• 제목/요약/키워드: bending strain

검색결과 891건 처리시간 0.091초

외부 보강된 Bi-2223테이프의 가압 $LN_2$하에서 임계전류 열화거동의 굽힘변형률 의존성 (Bending strain dependence of the critical current degradation behavior in externally-reinforced Bi-2223 tapes with different hermeticity under pressurized liquid nitrogen)

  • 신형섭;디존 존얀;조전욱;하동우;오상수
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2006년도 하계학술대회 논문집 Vol.7
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    • pp.257-258
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    • 2006
  • The $I_c$ degradation behaviors of externally-reinforced Bi-2223 superconducting tapes under pressurized liquid nitrogen were investigated. Tapes with different thickness of reinforcement layers were compared and the results showed that when the bending strain was calculated at the outer surface, the tape with the thicker reinforcement showed a better bending strain tolerance of $I_c$, but when the bending strain was calculated at the outermost filament, the $I_c$ degradation behavior became identical for all tapes. $I_{c0}$ decreased with the increase of applied pressure. After depressurization to atmospheric pressure from 1 MPa, the $I_c$ was completely recovered to its initial values. Ballooning occurred after a thermal cycle.

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유연 디스플레이용 무색 투명 폴리이미드 필름의 굽힘 잔류 변형률 평가 (Evaluation of Residual Strains under Pure Bending Loading for Colorless and Optically Transparent Polyimide Film for Flexible Display)

  • 최민성;박민석;박한영;오충석
    • 반도체디스플레이기술학회지
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    • 제20권4호
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    • pp.49-54
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    • 2021
  • The display industry is transitioning from traditional rigid products such as flat panel displays to flexible or wearable ones designed to be folded or rolled. Accordingly, colorless and optically transparent polyimide (CPI) films are one of the prime candidates to substitute traditional cover glass as a passivation layer to accommodate product flexibility. However, CPI films subjected to repetitive pure bending loads inevitably entail an accumulation of residual strain that can eventually cause wrinkles or delamination in the underlying component after a certain number of static and cyclic loading. The purpose of this study is to establish an experimental method to systematically evaluate the bending residual strain of CPI films. Films were monotonically and cyclically wrapped on mandrels of various diameters to ensure a constant strain in each. After unwrapping the wound CPI film, the residual radius of curvature remaining on the film was measured and converted into residual strain. The critical radius of curvature at which residual strain does not remain was about 5 mm, and the residual strain decreased in proportion to the log time. It is expected that flexible displays can be reliably designed using the data between the applied bending strain and the residual strain.

Influences of Bending Temperature on the I$_{c}$ Degradation Behavior of Bi-2223 tapes under Bending

  • Shin Hyung Seop;Dizon John Ryan C.;Katagiri Kazumune;Kuroda Tsuneo
    • 한국초전도ㆍ저온공학회논문지
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    • 제7권2호
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    • pp.11-15
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    • 2005
  • The I$_{c}$ degradation behavior of Bi-2223 tapes bent at RT and 77K were investigated using the bending device invented by Goldacker. Test results on fixing the tape at RT and 17K showed no difference. At 17K and RT bending, the critical strain was 0.67 and 0.50$\%$, respectively, for the VAM-l tape. For the AMSC tape, it was 0.94 and 0.88$\%$, respectively. These results show that there is additional residual stress in the superconducting filaments to be bent at 17K which shifts the formation of cracks into smaller bending radii. This was proved by computational analysis based on the mixture rule of composites. For the VAM-l tape, the Ie degradation behavior using the Goldacker type device shifted to higher strain levels at about 0.5$\%$, as compared with the FRP sample holders which have a critical bending strain of about 0.24$\%$. Also, for the externally reinforced AMSC tape, Ie degradation using the Goldacker type device begins at a higher strain level, at 0.88$\%$ as compared with using FRP sample holders, at 0.74$\%$. The difference between both cases can be explained by the tensile' and thermal stresses that the tapes were subjected to during fixing (soldering) when the FRP sample holders were used.

