• Title/Summary/Keyword: array sensors

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Novel Design of 8T Ternary SRAM for Low Power Sensor System

  • Jihyeong Yun;Sunmean Kim
    • Journal of Sensor Science and Technology
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    • v.33 no.3
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    • pp.152-157
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    • 2024
  • In this study, we propose a novel 8T ternary SRAM that can process three logic values (0, 1, and 2) with only two additional transistors, compared with the conventional 6T binary SRAM. The circuit structure consists of positive and negative ternary inverters (PTI and NTI, respectively) with carbon-nanotube field-effect transistors, replacing conventional cross-coupled inverters. In logic '0' or '2,' the proposed SRAM cell operates the same way as conventional binary SRAM. For logic '1,' it works differently as storage nodes on each side retain voltages of VDD/2 and VDD, respectively, using the subthreshold current of two additional transistors. By applying the ternary system, the data capacity increases exponentially as the number of cells increases compared with the 6T binary SRAM, and the proposed design has an 18.87% data density improvement. In addition, the Synopsys HSPICE simulation validates the reduction in static power consumption by 71.4% in the array system. In addition, the static noise margins are above 222 mV, ensuring the stability of the cell operation when VDD is set to 0.9 V.

Design of a CMOS x-ray line scan sensors (CMOS x-ray 라인 스캔 센서 설계)

  • Heo, Chang-Won;Jang, Ji-Hye;Jin, Liyan;Heo, Sung-Kyn;Kim, Tae-Woo;Ha, Pan-Bong;Kim, Young-Hee
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.17 no.10
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    • pp.2369-2379
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    • 2013
  • A CMOS x-ray line scan sensor which is used in both medical imaging and non-destructive diagnosis is designed. It has a pixel array of 512 columns ${\times}$ 4 rows and a built-in DC-DC converter. The pixel circuit is newly proposed to have three binning modes such as no binning, $2{\times}2$ binning, and $4{\times}4$ binning in order to select one of pixel sizes of $100{\mu}m$, $200{\mu}m$, and $400{\mu}m$. It is designed to output a fully differential image signal which is insensitive to power supply and input common mode noises. The layout size of the designed line scan sensor with a $0.18{\mu}m$ x-ray CMOS image sensor process is $51,304{\mu}m{\times}5,945{\mu}m$.

NDT of a Nickel Coated Inconel Specimen Using by the Complex Induced Current - Magnetic Flux Leakage Method and Linearly Integrated Hall Sensor Array (복합 유도전류-누설자속법과 고밀도 홀센서배열에 의한 니켈 코팅 인코넬 시험편의 비파괴검사)

  • Jun, Jong-Woo;Lee, Jin-Yi;Park, Duk-Keun
    • Journal of the Korean Society for Nondestructive Testing
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    • v.27 no.5
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    • pp.375-382
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    • 2007
  • Nondestructive testing (NDT) by using the electromagnetic methods are useful for detecting cracks on the surface and subsurface of the metal. However, when the material contains both ferromagnetic and paramagnetic materials, it is difficult for NDT to detect and analyze cracks using this method. In addition the existence of a partial ferromagnetic material can be incorrectly characterized as a crack in the several cases. On the other hand a large crack has sometimes been misunderstood as a partially magnetized region. Inconel 600 is an important material in atomic energy plant. A nickel film is coated when a crack a appears on an Inconel substrate. Cracks are difficult to detect on the combined material of an Inconel substrate with a nickel film, which are paramagnetic and ferromagnetic material respectively. In this paper, a scan type magnetic camera, which uses a complex induced current-magnetic flux leakage (CIC-MFL) method as a magnetic source and a linearly integrated Hall sensor array (LIHaS) on a wafer as the magnetic sensors, was examined for its ability to detect cracks on the combined material. The evaluation probability of a crack is discussed. In addition the detection probability of the minimum depth was reported.

