• 제목/요약/키워드: annealing.

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EBSD를 이용한 $SrTiO_3$의 입자 크기 및 입자 배향 분포 (EBSD studies of the grain size and grain orientation distribution of $SrTiO_3$)

  • 박명범;;조남희
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2006년도 하계학술대회 논문집 Vol.7
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    • pp.46-46
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    • 2006
  • $SrTiO_3$ was annealed at two different annealing times (1 h and 16 h) to investigate the annealing effect on the grain size and orientation distribution. Electron backscattered diffraction (EBSD) was used to analyze the grain size and grain orientation distributions of the $SrTiO_3$. It is possible to understand the annealing effect on the microstructure evolution, by comparing the grain size and orientation distribution of the $SrTiO_3$ as a function of annealing time.

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Effect of Post Annealing in Oxygen Ambient on the Characteristics of Indium Gallium Zinc Oxide Thin Film Transistors

  • Jeong, Seok Won
    • 한국전기전자재료학회논문지
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    • 제27권10호
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    • pp.648-652
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    • 2014
  • We have investigated the effect of electrical properties of amorphous InGaZnO thin film transistors (a-IGZO TFTs) by post thermal annealing in $O_2$ ambient. The post-annealed in $O_2$ ambient a-IGZOTFT is found to be more stable to be used for oxide-based TFT devices, and has better performance, such as the on/off current ratios, sub-threshold voltage gate swing, and, as well as reasonable threshold voltage, than others do. The interface trap density is controlled to achieve the optimum value of TFT transfer and output characteristics. The device performance is significantly affected by adjusting the annealing condition. This effect is closely related with the modulation annealing method by reducing the localized trapping carriers and defect centers at the interface or in the channel layer.

박판의 풀림 사이클이 기계적 성질에 미치는 영향 (Effect of Annealing Cycle of the Steel Sheet in the Mechanical Properties)

  • 김순경;이승수;전언찬
    • 한국정밀공학회지
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    • 제15권7호
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    • pp.69-77
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    • 1998
  • Development on the mechanical properties of steel sheet for the automobile body panel is very important in the BAF(Batch annealing furnace) annealing process. Because of the heat treatment method in the BAF, mechanical properties were decided on the heat treatment method of the coil. So, we tested on the development of mechanical properties according to heat treatment method at the annealing furnace using the In atmospheric gas($H_2$ : 75%, $N_2$ : 25%) and the HNx atmospheric gas($H_2$ : 5%, $N_2$ : 95%) We confirmed the following characteristics, mechanical properties were changed under the influence of the annealing cycle and the atmospheric gas. And, we have some result according to heat treatment method. Elongation of the mechanical properties in the HNx BAF is higher than the Ax BAF. But tensile strength and hardness is higher than the HNx BAF.

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Post Deposition Annealing Effect on the Structural, Electrical and Optical Properties of ZnO/Ag/ZnO Thin Films

  • Kim, Daeil
    • 열처리공학회지
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    • 제25권2호
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    • pp.85-89
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    • 2012
  • Transparent conductive ZnO/Ag/ZnO (ZAZ) multilayer films were deposited by Radio frequency (RF) magnetron sputtering and direct current (DC) magnetron sputtering. The effects of post deposition vacuum annealing temperature on the structural, electrical and optical properties of the ZAZ multilayer films were investigated. The thickness of ZAZ films is kept constant at ZnO 50 nm/Ag 5nm/ZnO 45 nm, while the vacuum annealing temperatures were varied from 200 and $400^{\circ}C$, respectively. As-deposited ZAZ films exhibit a sheet resistance of $6.1{\Omega}/{\Box}$ and optical transmittance of 72.7%. By increasing annealing temperature to $200^{\circ}C$, the resistivity decreased to as low as $5.3{\Omega}/{\Box}$ and optical transmittance also increased to as high as 82.1%. Post-deposition annealing of ZAZ multilayer films lead to considerably lower electrical resistivity and higher optical transparency, simultaneously by increased crystallization of the films.

어닐링처리한 Ni-50at%Al 압분체의 연소합성 거동 (Reaction Synthesis of Annealed Ni-50at%Al Powder Compact)

  • 조용재;이한영
    • 대한금속재료학회지
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    • 제49권10호
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    • pp.790-796
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    • 2011
  • To reduce the heat released during intermetallic reaction, Ni-50at%Al powder compact has been previously annealed at several conditions before the reaction. The effects of the pre-annealing conditions on the reaction synthesis process have been investigated. Experimental results show that the heat released during the reaction synthesis decreased proportionally with increase of the pre-annealing temperature and duration time. The reaction duration period was significantly increased when the intermetallics were formed in the powder compact during the pre-annealing. This was attributed to the fact that the reaction occurred by solid-state diffusion between the un-reacted elemental atoms and that the $NiAl_3$ phase formed predominantly during pre-annealing.

무전해 Ni-B 도금을 이용한 플라즈마 디스플레이 버스 전극용 확산방지막의 열처리 영향 (Effect of Heat Treatment of the Diffusion Barrier for Bus Electrode of Plasma Display by Electroless Ni-B Deposition)

  • 최재웅;황길호;홍석준;강성군
    • 한국재료학회지
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    • 제14권8호
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    • pp.552-557
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    • 2004
  • Thin Ni-B films, 1 ${\mu}m$ thick, were electrolessly deposited on Cu bus electrode fabricated by electro deposition. The purpose of these films is to encapsulate Cu electrodes for preventing Cu oxidation and to serve as a diffusion barrier against copper contamination of dielectric layer in AC-plasma display panel. The layers were heat treated at $580^{\circ}C$(baking temperature of dielectric layer) with and without pre-annealing at $300^{\circ}C$($Ni_{3}B$ formation temperature) for 30 minutes. In the layer with pre-annealing, amount of Cu diffusion was lower about 5 times than that in the layer without pre-annealing. The difference of Cu concentration could be attributed to Cu diffusion before $Ni_{3}B$ formation at grain boundaries. However, the diffusion behavior of the layer with pre-annealing was similar to that of the layer without pre-annealing after $Ni_{3}B$ formation. With increasing annealing time, Cu concentration of both layers increased due to grain growth.

