• pp.74-80
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• 1994

Silicon direct bonding technology is very attractive for both silicon-on-insulator devices and sensor fabrication because of its thermal stress free structure and stability. The process of SDB includes hydration of silicon wafer and heat treatment in a wet oxidation furnace. After hydration process, hydroxyl groups of silicon wafer were analyzed by using Fourier transformation-infrared spectroscopy. In case of hydrophilic treatment using a ($H_{2}O_{2}\;:\;H_{2}SO_{4}$) solution, hydroxyl groups are observed in a broad band around the 3474 $cm^{-1}$ region. However, hydroxyl groups do not appear in case of diluted HF solution. The bonded wafer was etched by using tetramethylammonium hydroxide etchant. The surface of the self etch-stopped silicon dioxide is completely flat, so that it can be used as sensor applications such as pressure, flow and acceleration, etc..

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.43-55
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• 2000

In traditional electronic packages the die and the substrate are interconnected with fine wire. Wire bonding technology is limited to bond pads around the peripheral of the die. As the demand for I/O increases, there will be limitations with wire bonding technology. Flip chip technology eliminates the need for wire bonding by redistributing the bond pads over the entire surface of the die. Instead of wires, the die is attached to the substrate utilizing a direct solder connection. Although several steps and processes are eliminated when utilizing flip chip technology, there are several new problems that must be overcome. The main issue is the mismatch in the coefficient of thermal expansion (CTE) of the silicon die and the substrate. This mismatch will cause premature solder Joint failure. This issue can be compensated for by the use of an underfill material between the die and the substrate. Underfill helps to extend the working life of the device by providing environmental protection and structural integrity. Flux residues may interfere with the flow of underfill encapsulants causing gross solder voids and premature failure of the solder connection. Furthermore, flux residues may chemically react with the underfill polymer causing a change in its mechanical and thermal properties. As flip chip packages decrease in size, cleaning becomes more challenging. While package size continues to decrease, the total number of 1/0 continue to increase. As the I/O increases, the array density of the package increases and as the array density increases, the pitch decreases. If the pitch is decreasing, the standoff is also decreasing. This paper will present the keys to successful flip chip cleaning processes. Process parameters such as time, temperature, solvency, and impingement energy required for successful cleaning will be addressed. Flip chip packages will be cleaned and subjected to JEDEC level 3 testing, followed by accelerated stress testing. The devices will then be analyzed using acoustic microscopy and the results and conclusions reported.

• The Journal of Korean Academy of Prosthodontics
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• v.36 no.2
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• pp.336-354
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• 1998

Traditionally, many kinds of mechanical bonding techniques were used for bonding resins to the surface of the metal alloys. If there is a seperation between resin and metal junction by stress accumulation and temperature change of oral cavity, the cracks or crazing may occur, accompanied by failure of resin bonding to metal. This study was designed to compare the shear bond strength of the type IV gold alloy and Cr-Co alloy surfaces treated with various methods and thermocycling. Universal Instron (Model 1000) and scanning electron microscope (JEOL, Japan) was used to record the shear bond strength of 5 groups. Forty specimens were made for each group ; group 1 was treated with sandblasting only, group 2 was coated with V-primer after sandblasting, group 3 was coated with Metal primer, group 4 wase coated with MR Bond and group 5 was coated with silane. After treated with various methods, thermocycling was done for half of the each group. The surfaces of failed pattern were observed with SEM. The results were as follows : 1. Shear bond strength of the group 1 was lower than that of another groups in type IV gold alloys and bond strength of the group 1, 2 were lower than that of group 3, 4, 5 in Cr-Co alloys. 2. Shear bond strength of the gold alloy with resin was higher than that of Cr-Co alloy when specimens were coated with V-primer. 3. Shear bond strength of the Co-Cr alloys with resin was higher than that of gold alloys when specimens were coated with Metal primer. 4. The bond strength of all specimens did not decreased significantly after thermocycling. 5. Adhesive failures were found in group 1 and Cr-Co alloy in group 2, but adhesive and cohesive failures were found in another groups.

• Journal of Sensor Science and Technology
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• v.3 no.3
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• pp.45-53
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• 1994

A new type of Si diaphragm was fabricated using Si-wafer direct bonding and two-step electrochemical etch-stopping methods. Using the new diaphragm structure in mechanical sensors, more precise control of cavity depth and diaphragm thickness was achievable. Also, the propagation of the stress, which was generated near the bonding interface, to the surface can be avoided. Finally, a piezoresistive-type Si pressure sensor was fabricated utilizing the diaphragm and a digital pressure gauge, which can display units of pressure, was realized.

