• Journal of Welding and Joining
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• v.23 no.6
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• pp.77-86
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• 2005

Low temperature bonding of the silicon and glass using the Spin-on Glass (SOG) has been conducted experimentally to figure out the effects of the SOG solution composition and process variables on bond strength using the Design of Experiment method. In order to achieve the high quality bond interface without rack, sufficient reaction time of the optimal SOG solution composition is needed along with proper pressure and annealing temperature. The shear strength under the optimal SOG solution composition and process condition was higher than that of conventional anodic bonding and similar to that of wafer direct bonding.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.07a
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• pp.347-350
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• 2001

A typical Mold method is to form a gate electrode, a gate oxide, and emitter tip after fabrication of mold shape using wet-etching of Si substrate. In this study, however, new Mold method using a side wall space structure is used in order to make sharper emitter tip with a gate electrode. Using LPCVD(low pressure chemical vapor deposition), a gate oxide and electrode layer are formed on a Si substrate, and then BPSG(Boro phospher silicate glass) thin film is deposited. After, the BPSG thin film is flowed into a mold as high temperature in order to form a sharp mold structure. Next TiN thin film is deposited as a emitter tip substance. The unfinished device with a glass substrate is bonded by anodic bonding techniques to transfer the emitters to a glass substrate, and Si substrate is etched using KOH-deionized water solution. Finally, we made sharp field emitter array with gate electrode on the glass substrate.

• Korean Journal of Metals and Materials
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• v.48 no.12
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• pp.1116-1122
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• 2010

Metal interconnections of multilayer Al/Ni and TiW/seed-Ni/Ni were formed on glass, and the adhesion strength and nanoindentation response of the composite layers were evaluated. The Al/Ni multilayer was formed by an anodic bonding of glass to Al and subsequent electroless plating of Ni, while the TiW/Ni multilayer was fabricated by sputter deposition of TiW and seed-Ni onto glass and electroless plating of Ni. Because of the diffusion of aluminum into glass during the anodic bonding, anodically bonded glass/Al joint exhibited greater interfacial strength than the sputtered glass/TiW one. The Al/Ni on glass also showed excellent resistance against delamination by bending deformation compared to the TiW/seed-Ni/Ni on glass. From the nanoindentation experiment of each metal layer on glass, it was found that the aluminum layer had extremely low hardness and elastic modulus similar to the glass substrate and played a beneficial role in the delamination resistance by lessening stress intensification at the joint. The indentation data of the multilayers also supported superior joint reliability of the Al/Ni to glass compared to that of the TiW/seed-Ni/Ni to glass.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.25 no.1
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• pp.11-15
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• 2001

We present the design and strength evaluation of an anodically bonded pressurized cavity array, based on the energy release rate measured from the anodically bonded plates of two dissimilar materials. From a theoretical analysis, a simple fracture mechanics model of the pressurized cavity array has been developed. The energy release rate (ERR) of the bonded cavity with an infinite bonding length has been derived in terms of cavity pressure, cavity size, bonding length, plate size and material properties. The ERR with a finite bonding length has been evaluated from the finite element analysis performed for varying cavity and plate sizes. It is found that, for an inter-cavity bonding length greater than the half of the cavity length, the bonding strength of cavity array approaches to that of the infinite plate. For a shorter bonding length, however, the bonding strength of the cavity array is monotonically decreased with the ratio of the bonding length to the cavity length. The critical ERR of 6.21J/㎡ has been measured from anodically bonded silicon-glass plates. A set of critical pressure curves has been generated for varying cavity array sizes, and a design method of the pressurized cavity array has been developed for the failure-free wafer-level packaging of MEMS devices.

• Restorative Dentistry and Endodontics
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• v.18 no.2
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• pp.469-481
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• 1993

The purpose of this study was to achieve the reduction of the galvanic current between the dental amalgam alloy and gold alloy. In order to measure the galvanic current between these two metals a prep in the size of $4{\times}13mm$ which was filled with amalgam and another prep of $4{\times}2mm$ was filled with gold alloy was made in the acrylic resin. These two preps were then connected to a 2mm diameter copper wire. Using an ammeter to measure the galvanic current, six different kinds of amalgam and gold alloy were immersed in saline solution with approximately 10mm distance between the two alloys. Chemical agents that are thought to reduce the galvanic current such as hydrazine. silver nitrate, potassium chromate, and bonding agents such as Scotch bond 2(3M) and All bond 2(Bisco) were applied to the alloy surface. Cathodic inhibitor such as hydrazine was applied to gold alloy where as anodic inhibitor such as silver nitrate and potassium chromate were applied to amalgam. Both bonding agents, Scotch bond 2(3M) and All bond 2 (Bisco), were applied to amalgam. The following results were obtained when the currency on the coated alloy surface was compared to the uncoated surface. 1. The galvanic currency went down as the time elapsed and after 30 minutes no change was detected. 2. Initial currency was higher in low copper amalgam compared to high copper amalgam. Intitial currency was the highest in low copper lathe-cut amalgam. 3. Group of gold coated with hydrazine had the most reduction in galvanic currency. 4. Group of amalgam coated with silver nitrate or potassium chromate also showed significant reduction in galvanic currency. 5. The bonding agents also helped reduce galvanic currency. 6. Of all the agents used to reduce galvanic currency, silver nitrate showed the best result.

