• 제목/요약/키워드: array surface temperature

검색결과 97건 처리시간 0.029초

고속전단 시험을 이용한 Sn-37Pb BGA solder joints의 기계적 신뢰성 특성 평가 (Mechanical reliability of Sn-37Pb BGA solder joints with high-speed shear test)

  • 장진규;하상수;하상옥;이종근;문정탁;박재현;서원찬;정승부
    • 마이크로전자및패키징학회지
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    • 제15권4호
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    • pp.65-70
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    • 2008
  • 본 연구에서는 BGA(Ball Grid Array) 솔더 접합부에 high impact가 가해졌을 경우 접합부의 기계적 특성에 대해서 연구하였다. 시편은 ENIG(Electroless Nickel Immersion Gold) 표면 처리된 FR-4 기판 위에 직경이 500 ${\mu}m$인 Sn-37Pb 솔더볼을 BGA 방식으로 배열하고 리플로우(Reflow)를 통하여 제작하였다. HTS(High Temperature Storage) 테스트를 위해, 시편을 일정한 온도의 $120^{\circ}C$에서 250시간 동안 시효처리(Aging)를 실시하였다. 시효처리 후, 각각의 시편은 고속 전단 시험기(Dage-4000HS)를 이용하여 속도 변수는 0.01, 0.1, 1, 3 m/s로 설정하여 고속전단 시험을 실시하였다. 전단시험 후, 솔더 접합 계면과 파면을 주사전자현미경(Scanning Electron Microscope, SEM)을 통하여 관찰하였다. 솔더 접합 계면에는 $Ni_3Sn_4$의 금속간 화합물이 성장하였으며, 시효처리 후, 솔더 접합 계면에 생성된 금속간 화합물의 두께가 증가하는 것을 관찰 할 수 있었다. 전단 시험 결과, 전단 속도가 빨라짐에 따라 전단 강도값은 증가하는 경향을 나타내었다. 솔더 접합부의 파단은 전단 속도와 시효처리 시간에 따라 다양한 파괴 모드로 진행됨을 알 수 있었다. 또한, 파괴 모드는 연성파괴 형상을 보이다가 전단속도가 증가함에 따라 취성 파괴 형상으로 변하는 것을 알 수 있었다.

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차량 내 탑승자 상태 인식용 적외선 센서의 제조 및 특성 (Fabrications and Characteristics of Infrared Sensor for Passenger Conditional Detection in Vehicle)

  • 이성현;남태운
    • 한국전기전자재료학회논문지
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    • 제22권3호
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    • pp.222-229
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    • 2009
  • A noble infrared sensor was studied for passenger conditional detection in vehicle, This research relates to uncooled infrared sensors for detecting the presence, type and temperature of occupants in vehicle. It sense that the occupants purpose to control the smart airbag for safety in the case of adult or child and to control the automatic air conditioning for convenience. This paper described the design and the fabrication of microbolometers which were composed of 2 by 8 elements using the surface micromachining technology. The characteristics of the array were investigated in the spectral region of $8{\sim}12{\mu}m$. The fabricated detectors exhibited the thermal mass of $7.05{\times}10^{-9}\;J/K$, the thermal conductance of $1.03{\times}10^{-6}\;W/K$, the thermal time constant of 6.8 ms, the responsivity of $2.96{\times}10^4\;V/W$ and the detectivity of $1.01{\times}10^9\;cmHz^{1/2}/W$, at the chopper frequency of 10 Hz and the bias current of $4.4{\mu}A$. We could successfully detect the human body condition in the divided zone. As a results, we concluded that microbolometer optimized in this research could be useful for the application of passenger conditional detection in vehicle.

수중 환경용 음향 배플의 내구성 연구 (A Durability Study on the Acoustic Baffle for Underwater Environment)

  • 서영수;김동현;김진태;강명환;정우진
    • 한국소음진동공학회논문집
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    • 제26권4호
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    • pp.449-457
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    • 2016
  • Cylindrical array sensor of a surface ship to detect an enemy is normally installed in the sonar dome. Reflected signals by some structures inside the sonar dome make unwanted signals. To minimize unwanted signals, acoustic baffles are used. Acoustic baffles are hard to install and replace, so the durability of acoustic baffles is an important design parameter. To verify the durability of acoustic baffle, accelerated aging tests according to temperature and pressure were performed. Acoustic baffle specimens were made and they are tested the visual and the performance (echo reduction and transmission loss) inspection before and after aging. After the inspection, the effect of accelerated aging of the acoustic baffles were discussed.