• Composites Research
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• v.26 no.2
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• pp.129-134
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• 2013

The strength of adhesive joints employed in composite structures under cryogenic environments, such as LNG tanks, is affected by thermal residual stress generated from the large temperature difference between the bonding process and the operating temperature. Aramid fibers are noted for their low coefficient of thermal expansion (CTE) and have been used to control the CTE of thermosetting resins. However, aramid composites exhibit poor adhesion between the fibers and the resin because the aramid fibers are chemically inert and contain insufficient functional groups. In this work, electrospun meta-aramid nanofiber-reinforced epoxy adhesive was fabricated to improve the interfacial bonding between the adhesive and the fibers under cryogenic temperatures. The CTE of the nanofiber-reinforced adhesives were measured, and the effect on the adhesion strength was investigated at single-lap joints under cryogenic temperatures. The fracture toughness of the adhesive joints was measured using a Double Cantilever Beam (DCB) test.

• Korean Journal of Metals and Materials
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• v.48 no.12
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• pp.1116-1122
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• 2010

Metal interconnections of multilayer Al/Ni and TiW/seed-Ni/Ni were formed on glass, and the adhesion strength and nanoindentation response of the composite layers were evaluated. The Al/Ni multilayer was formed by an anodic bonding of glass to Al and subsequent electroless plating of Ni, while the TiW/Ni multilayer was fabricated by sputter deposition of TiW and seed-Ni onto glass and electroless plating of Ni. Because of the diffusion of aluminum into glass during the anodic bonding, anodically bonded glass/Al joint exhibited greater interfacial strength than the sputtered glass/TiW one. The Al/Ni on glass also showed excellent resistance against delamination by bending deformation compared to the TiW/seed-Ni/Ni on glass. From the nanoindentation experiment of each metal layer on glass, it was found that the aluminum layer had extremely low hardness and elastic modulus similar to the glass substrate and played a beneficial role in the delamination resistance by lessening stress intensification at the joint. The indentation data of the multilayers also supported superior joint reliability of the Al/Ni to glass compared to that of the TiW/seed-Ni/Ni to glass.

• International Journal of Concrete Structures and Materials
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• v.1 no.1
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• pp.37-43
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• 2007

This paper discusses the failure mode of reinforced concrete beams strengthened with composite materials based on six experimental set-ups to determine the FRP-to-concrete bond strength. Interfacial bond behavior between concrete and CFRP plates was discussed. Shear test were performed with different concrete compressive strengths (21 MPa and 28 MPa) and different bonding length (100 mm, 150 mm, 200 mm, and 250 mm). Shear test results indicate that the effective bond length (the bond length beyond which the ultimate load does not increase) was estimated as $196{\sim}204\;mm$ through linear regression analysis. Failure mode of specimens occurred due to debonding between concrete and CFRP plates. Maximum bond stress is calculated as about $3.0{\sim}3.3\;MPa$ from the relationships between bond stress and slip. Finally, the interfacial bond-slip model between CFRP plates and concrete, which is governed debonding failure, has been estimated from shear tests. Average bond stress was about $1.86{\sim}2.04\;MPa$, the volume of slip between CFRP plate and concrete was about $1.45{\sim}1.72\;mm$, and the fracture energy was found to be about $1.35{\sim}1.71\;N/mm$.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.32 no.5
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• pp.387-395
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• 2008

Stress distribution and interfacial debonding process at the interface between a rubber mold and a powder compact were analyzed during unloading under cold isostatic pressing. The Cap model proposed by Lee and Kim was used for densification behavior of powder based on the parameters involved in the yield function of general Cap model and volumetric strain evolution. Cohesive elements incorporating a bilinear cohesive zone model were also used to simulate interfacial debonding process. The Cap model and the cohesive zone model were implemented into a finite element program (ABAQUS). Densification behavior of powder was investigated under various interface conditions between a rubber mold and a powder compact during loading. The residual tensile stress at the interface was investigated for rubber molds with various elastic moduli under perfect bonding condition. The variations of the elastic energy density of a rubber mold and the maximum principal stress of a powder compact were calculated for several interfacial strengths at the interface during unloading.