The Effect of Thermal Annealing Process on Fermi-level Pinning Phenomenon in Metal-Pentacene Junctions

  • Cho, Hang-Il;Park, Jin-Hong
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2016년도 제50회 동계 정기학술대회 초록집
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    • pp.290.2-290.2
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    • 2016
  • Recently, organic thin-film transistors have been widely researched for organic light-emitting diode panels, memory devices, logic circuits for flexible display because of its virtue of mechanical flexibility, low fabrication cost, low process temperature, and large area production. In order to achieve high performance OTFTs, increase in accumulation carrier mobility is a critical factor. Post-fabrication thermal annealing process has been known as one of the methods to achieve this by improving the crystal quality of organic semiconductor materials In this paper, we researched the properties of pentacene films with X-Ray Diffraction (XRD) and Atomic Force Microscope (AFM) analyses as different annealing temperature in N2 ambient. Electrical characterization of the pentacene based thin film transistor was also conducted by transfer length method (TLM) with different annealing temperature in Al- and Ti-pentacene junctions to confirm the Fermi level pinning phenomenon. For Al- and Ti-pentacene junctions, is was found that as the surface quality of the pentacene films changed as annealing temperature increased, the hole-barrier height (h-BH) that were controlled by Fermi level pinning were effectively reduced.

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비대칭 압연과 열처리한 Cu 판의 집합조직과 소성변형비 변화 (I) (Changes of Texture and Plastic Strain Ratio of Asymmetrically Rolled and Annealed Cu Sheet (I))

  • 이철우;이동녕;김인수
    • 소성∙가공
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    • 제28권6호
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    • pp.354-360
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    • 2019
  • The plastic strain ratio is one of the factors that affect the deep drawability of metal sheets. The plastic strain ratio of fully annealed Cu sheet is low because its texture has {001}<100>. In order to improve the deep drawability of Cu sheet, it is necessary to increase the plastic strain ratio of Cu sheet. This study investigate the increase of plastic strain ratio of a Cu sheet after the first asymmetry rolling and annealing, and the second asymmetry rolling and annealing in air and Ar gas conditions. The average plastic strain ratio (Rm) was 0.951 and |ΔR| value was 1.27 in the initial Cu sheet. After the second 30.1% asymmetric rolling and annealing of Cu sheet at 1000℃ in air condition, the average plastic strain ratio (Rm) was 1.03 times higher. However, |ΔR| was 0.12 times lower than that of the initial specimen. After the second 18.8% asymmetric rolling and annealing of Cu sheet at 630℃ in Ar gas condition, the average plastic strain ratio (Rm) was 1.68 times higher and |ΔR| was 0.82 times lower than that of the initial specimen. These results are attributed to the change of the texture of Cu sheet due to the different annealing conditions.

다양한 열처리 분위기에 따른 SBT 커패시터의 강유전체 특성 (Ferroelectrical Properties of SBT Capacitors with various Annealing Atmosphere)

  • 조춘남;오용철;김진사;최운식;김충혁;박용필;홍진웅;이준웅
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2003년도 제5회 학술대회 논문집 일렉트렛트 및 응용기술연구회
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    • pp.72-76
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    • 2003
  • The $Sr_{0.7}Bi_{2.6}Ta_2O_9$(SBT) thin films are deposited on Pt-coated electrode(Pt/$TiO_2/SiO_2$/Si) using RF magnetron sputtering method. The structural and electrical properties of SBT capacitors were influenced with annealing atmosphere. In the XRD pattern, the SBT thin films in all annealed atmosphere had (105) orientation. In the SEM images, Bi-layered perovskite phase was crystallized in all annealing atmosphere and grains largely grew in oxygen annealing atmosphere. The maximum remanent polarization and the coercive electric field in oxygen annealing atmosphere are $12.40[{\mu}C/cm^2]$ and 30[kV/cm] respectively. The fatigue characteristics of SBT capacitors did not change up to $10^{10}$ switching cycles.

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다결정 실리콘 박막으로 구성된 Metal-Semiconductor-Metal 광검출기의 제조 (Metal-Semiconductor-Metal Photodetector Fabricated on Thin Polysilicon Film)

  • 이재성;최경근
    • 한국전기전자재료학회논문지
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    • 제30권5호
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    • pp.276-283
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    • 2017
  • A polysilicon-based metal-semiconductor-metal (MSM) photodetector was fabricated by means of our new methods. Its photoresponse characteristics were analyzed to see if it could be applied to a sensor system. The processes on which this study focused were an alloy-annealing process to form metal-polysilicon contacts, a post-annealing process for better light absorption of as-deposited polysilicon, and a passivation process for lowering defect density in polysilicon. When the alloy annealing was achieved at about $400^{\circ}C$, metal-polysilicon Schottky contacts sustained a stable potential barrier, decreasing the dark current. For better surface morphology of polysilicon, rapid thermal annealing (RTA) or furnace annealing at around $900^{\circ}C$ was suitable as a post-annealing process, because it supplied polysilicon layers with a smoother surface and a proper grain size for photon absorption. For the passivation of defects in polysilicon, hydrogen-ion implantation was chosen, because it is easy to implant hydrogen into the polysilicon. MSM photodetectors based on the suggested processes showed a higher sensitivity for photocurrent detection and a stable Schottky contact barrier to lower the dark current and are therefore applicable to sensor systems.