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A novel low resistivity copper diffusion joint for REBa2Cu3O7-δ tapes by thermocompression bonding in air

  • Received : 2022.09.22
  • Accepted : 2022.11.24
  • Published : 2022.12.31

Abstract

Applications of REBa2Cu3O7-δ tapes require joints with a simple manufacturing process, low resistance and good mechanical properties. In the present study, we successfully developed a copper diffusion joint between Cu-stabilized REBa2Cu3O7-δ tapes that meets the above requirements without solder simply by applying flux, heat and pressurization. After a 3 min thermocompression process at approximately 150 δ and 336 MPa in air, two tapes were directly connected between Cu stabilizers by copper diffusion, which was proven by microstructure analysis. The specific resistivity of the copper diffusion joint reached 5.8 nΩ·cm2 (resistance of 0.4 nΩ for a 306 mm splicing length) at 77 K in the self-field. The axial tensile stress reached 200 N without critical current degradation. The results show promise for the preparation of copper diffusion joints to be used in coils, attached tapes, and wire/cable terminals.

Keywords

Acknowledgement

Thanks to Dr. Huajun Liu, Dr. Fang Liu and Peng Xu from the Institute of Plasma Physics, Chinese Academy of Sciences for measuring the V-I characteristics of the joints, Jiamin Zhu and Sikan Chen from Shanghai Superconductor Technology Co., Ltd. for their guidance on the axial tensile stress test of the joints, Dr. Yue Zhao from the School of Electronics, Information and Electrical Engineering, Shanghai Jiao Tong University for helping us to understand the microstructure of REBCO tapes, and Prof. Hao Lu from the School of Materials Science and Engineering, Shanghai Jiao Tong University for guidance on investigating the microstructure of the copper diffusion joints. The authors acknowledge support from the National Natural Science Foundation of Shanghai (Project No. 20ZR1425800) and Shanghai Rising-Star Program (Project No. 20QC1401400).

