• 대한설비공학회:학술대회논문집
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• 대한설비공학회 2006년도 하계학술발표대회 논문집
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• pp.1156-1161
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• 2006

This study is to evaluate the cooling performance of the Bonding type and Injection type of heat sink using three different kinds of industrial Peltier module by digital $LabView^{TM}$ measurement. Injection type of heat sink could be more efficient for the heat transfer than Bonding type, even with 30% more radiating surface area. In addition, the experimental results revealed that the sufficient power supplied was able to show the better cooling performance of Peltier module.

• Journal of Magnetics
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• 제6권2호
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• pp.73-76
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• 2001

A double rectangular spiral type inductor has been fabricated by using FeTaN films. The inductor is composed of internal coils sandwiched by magnetic layers. Characteristics of inductor performance are investigated with an emphasis on planarization of magnetic films. In the absence of the planarization process, the grating topology of the upper magnetic films over the coil arrays degrades the soft magnetic properties and the inductor performance. It also induces a longitudinal magnetic anisotropy with the easy axis aligned to the magnetic flux direction. This alignment prevents the upper magnetic films from contributing to the total induction. Glass bonding is a viable method for achieving a completely planar inductor structure. The planar inductor with glass bonding shows excellent performance: inductance of 1.1 $\mu H$, Q factor of 7 (at 5 MHz), and the current capability up to 100 mA.

• 한국음향학회지
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• 제33권2호
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• pp.102-110
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• 2014

양 전극 사이에 압전층 외에 비압전성의 접합층이 존재하는 ${\lambda}/4$ 모드 PVDF 초음파 트랜스듀서에 있어서 그 접합층이 트랜스듀서의 성능에 미치는 영향을 등가회로에 의해 해석하였다. 등가회로로서는 Kikuchi 등이 제안한 전송선로 모델[Sound of IEICE, 55-A, 331-338 (1981)]을 도입하였는데, 먼저 그 모델에 의한 해석의 타당성을 $80{\mu}m$ 두께의 PVDF 압전막이 동(Cu) 후면체에 부착되는 세 가지 경우를 가정한 KLM 모델과의 비교를 통해 검증하였다. 다음으로, 그 압전막과 더불어 $5{\mu}m{\sim}20{\mu}m$ 두께의 에폭시 접합층을 갖는 다섯 개의 트랜스듀서를 제작하여 펄스 에코 응답을 측정한 후 시뮬레이션 결과와 비교하였다. 두 결과는 서로 잘 일치하였는바, 도입한 Kikuchi 모델에 의해 접합층이 트랜스듀서의 성능에 미치는 영향을 파악할 수 있음을 알았는데, 접합층이 $20{\mu}m$일 때는 그 접합층이 없을 때에 비해 중심주파수와 대역폭은 각각 약 19.7 %, 25.0 % 감소하고, 삽입손실은 57.2 % 증가하는 것으로 나타났다.

• 한국공작기계학회논문집
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• 제18권1호
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• pp.116-121
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• 2009

Thermosonic flip chip bonding is an important technology for the electronic packaging due to its simplicity, cost effectiveness and clean and dry process. Mechanical properties of the horn and the shank, such as the natural frequency and the amplitude, have a great effect on the bonding capability of the transverse flip chip bonding system. In this research, two kinds of study are performed. The first is the new design of the clamp and the second is the effect of tolerance parameters to the performance of the system. The clamp with a bent shape is newly designed to hold the nodal point of the flip chip. The second is the effect of the design parameters on the vibration amplitude and planarity at the end of the shank. The variation of the tolerance parameters changes the amplitude and the frequency of the vibration of the shank. They, in turn, have an effect on the quantity of the plastic deformation of the gold ball bump, which determined the quality of the flip chip bonding. The tolerance parameters that give the great effect on the amplitude of the shank are determined using Taguchi's method. Error of set-up angle, the length and diameter of horn and error of the length of the shank are determined to be the parameters that have peat effect on the amplitude of the system.

• 마이크로전자및패키징학회지
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• 제28권2호
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• pp.59-64
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• 2021

차세대 반도체 기술은 이종소자 집적화(heterogeneous integration)를 이용한 시스템-인-패키징(system-inpackage, SIP) 기술로 발전하고 있고, 저온 Cu 본딩은 SIP 구조의 성능 향상과 미세 피치 배선을 위해서 매우 중요한 기술이라 하겠다. 본 연구에서는 porous한 Ag 나노막을 이용하여 Cu 표면의 산화 방지 효과와 저온 Cu 본딩의 가능성을 조사하였다. 100℃에서 200℃의 저온 영역에서 Ag가 Cu로 확산되는 것보다 Cu가 Ag로 확산되는 것이 빠르게 관찰되었고, 이는 저온에서 Ag를 이용한 Cu간의 고상 확산 본딩이 가능함을 나타내었다. 따라서 Ag 나노막을 이용한 Cu 본딩을 200℃에서 진행하였고, 본딩 계면의 전단 강도는 23.27 MPa로 측정되었다.