Fixed Pattern Noise Reduction in Infrared Videos Based on Joint Correction of Gain and Offset (적외선 비디오에서 Gain과 Offset 결합 보정을 통한 고정패턴잡음 제거기법)

  • Kim, Seong-Min;Bae, Yoon-Sung;Jang, Jae-Ho;Ra, Jong-Beom
    • Journal of the Institute of Electronics Engineers of Korea SP
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    • v.49 no.2
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    • pp.35-44
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    • 2012
  • Most recent infrared (IR) sensors have a focal-plane array (FPA) structure. Spatial non-uniformity of a FPA structure, however, introduces unwanted fixed pattern noise (FPN) to images. This non-uniformity correction (NUC) of a FPA can be categorized into target-based and scene-based approaches. In a target-based approach, FPN can be separated by using a uniform target such as a black body. Since the detector response randomly drifts along the time axis, however, several scene-based algorithms on the basis of a video sequence have been proposed. Among those algorithms, the state-of-the-art one based on Kalman filter uses one-directional warping for motion compensation and only compensates for offset non-uniformity of IR camera detectors. The system model using one-directional warping cannot correct the boundary region where a new scene is being introduced in the next video frame. Furthermore, offset-only correction approaches may not completely remove the FPN in images if it is considerably affected by gain non-uniformity. Therefore, for FPN reduction in IR videos, we propose a joint correction algorithm of gain and offset based on bi-directional warping. Experiment results using simulated and real IR videos show that the proposed scheme can provide better performance compared with the state-of-the art in FPN reduction.

Fabrication and Characteristics of Infrared Photodiode Using Insb Wafer with p-i-n Structure (p-i-n 구조의 InSb 웨이퍼를 이용한 적외선 광다이오드의 제조 및 그 특성)

  • Cho, Jun-Young;Kim, Jong-Seok;Son, Seung-Hyun;Lee, Jong-Hyun;Choi, Sie-Young
    • Journal of Sensor Science and Technology
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    • v.8 no.3
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    • pp.239-246
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    • 1999
  • A highly sensitive photovoltaic infrared photodiode was fabricated for detecting infrared light in $3{\sim}5\;{\mu}m$ wavelength range on InSb wafer with p-i-n structure grown by MOCVD. Silicon dioxide($SiO_2$) insulating films for the junction interface and surface of photodiode were prepared using RPCVD because InSb has low melting point and evaporation temperature. After formation of In ohmic contacts by thermal evaporation, the electrical properties of the photodiode were characterized in dark state at 77K. A product of zero-bias resistance and area($R_0A$) showed $1.56{\times}10^6\;{\Omega}{\cdot}cm^2$ that satisfied BLIP(background limited infrared photodetector) condition. When the photodiode was tested under infrared light, the normalized detectivity of about $10^{11}\;cm{\cdot}Hz^{1/2}{\cdot}W^{-1}$ was obtained. we successfully fabricated a unit cell with InSb IR array with good quantum efficiency and high detectivity.

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Analysis of Spatial Resolution Characteristics for DMC/UlatraCamXp/ADS80 Digital Aerial Image Based on Visual Method (시각적 기법에 의한 DMC/UlatraCamXp/ADS80 디지털 항공영상의 공간해상도 특성 분석)

  • Lee, Tae Yun;Lee, Jae One
    • Journal of Korean Society for Geospatial Information Science
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    • v.24 no.1
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    • pp.61-68
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    • 2016
  • Digital aerial images have been commonly used in a large scale map production owing to their excellent geometry, and high spatial and radiometric resolution in recent years. However, a quality verification process for acquired images should be preceded in order to secure the high precision and reliability of produced results. Several experimental studies to verify digital imaging systems have been vigorously researched by constructing permanent test field in abroad. On the other hand, it is urgently necessary to suggest a practical scheme for an image quality verification, because this related study and experiment are still in its early stage at home. Hence, this study aims to present an easy method to measure the spatial resolution of the image in a visual way using a portable Siemens star. The images used in the study were obtained with three different cameras, two frame array sensors of DMC, UltraCamXp and a linear array sensor of ADS80. The Siemens star target appeared in every image is extracted and then the spatial resolution of image is compared with theoretical GSD(Ground Sample Distance) by a visual method. In addition, the change of spatial resolution depending on the location of the Siemens star from image center and flight direction and cross-flight direction is also compared and analyzed. As study results, while the theoretical GSDs of images taken with each camera are about 6~9cm, the visual resolutions are 1.2~1.3 times as great as the theoretical ones.