References

  1. J. L. MacManus-Driscoll and S. C. Wimbush, "Processing and application of high-temperature superconducting coated conductors," Nat. Rev. Mater., vol. 6, pp. 587-604, 2021.  https://doi.org/10.1038/s41578-021-00290-3
  2. V. Selvamanickam, Y. M. Chen, X. M. Xiong, Y. Y. Y. Xie, M. Martchevski, A. Rar, Y. F. Qiao, R. M. Schmidt, A. Knoll, K. P. Lenseth, and C. S. Weber, "High Performance 2G Wires: From R&D to Pilot-Scale Manufacturing," IEEE Trans. Appl. Supercond., vol. 19, pp. 3225-3230, 2009.  https://doi.org/10.1109/TASC.2009.2018792
  3. M. P. V. Selvamanickam, "Development of RE-Ba-Cu-O superconductors in the U.S. for ultra-high field magnets," Supercond. Sci. Technol., vol. 35, pp. 043001, 2022. 
  4. K. Mizuno, M. Sugino, M. Tanaka, and M. Ogata, "Experimental Production of a Real-Scale REBCO Magnet Aimed at Its Application to Maglev," IEEE Trans. Appl. Supercond., vol. 27, pp. 3600205, 2017. 
  5. Y. Park, M. Lee, H. Ann, Y. H. Choi, and H. Lee, "A superconducting joint for GdBa2Cu3O7-d coated conductors," NPG Asia Mater., vol. 6, pp. e98, 2014. 
  6. S. Mukoyama, A. Nakai, H. Sakamoto, S. Matsumoto, G. Nishijima, M. Hamada, K. Saito, and Y. Miyoshi, "Superconducting joint of REBCO wires for MRI magnet," J Phys Conf Ser., vol. 1054, pp. 012038, 2018. 
  7. K. Ohki, T. Nagaishi, T. Kato, D. Yokoe, T. Hirayama, Y. Ikuhara, T. Ueno, K. Yamagishi, T. Takao, R. Piao, H. Maeda, and Y. Yanagisawa, "Fabrication, microstructure and persistent current measurement of an intermediate grown superconducting (iGS) joint between REBCO-coated conductors," Supercond. Sci. Technol., vol. 30, pp. 115017, 2017. 
  8. G. D. Brittles, T. Mousavi, C. R. M. Grovenor, C. Aksoy, and S. C. Speller, "Persistent current joints between technological superconductors," Supercond. Sci. Technol., vol. 28, pp. 093001, 2015. 
  9. I. V. Kulikov, M. Y. Chernykh, T. S. Krylova, D. S. Yashkin, I. A. Chernykh, and M. L. Zanaveskin, "Superconducting joint fabrication for HTS second generation GdBCO/YBCO tapes," Supercond. Sci. Technol., vol. 33, pp. 015001, 2020. 
  10. Q. Miao, J. M. Zhu, M. Cheng, Z. Zhang, Z. Y. Li, Y. Wang, J. Sheng, Z. Jin, and Z. Hong, "Fabrication and Characteristic Tests of a Novel Low-Resistance Joint Structure for YBCO CoatedConductors," IEEE Trans. Appl. Supercond., vol. 25, pp. 6600705, 2015 
  11. W. Liu, X. Y. Zhang, Y. Liu, J. Zhou, and Y. H. Zhou, "Lap Joint Characteristics of the YBCO Coated Conductors Under Axial Tension," IEEE Trans. Appl. Supercond., vol. 24, pp. 6600805, 2014. 
  12. S. D. Zhang, F. M. Li, G. Yang, S. W. Xu, Z. C. Han, Z. M. Fan, P. Jiang, and Y. M. Chen, "Enhanced Electrical and Mechanical Performances of Soldered Joint Between Copper Stabilized REBCO Superconducting Tapes," IEEE Trans. Appl. Supercond., vol. 29, pp. 8800807, 2019. 
  13. R. Tediosi, M. Alessandrini, C. Beneduce, S. Schneider, and D. Eckert, "Low Temperature and Magnetic Field Performance of Spliced Commercial YBCO CC," IEEE Trans. Appl. Supercond., vol. 22, pp. 6600804, 2012. 
  14. H. S. Shin, J. M. Kim, and M. J. Dedicatoria, "Pursuing low joint resistivity in Cu-stabilized REBa2Cu3O7-d coated conductor tapes by the ultrasonic weld-solder hybrid method," Supercond. Sci. Technol., vol. 29, pp. 015005, 2016. 
  15. Y. Tsui, E. Surrey, and D. Hampshire, "Soldered joints-an essential component of demountable high temperature superconducting fusion magnets," Supercond. Sci. Technol., vol. 29, pp. 075005, 2016. 
  16. J. Y. Kato, N. Sakai, S. Tajima, S. Miyata, M. Konishi, Y. Yamada, N. Chikumoto, K. Nakao, T. Izumi, and Y. Shiohara, "Diffusion joint of YBCO coated conductors using stabilizing silver layers," Physica C, vol. 445, pp. 686-688, 2016.  https://doi.org/10.1016/j.physc.2006.05.005
  17. J. Kato, N. Sakai, S. Miyata, M. Konishi, Y. Yamada, N. Chikumoto, K. Nakao, T. Izumi, and Y. Shiohara, "Optimization of the diffusion joint process for the Ag layers of YBCO coated conductors," Physica C, vol. 463, pp. 747-750, 2007.  https://doi.org/10.1016/j.physc.2007.02.058
  18. J. Kato, N. Sakai, S. Miyata, A. Ibi, Y. Sutoh, Y. Yamada, N. Chikumoto, K. Nakao, T. Izumi, and Y. Shiohara, "Diffusion joint using silver layer of YBCO coated conductors for applications," Physica C, vol. 468, pp. 1571-1574, 2008.  https://doi.org/10.1016/j.physc.2008.05.261
  19. D. X. Huang, H. W. Gu, H. J. Shang, T. G. Li, B. W. Xie, Q. Zou, and F. Z. Ding, "Achievement of Low-Resistivity Diffusion Joint of REBCO Coated Conductors by Improving the Interface Connection of Ag Stabilizer," IEEE Trans. Appl. Supercond., vol. 31, pp. 4600507, 2021. 
  20. X. Y. Wu, W. Wu, J. M. Zhu, T. X. Chang, Y. Zhao, Z. W. Zhang, Y. H. Pan, J. L. Zuo, Z. Y. Li, Z. Y. Hong, and Z. J. Jin, "Electromechanical Performance Study on Silver Diffusion Joints of REBCO Coated Conductors Under Axial Tensile Stress," IEEE Trans. Appl. Supercond., vol. 27, pp. 6600806, 2017. 
  21. Y. Zhao, J. M. Zhu, G. Y. Jiang, C. S. Chen, W. Wu, Z. W. Zhang, S. K. Chen, Y. M. Hong, Z. Y. Hong, Z. J. Jin, and Y. Yamada, "Progress in fabrication of second generation high temperature superconducting tape at Shanghai Superconductor Technology," Supercond. Sci. Technol., vol. 32, pp. 044004, 2019. 
  22. H. M. Zhang, H. L. Suo, L. Wang, L. Ma, J. H. Liu, Z. L. Zhang, and Q. L. Wang, "Database of the effect of stabilizer on the resistivity and thermal conductivity of 20 different commercial REBCO tapes," Supercond. Sci. Technol., vol. 35, pp. 045016, 2022. 
  23. IEC 6178-26: "Superconductivity-part 26: critical current measurement-DC critical current of REBCO composite superconductors," 2020. 
  24. J. Ma, J. M. Zhu, W. Wu, J. Sheng, Z. H. Yao, Z. Y. L, Z. Jin, and Z. Hong, "Axial Tension and Overcurrent Study on a Type of Mass-Producible Joint for ReBCO Coated Conductors," IEEE Trans. Appl. Supercond., vol. 26, pp. 8400505, 2016. 
  25. B. Rebhan and K. Hingerl, "Physical mechanisms of copper-copper wafer bonding," J. Appl. Phys., vol. 118, pp. 135301, 2015. 
  26. J. Lu, Y. Xin, B. Jarvis, and H. Y. Bai, "Oxygen out-diffusion in REBCO coated conductor due to heating," Supercond. Sci. Technol., vol. 34, pp. 075004, 2021 
  27. G. Benchabane, Z. Boumerzoug, I. Thibon, and T. Gloriant, "Recrystallization of pure copper investigated by calorimetry and microhardness," Mater. Charact., vol. 59, pp. 1425-1428, 2008.  https://doi.org/10.1016/j.matchar.2008.01.002
  28. R. M. Brick, "Structure and properties of engineering materials (McGraw-Hill College)," 1977 
  29. Y. H. Pan, W. Wu, J. Sheng, X. F. Li, F. L. Dong, M. Y. Wang, Y. Zhao, Z. W. Zhang, Z. Y. Li, Z. Huang, Z. Y. Hong, and Z. J. Jin, "An equivalent homogenized model for non-superconducting joints made by ReBCO coated conductors," Supercond. Sci. Technol., vol. 31, pp. 095004, 2018. 
  30. J. W. Ekin, "Experimental Techniques for Low-Temperature Measurements (New York: Oxford University Press)," 2006. 
  31. Hyung-Seop Shin, et al., "Joint characteristics of ultrasonic welded CC bridge joints for HTS coil applications," Supercond. Sci. Technol., vol. 33, pp. 115007, 2020.