플립칩 본딩 구조의 표면방출레이저 어레이에 대한 열 해석 (Thermal analysis of a VCSEL array with flip-chip bond design)

  • 김선훈;김태언;김상택;기현철;양명학;김효진;고항주;김회종
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2008년도 하계학술대회 논문집 Vol.9
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    • pp.415-416
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    • 2008
  • The finite element model was used to simulate the temperature distribution of a arrayed vertical-cavity surface-emitting laser (VCSEL). In this work, the dimension of AlGaAs/GaAs based VCSEL array was $50{\mu}m$ active diameter and $250{\mu}m$ pitch, and AuSn solder of 80wt%Au-20wt%Sn was included to flip-chip bond. The results of the thermal simulation will be applied to predict the thermal cross-talk in high speed parallel optical interconnects.

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200kW 급 태양광발전 어레이 표면의 냉각/세정에 대한 장기 실증 실험 (Long-Term Experiments of Cooling/Cleaning on Surface of 200-kW PV Power Array)

  • 한준선;정성대;유상필;이승수
    • 대한기계학회논문집B
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    • 제37권11호
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    • pp.971-975
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    • 2013
  • 태양광 발전은 일사량이 높을수록 발전량이 증가된다. 그러나 일사량이 높아짐에 따라 셀의 온도도 같이 증가하여 발전효율은 감소하게 된다. 일반적으로 태양광 셀(Cell) 표면의 온도를 $1^{\circ}C$ 감소시키면 약 0.5%의 발전량의 증가가 있다고 알려져 있다. 본 논문은 태양광 발전량 증가를 위해 냉각/세정 장기 실증 실험을 수행하였다. 기전력과 집광량을 높이기 위해 모듈 표면 온도를 낮추고 오염물질을 제거하는 냉각/세정 기술을 이용하였다. 실험 방법은 냉각/세정 설비가 설치된 곳과 설치되지 않은 곳의 이용률을 비교하였다. 장기 실증 시험을 결과 냉각/세정 설비의 구동으로 인한 발전량이 최소 13%에서 최대 19%까지 증가하였다.

Argo 자료를 이용한 해외어장 실시간 해황정보시스템 개발연구 (Development of Real-time Oceanographic Information System for Pelagic Fishery Based on Argo Data)

  • 양준용;석문식;서영상;정희동;허승
    • 한국환경과학회지
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    • 제17권4호
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    • pp.461-468
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    • 2008
  • Competitive power of pelagic fishery in Korea has been weakened by the domestic and international problems such as wage increase and exclusive economic zone. To make it worse, fishing fleet spends more than 80% of fishing time on searching fishing grounds. Real-time information on oceanographic data, temperature in particular, are likely to contribute to raise efficiency of fishing. However, available data obtained by satellite remote sensing, fixed buoy and drifting buoy, limited to sea surface or fixed positions. ARGO (Array for Real-time Geostrophic Oceanography), an international program, has delivered vertical profiles of temperature and salinity in the upper 2000m of the world ocean every 10 days using freely moving floats. We have developed real-time oceanographic information system for pelagic fishery based on the Argo data which has the contents of vertical profile, horizontal distribution and vertical section of temperature around fishing grounds and searched data can be download unrestrictedly. Comparison of skipjack catch with sea surface temperature and depth of $20^{\circ}C$ derived from Argo data in the West Equatorial Pacific revealed that Argo data are able to help fishing fleet to find fishing grounds and to increase catch.