• Bulletin of the Korean Chemical Society
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• v.33 no.8
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• pp.2499-2507
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• 2012

A novel and convenient electrochemical method has been developed for sensitive determination of melamine (MEL) using ascorbic acid (AA) as the recognition element. The working electrode employed in this method was modified with the nanocomposite of hydroxyapatite/carbon nanotubes to enhance the current signal of recognition element. The interaction between MEL and AA was investigated by fourier transform infrared spectroscopy and cyclic voltammetry, and the experimental results indicated that hydrogen bonding was formed between MEL and AA. Because of the existing hydrogen bonding and electrostatic interaction, the anodic peak current of AA was decreased obviously while the non-electroactive MEL added in. It illustrated that the MEL acted as an inhibitor to the oxidation of AA and the decreasing signals can be used to detect MEL. Under the optimal conditions, the decrease in anodic peak current of AA was proportional to the MEL concentrations ranging from 10 to 350 nM, with a detection limit of 1.5 nM. Finally this newly-proposed method was successfully employed to detect MEL in infant formula and milk, and good recovery was achieved.

• Transactions on Electrical and Electronic Materials
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• v.3 no.1
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• pp.4-8
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• 2002

The typical mold method for FED (field emission display) fabrication is used to form a gate electrode, a gate oxide layer, and emitter tip after fabrication of a mold shape using wet-etching of Si substrate. However, in this study, new mold method using a side wall space structure was developed to make sharp emitter tips with the gate electrode. In new method, gate oxide layer and gate electrode layer were deposited on a Si wafer by LPCVD (low pressure chemical vapor deposition), and then BPSG (Boro phosphor silicate glass) thin film was deposited. After then, the BPSG thin film was flowed into the mold at high temperature in order to form a sharp mold structure. TiN was deposited as an emitter tip on it. The unfinished device was bonded to a glass substrate by anodic bonding techniques. The Si wafer was etched from backside by KOH-deionized water solution. Finally, the sharp field emitter array with gate electrode on the glass substrate was formed.

• Proceedings of the KIEE Conference
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• 2007.11a
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• pp.150-151
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• 2007

We present an one-axis parallel-plate type of bulk micromachined torsional micromirror array with single crystalline silicon (SCS) fabricated on the glass substrate. Structurally, bottom electrodes (amophous silicon) in this mirror are DRIEed along the aluminum mirror patterns on SCS, which are self-aligned with mirror plates. Tracing the history of the micromirror study, we found that few papers have been published on research for uniform driving voltages based upon the tilting direction. If there is a slight misalignment during anodic bonding between top (mirror plate) and bottom electrodes, the non-uniformity of driving voltage will be led depending on two different tilting direction. This paper discusses how much the pull-in voltages can be different due to misalignment between two electrodes. Moreover, We achieve uniform pull-in voltage regardless of misalignments in photolithography and anodic-bonding between two individual layers.

• Korean Chemical Engineering Research
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• v.44 no.3
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• pp.243-247
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• 2006

MFI zeolite membranes were prepared on anodic alumina (Anodisc) as support. First, silicalite-1(${\approx}1.2{\mu}m$) seed crystals were attached to the surface of the support via chemical bonding, and the a- and b-axis oriented zeolite membranes could be synthesized on the support coated with the monolayer of the seed crystals by secondary growth hydrothermal synthesis. The zeolite membranes prepared were characterized using scanning electron microscope and analyzed by X-ray diffraction.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2012.05a
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• pp.295-295
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• 2012

The $TiO_2$ films were prepared in the $H_2SO_4$ solution containing $NH_4F$ at different anodic voltages, to compare the photocatalytic performances of titania for purification of waste water. The microstructure was characterized by a Field-emission scanning electron microscopy (FE-SEM) and X-ray diffractometry (XRD). Chemical bonding states and co-doped elements of F and N were analyzed using surface X-ray photoelectron spectroscopy (XPS). The photocatalytic activity of the co-doped $TiO_2$ films was analyzed by the degradation of aniline blue solution. From the result of diffuse reflectance absorption spectroscopy(DRS), it is indicated that the absorption edge of the F-N-codoped $TiO_2$ films shifted toward visible light area, and the photocatalytic reaction of $TiO_2$ was improved by doping an appropriate contents of F and N.