고온 초전도 케이블용 Bi-2223 선재의 기계적 특성 (Mechanical Characteristics of Bi-2223 Wire for High-Tc Superconducting Cable)

  • 백승명;김영석;정순용;김상현
    • 한국전기전자재료학회논문지
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    • 제11권11호
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    • pp.1028-1034
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    • 1998
  • Bi-2223 superconductor is known as one of the candidates for practical superconducting wires. Ag-sheathed Bi-2223 superconducting wires were fabricated using the powder-in-tube(PIT) method. When the 19-filaments wire was immersed in liquid nitrogen(77K), maximum critical current density Jc of 62 A/$mm_2$ at 0T was achieved. The critical current density has been shown to depend on the mechanical properties such as tensile stress and bending strain in Ag-sheathed Bi-2223 superconducting wires. The tensile strain for Jc degradation onset was in the range of 0.12~0.3%. In the case of 19-filaments wire, the bending strain is estimated to be smaller than 0.3% for the reasonable Jc value. The observed degradation of the critical current density due to strain effect is inevitable and can be attributed to the formation of microcracks within the superconducting core.

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무아레 간섭계를 이용한 WB-PBGA 패키지의 온도변화 및 굽힘하중에 대한 거동해석 (Thermo-mechanical and Flexural Analysis of WB-PBGA Package Using Moire Interferometry)

  • ;주진원
    • 대한기계학회논문집A
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    • 제26권7호
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    • pp.1302-1308
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    • 2002
  • Thermo-mechanical and flexural behavior of a wire-bond plastic ball grid array (WB-PBGA) package are characterized by high sensitive moire interferometry. Moire fringe patterns are recorded and analyzed for several bending loads and temperatures. At the temperature higher than $100^{\circ}C$, the inelastic deformation in solder balls become more dominant, so that the bending of the molding compound decreases while temperature increases. The deformation caused by thermally induced bending is compared with that caused by mechanical bending. The strain results show that the solder ball located at the edge of the chip has largest shear strain by the thermal load while the maximum average shear strain by the bending moment occurs in the end solder.

슬라이드형 휴대폰 FPCB(Flexible Printed Circuit Board)의 수명예측 (Lifetime Estimation for FPCB of Slide mobile phone)

  • 최진영;장석원;곽계달
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2008년도 추계학술대회A
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    • pp.1283-1288
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    • 2008
  • The FPCB is used as the important component of the sliding mechanism of mobile phones. FPCB have been used as jumper cables(fixed wiring) in various types of circuits because of their flexibility and bending property. The dominant failure mode of the FPCB is open that was caused by fatigue. The fatigue is repeated whenever the sliding is open, so it is a mainly cause of FPCB fatigue. We examined the bending-fatigue lifetime of FPCB. we focused on observing the contact resistance degradation of FPCB of mobile phones according to different test condition of bending strain. As a result, it has proved that lifetime decreased by increasing bending strain.

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Elastic Stability of Thin-Walled Arches subjected to Uniform Bending - Linear Bending Normal Strain Distribution -

  • Ryu, Hyo-Jin;Lim, Nam-Hyoung;Lee, Chin-Ok
    • 한국방재학회 논문집
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    • 제9권2호
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    • pp.11-15
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    • 2009
  • 본 논문에서는 균일 모멘트 하중을 받는 박판 아치의 탄성 좌굴에 관한 연구를 수행하였다. 초기 곡률을 고려한 비선형 변형률-변위 관계식을 전체 포텐셜 에너지 방정식의 이차 변분에 대입하여 초기 곡률 효과를 포함하는 에너지 방정식을 유도하였다. 휨 모멘트에 의한 단면 내 법선 변형률이 선형으로 분포한다는 초기 곡률 효과에 대한 가정사항을 유도과정에 일관되게 적용하였다. 균일 모멘트 하중을 받는 아치의 휨-비틀림 좌굴하중에 관한 제차해를 제시하고 타 연구자의 결과와 비교하였다.