액적 열전달 향상에 미치는 Dissolved 가스의 영향에 관한 연구 (Effect of Dissolved Gases on Liquid Droplet Heat Transfer Enhancement)

  • 이정호
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2003년도 춘계학술대회
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    • pp.1491-1498
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    • 2003
  • Droplet evaporation can be used to transfer large amounts of energy since heat is transferred across a thin liquid film. Spreading the drop over a larger area can enhance this heat transfer. One method of accomplishing this is to dissolve gas into the liquid. When the drop strikes the surface, a gas bubble nucleates and can grow and merge within the liquid, resulting in an increase in the droplet diameter. In this study, time and space resolved heat transfer characteristics for a single droplet striking a heated surface were experimentally investigated. The local wall heat flux and temperature measurements were provided by a novel experimental technique in which 96 individually controlled heaters were used to map the heat transfer coefficient contour on the surface. A high-speed digital video camera was used to simultaneously record images of the drop from below. The measurements to date indicate that significantly smaller droplet evaporation times can be achieved. The splat diameter was observed to increase with time just after the initial transient dies out due to the growth of the bubble, in contrast to a monotonically decreasing splat diameter for the case of no bubbles. Bursting of the bubble corresponded to a sudden decrease in droplet heat transfer.

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채널 유동장 내에 배열된 전자부품의 강제대류 냉각 특성에 관한 연구(I) -채널과 발열부품의 높이 비(H/B)의 영향(히트싱크가 부착되지 않은 경우)- (Cooling Characteristics on the Forced Convection of an Array of Electronic Components in Channel Flow (I) - The Effect of H/B (without the Heat Sink) -)

  • 김광수;양장식
    • 설비공학논문집
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    • 제18권1호
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    • pp.73-80
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    • 2006
  • Present study is concerned with an experimental study on the cooling characteristics of heat-generating components arranged in channels which are made by printed circuit boards. To assess the thermal performance of the heat-generating components arranged by $5\times11$ in flow channel, three variables are used: the velocity of the fluid at the entrance, the height of channel, and row number of the component. The cooling characteristics of the heat-generating components such as the surface temperature rise, the adiabatic temperature rise, the adiabatic heat transfer coefficient, and the effect of thermal wake are compared with the result of the experiment and the numerical analysis. Based on the experiment analysis, some conclusions can be drawn: First of all, the experiment and numerical analysis are identical comparatively; the heat transfer coefficient increases as H/B decreases. Howeve., when H/B is over 7.2, the effect of H/B is rather trivial. The effect is the biggest at the first component from the entrance, and it decreases until the fully developed flow, where it becomes very consistent. The thermal wake function calculated for each row decreases as H/B increases.

채널 유동장 내에 배열된 전자부품의 강제대류 냉각특성에 관한 연구(II) -레이놀즈 수의 영향(히트싱크가 부착되지 않은 경우)- (Cooling Characteristics on the Forced Convection of an Array of Electronic Components in Channel Flow (II) - The Effect of the Reynolds Number (without the Heat Sink) -)

  • 김광수;양장식
    • 설비공학논문집
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    • 제18권6호
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    • pp.509-517
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    • 2006
  • Present study is concerned with an experimental study on the cooling characteristics of heat-generating components arranged in channels which are made by printed circuit boards. To estimate the thermal performance of the heat-generating components arranged by $5\times11$ in channel flow, three variables are used: the inlet velocity, the height of channel, and row number of the component. The cooling characteristics of the heat-generating components such as the surface temperature rise, the adiabatic temperature rise, the adiabatic heat transfer coefficient, and the effect of thermal wake are compared with the result of the experiment and the numerical analysis. The experimental result is in a good agreement with the numerical analysis. The heat transfer coefficient increases as the Reynolds number increases, while the thermal wake function calculated for each row decreases as the Reynolds number increases. In addition, it is found that Nu-Re correlation equation is Identical to the previous studies, and the empirical correlation equation between the thermal wake function and Re is presented.

평판형 태양열 집열기의 각도에 따른 집열성능 연구 (Study on the Heat Collecting Performance of Flat-Plate Solar Collector by the angle)

  • 지명국;공태우;배철환;정효민;정한식
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2000년도 춘계학술대회논문집B
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    • pp.316-321
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    • 2000
  • In this study, heat collecting performance was study of flat plate solar collector by the angle. A method of study on were made turn out artificial sun by the angle of 0, 15, 30 degrees. The heat performances were measured the tube array surface temperature by thermo-couple. The winter season natural condition for 4 times on the angles of various general and emboss glass at optimum distance(0.68m) calculated of between sun and solar collector. To sum up temperature rise is appear more or less that emboss glass is all the better for general glass. The temperature variable at below of 30 degree was appear very less. The maximum performance of this system at that it is tilt angle of 30 with general glass is appear Q:11.54(kcal/min) and ${\Delta}T=18.9^{\circ}C$.

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