• Structural Engineering and Mechanics
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• 제68권4호
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• pp.485-495
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• 2018

This paper presents the results of an experimental study on the structural performance of an innovative GFRP-concrete composite beam construction, which is reinforced with longitudinal GFRP pultruded box-profile and transverse steel stirrups. GFRP perfobond (PBL) shear connectors are employed to enhance the bonding performance between the GFRP profile and the concrete portion. To investigate the shear and flexural performance of this composite system, eight specimens were designed and tested under three-point and four-point bending. The main variables were the height of the composite beam and the shear span-to-depth ratio. The test results indicated that bonding cracks did not occur at the interface between the GFRP profile and the concrete until the final stage of the test. This shows that the specimens performed well as composite beams during the test and that the GFRP PBL connectors were reliable. Based on the test results, two calculation methods were used to determine the flexural and shear capacity of the composite beams. A comparative study of the test and theoretical results suggests that the proposed methods can reasonably predict both the flexural and shear capacities of the specimens, whereas the provisions of ACI 440 are relatively conservative on both counts.

• Journal of the Korean Wood Science and Technology
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• 제38권2호
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• pp.117-123
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• 2010

The objective of this research was executed to investigate the effect of molar ratio of formaldehyde to urea and melamine (F/(U+M)) of urea-melamine-formaldehyde (UMF) resin on bonding high and low moisture content veneers. For that purpose, UMF resin types with 5 different F/(U+M) molar ratios (1.45, 1.65, 1.85, 2.05, and 2.25) synthesized were used in present study. First, their curing behavior was evaluated by differential scanning calorimetry. Second, their adhesion performance in bonding high and low moisture content veneers was evaluated by probe tack and dry and wet shear strength tests. Curing temperature and reaction enthalpy decreased with the increase of F/(U+M) molar ratio. And the dry and wet shear strengthsof plywood manufactured from low moisture content veneers were higher than thoseof plywood manufactured from high moisture content veneers. Also, the maximum initial tack force on the low moisture content veneer was higher than that on the high moisture content veneer.

• Elastomers and Composites
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• 제57권4호
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• pp.157-164
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• 2022

Representative bulletproof materials, such as aramid or ultra-high molecular weight polyethylene(UHMWPE), have excellent strength and modulus in the plane direction but are very vulnerable to forces applied in the thickness direction. This paper reports a study on the effects of reinforcement in the thickness direction when bulletproof composite fabrics are prepared to improve their performance. Aramid and UHMWPE fabrics were combined using the film-bonding, needle-punching, or stitching methods and then subjected to low-velocity projectile and ball-drop impact tests. The results of the low-velocity projectile test indicated that the backface signature(BFS) decreased by up to 29.2% in fabrics obtained via the film-bonding method. However, the weight of the film-bonded fabric increased by approximately 23% compared with that obtained by simple lamination, and the fabric stiffened on account of the binder. Flexibility, light weight for wearability, and excellent bulletproof performance are very important factors in the development of bulletproof materials. When the needle-punching method was used, the BFS increased as the fibers sustained damage by the needle. When the composite fabrics were combined by stitching, no significant difference in weight and thickness was observed, and the BFS showed similar results. When a diagonal stitching pattern was employed, the BFS decreased as the stitching density increased. By contrast, when a diamond stitching pattern was used, the fabric fibers were damaged and the BFS increased as the stitching density increased.

• Journal of the Korean Wood Science and Technology
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• 제49권2호
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• pp.107-121
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• 2021

본 연구에서는 층재 수종과 길이방향의 합판 접합방식과 접합부의 접착제 도포 여부에 따른 휨 성능 및 파괴 양상 분석을 통하여 합판을 코어로 사용한 CLT에 적합한 합판의 접합 방식을 최적화 하고자 하였다. 더글라스 퍼 층재의 경우 길이방향 접합에 의해 휨탄성계수 약 11.5% 감소, 휨강도는 접착제 도포 및 접합방식에 따라 증가 또는 감소하였다. 접착제 미도포 butt joint, 접착제 도포 half lap joint, butt joint 조건이 최적조건으로 도출 되었다. 낙엽송 층재의 경우 길이방향 접합에 의해 휨강도는 약 15%, 휨탄성계수는 약 40% 감소하였으며 접합방식에 따른 차이를 나타내지 않았다. half lab joint와 tongue & groove joint 사용 시 합판 층의 접합부에서 휨에 파괴를 1차적으로 방지해줌으로써 중층의 층재로 전달되는 하중을 감소시켜 주는 것으로 판단된다. 본 연구 결과를 통해 Ply-lam CLT 제조과정에서 낙엽송 층재를 사용하는 경우 접합방법에 따른 차이를 나타내지 않았으며 더글라스퍼 층재를 사용할 경우 butt joint와 half lap 접합 방식이 적합할 것으로 판단된다.

• 대한기계학회논문집B
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• 제32권12호
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• pp.915-923
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• 2008

The performance experiments for a microchannel printed circuit heat exchanger (PCHE) of high-performance and high-efficiency on the two technologies of micro photo-etching and diffusion bonding were performed in this study. The microchannel PCHE were experimentally investigated for Reynolds number in ranges of 100 $\sim$ 700 under various flow conditions in the hot side and the cold side. The inlet temperatures of the hot side were conducted in range of $40^{\circ}C\;{\sim}\;50^{\circ}C$ while that of the cold-side were fixed at $20^{\circ}C$. In the flow pattern, the counter flow was provided 6.8% and 10 $\sim$ 15% higher average heat transfer rate and heat transfer performance than the parallel flow, respectively. The average heat transfer rate, heat transfer performance and pressure drop increases with increasing Reynolds number in all the experiment. The increasing of inlet temperature in the experiment range has not an effect on the heat transfer performance while the pressure drop decrease slightly with that of inlet temperature. The experimental correlations to the heat transfer coefficient and pressure drop factor as a function of the Reynolds number have been suggested for the microchannel PCHE.