Simulation of Stable Cloth on Triangular Mesh via LOD-Based Bending Springs on Strain-Based Dynamics

  • Jong-Hyun Kim
    • 한국컴퓨터정보학회논문지
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    • 제28권9호
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    • pp.73-79
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    • 2023
  • 본 논문에서는 삼각형 메쉬(Triangular mesh) 기반에서 변형률 기반 동역학(Strain-based dynamics, SBD)을 안정적으로 표현할 수 있는 LOD(Level of detail)기반의 굽힘 스프링(Bending spring) 구조와 감쇠 기법에 대해 설명한다. SBD는 삼각형 메쉬의 에지 길이(Edge length) 기반의 에너지 대신 변형률(Strain)을 활용하여 탄성 에너지를 모델링한다. 하지만, 큰 외력이 발생하면 에지 기반으로 탄성 에너지를 계산하는 과정에서는 비정상적인 삼각형(Degenerate triangle)이 나타나고 이 문제는 불안정한 변형률을 계산하기 때문에 잘못된 방향으로 늘어나는 문제가 발생한다. 본 논문에서는 이 문제를 효율적으로 처리할 수 있는 LOD기반의 굽힘 스프링을 생성하고 에너지를 계산하는 방법에 대해 소개한다. 결과적으로 본 논문에서 제안하는 기법은 굽힘 스프링 기반의 SBD를 안정적이고 효율적으로 처리할 수 있기 때문에 옷감 시뮬레이션을 안정적으로 표현할 수 있다.

Response of a laterally loaded pile group due to cyclic loading in clay

  • Shi, Jiangwei;Zhang, Yuting;Chen, Long;Fu, Zhongzhi
    • Geomechanics and Engineering
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    • 제16권5호
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    • pp.463-469
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    • 2018
  • In offshore engineering, lateral cyclic loading may induce excessive lateral movement and bending strain in pile foundations. Previous studies mainly focused on deformation mechanisms of single piles due to lateral cyclic loading. In this paper, centrifuge model tests were conducted to investigate the response of a $2{\times}2$ pile group due to lateral cyclic loading in clay. After applying each loading-unloading cycle, the pile group cannot move back to its original location. It implies that residual movement and bending strain are induced in the pile group. This is because cyclic loading induces plastic deformation in the soil surrounding the piles. As the cyclic load increases from 62.5 to 375 kN, the ratio of the residual to the maximum pile head movements varies from 0.30 to 0.84. Moreover, the ratio of the residual to the maximum bending strains induced in the piles is in a range of 0.23 to 0.82. The bending strain induced in the front pile is up to 3.2 times as large as that in the rear pile. Thus, much more protection measures should be applied to the front piles to ensure the serviceability and safety of pile foundations.

Three-dimensional numerical parametric study of tunneling effects on existing pipelines

  • Shi, Jiangwei;Wang, Jinpu;Ji, Xiaojia;Liu, Huaqiang;Lu, Hu
    • Geomechanics and Engineering
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    • 제30권4호
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    • pp.383-392
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    • 2022
  • Although pipelines are composed of segmental tubes commonly connected by rubber gasket or push-in joints, current studies mainly simplified pipelines as continuous structures. Effects of joints on three-dimensional deformation mechanisms of existing pipelines due to tunnel excavation are not fully understood. By conducting three-dimensional numerical analyses, effects of pipeline burial depth, tunnel burial depth, volume loss, pipeline stiffness and joint stiffness on bending strain and joint rotation of existing pipelines are explored. By increasing pipeline burial depth or decreasing tunnel cover depth, tunneling-induced pipeline deformations are substantially increased. As tunnel volume loss varies from 0.5% to 3%, the maximum bending strains and joint rotation angles of discontinuous pipelines increase by 1.08 and 9.20 times, respectively. By increasing flexural stiffness of pipe segment, a dramatic increase in the maximum joint rotation angles is observed in discontinuous pipelines. Thus, the safety of existing discontinuous pipelines due to tunnel excavation is controlled by joint rotation rather than bending strain. By increasing joint stiffness ratio from 0.0 (i.e., completely flexible joints) to 1.0 (i.e., continuous pipelines), tunneling-induced maximum pipeline settlements decrease by 22.8%-34.7%. If a jointed pipeline is simplified as a continuous structure, tunneling-induced settlement is thus underestimated, but bending strain is grossly overestimated. Thus, joints should be directly simulated in the analysis of tunnel-soil-pipeline interaction.