Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)
- Volume 15 Issue 4
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- Pages.65-70
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- 2008
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- 1226-9360(pISSN)
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- 2287-7525(eISSN)
Mechanical reliability of Sn-37Pb BGA solder joints with high-speed shear test
고속전단 시험을 이용한 Sn-37Pb BGA solder joints의 기계적 신뢰성 특성 평가
- Jang, Jin-Kyu (School of Advanced Materials Science & Engineering, Sungkyunkwan University) ;
- Ha, Sang-Su (School of Advanced Materials Science & Engineering, Sungkyunkwan University) ;
- Ha, Sang-Ok (School of Advanced Materials Science & Engineering, Sungkyunkwan University) ;
- Lee, Jong-Gun (School of Advanced Materials Science & Engineering, Sungkyunkwan University) ;
- Moon, Jung-Tak (MK ELECTRON CO.,LTD) ;
- Park, Jai-Hyun (Reserach Institute of Industrial Science & Technology) ;
- Seo, Won-Chan (School of Advanced Materials Science & Engineering, Pukyong National University) ;
- Jung, Seung-Boo (School of Advanced Materials Science & Engineering, Sungkyunkwan University)
- 장진규 (성균관대학교 신소재공학부) ;
- 하상수 (성균관대학교 신소재공학부) ;
- 하상옥 (성균관대학교 신소재공학부) ;
- 이종근 (성균관대학교 신소재공학부) ;
- 문정탁 (엠케이 전자) ;
- 박재현 (포항산업과학연구원) ;
- 서원찬 (부경대학교 신소재공학부) ;
- 정승부 (성균관대학교 신소재공학부)
- Published : 2008.12.31
Abstract
The mechanical shear strength of BGA(Ball Grid Array) solder joints under high impact loading was investigated. The Sn-37Pb solder balls with a diameter of
본 연구에서는 BGA(Ball Grid Array) 솔더 접합부에 high impact가 가해졌을 경우 접합부의 기계적 특성에 대해서 연구하였다. 시편은 ENIG(Electroless Nickel Immersion Gold) 표면 처리된 FR-4 기판 위에 직경이 500