Design and Implementation of BNN based Human Identification and Motion Classification System Using CW Radar (연속파 레이다를 활용한 이진 신경망 기반 사람 식별 및 동작 분류 시스템 설계 및 구현)

  • Kim, Kyeong-min;Kim, Seong-jin;NamKoong, Ho-jung;Jung, Yun-ho
    • Journal of Advanced Navigation Technology
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    • v.26 no.4
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    • pp.211-218
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    • 2022
  • Continuous wave (CW) radar has the advantage of reliability and accuracy compared to other sensors such as camera and lidar. In addition, binarized neural network (BNN) has a characteristic that dramatically reduces memory usage and complexity compared to other deep learning networks. Therefore, this paper proposes binarized neural network based human identification and motion classification system using CW radar. After receiving a signal from CW radar, a spectrogram is generated through a short-time Fourier transform (STFT). Based on this spectrogram, we propose an algorithm that detects whether a person approaches a radar. Also, we designed an optimized BNN model that can support the accuracy of 90.0% for human identification and 98.3% for motion classification. In order to accelerate BNN operation, we designed BNN hardware accelerator on field programmable gate array (FPGA). The accelerator was implemented with 1,030 logics, 836 registers, and 334.904 Kbit block memory, and it was confirmed that the real-time operation was possible with a total calculation time of 6 ms from inference to transferring result.

Regeneration of the Retarded Time Vector for Enhancing the Precision of Acoustic Pyrometry (온도장 측정 정밀도 향상을 위한 시간 지연 벡터의 재형성)

  • Kim, Tae-Kyoon;Ih, Jeong-Guon
    • The Journal of the Acoustical Society of Korea
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    • v.33 no.2
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    • pp.118-125
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    • 2014
  • An approximation of speed of sound in the measurement plane is essential for the inverse estimation of temperature. To this end, an inverse problem relating the measured retarded time data in between set of sensors and actuators array located on the wall is formulated. The involved transfer matrix and its coefficient vectors approximate speed of sound of the measurement plane by using the radial basis function with finite number of interpolation points deployed inside the target field. Then, the temperature field can be reconstructed by using spatial interpolation technique, which can achieve high spatial resolution with proper number of interpolation points. A large number of retarded time data of acoustic paths in between sensors and arrays are needed to obtain accurate reconstruction result. However, the shortage of interpolation points due to practical limitations can cause the decrease of spatial resolution and deterioration of the reconstruction result. In this works, a regeneration for obtaining the additional retarded time data for an arbitrary acoustic path is suggested to overcome the shortage of interpolation points. By applying the regeneration technique, many interpolation points can be deployed inside the field by increasing the number of retarded time data. As a simulation example, two rectangular duct sections having arbitrary temperature distribution are reconstructed by two different data set: measured data only, combination of measured and regenerated data. The result shows a decrease in reconstruction error by 15 % by combining the original and regenerated retarded time data.

Improvement of Signal Processing Circuit for Inspecting Cracks on the Express Train Wheel (고속 신호처리 회로에 의한 고속철도 차륜검사)

  • Hwang, Ji-Seong;Lee, Jin-Yi;Kwon, Suk-Jin
    • Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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    • 2008.05a
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    • pp.579-584
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    • 2008
  • A novel nondestructive testing (NDT) system, which is able to detect a crack with high speed and high spatial resolution, is urgently required for inspecting small cracks on express train wheels. This paper proposes an improved signal processing circuits, which uses the multiple amplifying circuits and the crack indicating pulse output system of the previous scan-type magnetic camera. Hall sensors are arrayed linearly, and the wheel is rotated with static speed in the vertical direction to sensor array direction. Each Hall voltages are amplified, converted and immediately operated by using, amplifying circuits, analog-to-digital converters and $\mu$-processor, respectively. The operated results, ${\partial}V_H/{\partial}t$, are compared with a standard value, which indicates a crack existence. If the ${\partial}V_H/{\partial}t$ is larger than standard value, the pulse signal is output, and indicates the existence of crack. The effectiveness of the novel method was verified by examine using cracks on the wheel specimen model.

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CMOS Analog-Front End for CCD Image Sensors (CCD 영상센서를 위한 CMOS 아날로그 프론트 엔드)

  • Kim, Dae-Jeong;Nam, Jeong-Kwon
    • Journal of IKEEE
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    • v.13 no.1
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    • pp.41-48
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    • 2009
  • This paper describes an implementation of the analog front end (AFE) incorporated with the image signal processing (ISP) unit in the SoC, dominating the performance of the CCD image sensor system. New schemes are exploited in the high-frequency sampling to reduce the sampling uncertainty apparently as the frequency increases, in the structure for the wide-range variable gain amplifier (VGA) capable of $0{\sim}36\;dB$ exponential gain control to meet the needed bandwidth and accuracy by adopting a new parasitic insensitive capacitor array. Moreover, the double cancellation of the black-level noise was efficiently achieved both in the analog and the digital domain. The proposed topology fabricated in a $0.35-{\mu}m$ CMOS process was proved in a full CCD camera system of 10-bit accuracy, dissipating 80 mA at 15 MHz with a 3.3 V supply voltage.

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