• Journal of Welding and Joining
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• v.8 no.3
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• pp.31-38
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• 1990

The bonding mechanism and bond strength were investigated for the cold pressure welding of Al to Al, Cu to Cu and Al to Cu by upsetting. A phenomenon of bonding betweenthe metallic components has been observed by a scanning electron microscope and metallurgical microscope. A modified equation for bond strength with respect to the reduction of height shows reasonably a good agreement with the experimental data. When the values of the hardening factor and threshold deformation for the given materials could be determined, the theoretical bond strength can be calculated.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.07a
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• pp.447-450
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• 2001

Abstract-Si direct bonding(SDB) technology is very attractive for both Si-on-insulator(SOI) electric devices and MEMS applications because of its stress free structure and stability. This paper presents on pre-bonding according to HF pre-treatment conditions in Si wafer direct bonding. The characteristics of bonded sample were measured under different bonding conditions of HF concentration, and applied pressure. The bonding strength was evaluated by tensile strength method. The bonded interface and the void were analyzed by using SEM and IR camera, respectively. Components existed in the interlayer were analysed by using FT-lR. The bond strength depends on the HF pre-treatment condition before pre-bonding (Min : 2.4kgf/cm$^2$∼Max : 14.9kgf/cm$^2$).

• The Journal of the Korea Contents Association
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• v.10 no.10
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• pp.219-225
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• 2010

The bonding strength between titanium and ceramic were analyzed according to the bonding agent and the coating methods of Au and TiN respectively. The bonding strength was measured through the 3 point bending test. Consequently, the bonding strength of the special bonding agent after the TiN coated (SPTB) group was $72.20({\pm}5.25)MPa$ which was the strongest one among groups. The bonding strength of the special bonding agent treated only (SPB) group was $67.66({\pm}12.10)MPa$, the special bonding agent after the Au coating SPGB group was $46.95({\pm}12.48)MPa$ and the SP group was $43.80({\pm}5.12)MPa$. Taking these results into account, the bonding strength of the SPB group shows the same as it of the SPTB group, however, it is stronger than SP group. And the TiN coated SPTB group shows the stronger bonding strength than the Au coated SPGB group.

• Proceedings of the Korea Concrete Institute Conference
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• 1993.10a
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• pp.35-38
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• 1993

Although bonding material content of the high strength flowing concrete is very important in engineering properties, in rich mix concrete increasing the bonding material content may not follow more good properties. This study is to investigate the influence of the bonding material content affecting on the engineering properties of high strength flowing concrete, and this paper is to analyze the properties of hardened concrete. The results reveal that the strength of concrete having loss bonding material content is higher than that of concrete having more bonding material content, and that in proportion to increasing of concrete strength brittleness factors decrease, and that the static modulus of elasticity in this study is less than that in specification.

• The Journal of Korean Academy of Prosthodontics
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• v.30 no.1
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• pp.85-91
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• 1992

The purpose of this study was to evaluate the bonding strength between porcelain laminate and Ni-Cr alloy in the various surface treatments of the bonding faces. For this study the metal surface of specimens were treated : 1) etching only, 2) sandblasting only, and 3) sandblasting and etching. The porcelain laminate were made and bonded to the metal specimens with light curing composite resin cement. Instron testing machine was used to measure their bonding strength : and the result was obtained as follows : 1. The bonding strength of the double treatment of the sandblasting and etching group was higher than that of the single treatment of sandblasting or the etching group. 2. The bonding strength of the sand blasting group was higher than that of the etching group. 3. The debonding were mainly occurred between the Ni-Cr alloy and the composite resin cement.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1999.05a
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• pp.370-373
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• 1999

Si direct bonding (SDB) technology is very attractive for both Si-on-insulator(SOI) electric devices and MEMS applications because of its stress free structure and stability. This paper presents on- pre treatment conditions in Si wafer direct bonding, The paper resents on pre-bonding according to HF pre-treatment conditions in Si wafer direct bonding. The characteristics of bonded sample were measured under different bonding conditions of HF concentration, applied pressure and annealing temperature(200~ 100$0^{\circ}C$) after pre-bonding. The bonding strength was evaluated by tensile strength method. The bonded interface and the void were analyzed by using SEM and IR camera, respectively, Components existed in the interlayer were analyzed by using FT-IR. The bond strength depends on the HF pre-treatment condition before pre-bonding(Min 2.4kgf/$\textrm{cm}^2$~ Max : 14.kgf/$\textrm{cm}^2$)

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.23 no.1
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• pp.29-33
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• 2010

As the demands for the higher data transmission speed and capacity as well as integration density grow throughout the network, much works have being done in order to integrate the Electrical PCB with Optical PCB. However, one of the most troublesome problems in the commercial bonding process is to need the high temperature for the bonding. Due to the high temperature bonding process, lots of side problems are followed such as warpage and crack, etc. In this paper, we tried to develop the new bonding technology with low temperature around $100^{\circ}C$. As a result of this study, the PCB bonding technology with high bonding strength is demonstrated with the value of bonding strength from 7 to 8 MPa at the temperature of $100^{\circ}C$.

• Proceedings of the Korean Institute of Building Construction Conference
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• 2020.11a
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• pp.153-154
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• 2020

This study aims to find out the reason that tile adhesive(type III) for ceramic tile does not harden under some conditions especially high humidity even though long curing time. Bonding strength of adhesive between substrate and ceramic tile is evaluated depending on bonding conditions such as substrate kind(concrete, board), bonding material (tile adhesive, tile cement) and curing condition(humidity 50, 70%). Based on the results, this study aimed to establish the quality of tile adhesion strength under the relevant conditions.

• Journal of Technologic Dentistry
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• v.39 no.3
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• pp.153-159
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• 2017

Purpose: In this study, a corresponding porcelain coating material was applied to dental Co-Cr metal among PFM. Methods: The bonding strength of the fired specimens was measured by a three-point flexural rigidity test. SEM/EDS was used to observe the surface component of specimens. Results: First, All groups were higher than the minimum bonding strength of 25 MPa specified in ISO 9693 for dental metal-ceramics specimens. Second, The bonding strength of control group(WO) is 44.64 MPa. Experimental group DM was 35.45 MPa and DP was 31.82 MPa(P<0.05). Tukey's HSD tests results have shown that the bonding strength in control group(WO) is higher than that of experimental group(DM, DP). Third, In the case of metal - porcelain bonding strength, the application of opaque porcelain and firing were higher than those of the group treated with degassing process. Conclusion: The bonding strength was higher when the powder opaque porcelain was applied than the paste opaque porcelain.

• Journal of the Korean Society of Safety
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• v.7 no.3
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• pp.99-107
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• 1992

Weld bonding can be applied as a combined method of spot welding and adhesive to have more advantages than those. Weld bonding has many merits that enlarge the fatigue strength of spot Welding and also improve the creep of adhesive. But it has not beer proved well in the various environmental conditions. In this study, weld bonding test for fatigue properties and tensile strength is presented under such various coditions as temperatures, humidity, and etc.