• 한국주조공학회지
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• 제29권5호
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• pp.204-212
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• 2009

The effects of addition of magnesium only and the simultaneous addition of magnesium and aluminum on the graphite morphology of the cast iron with the composition of 3.6wt.% and 2.5wt.%Si poured into shell stack mold were investigated. The nodularity and mechanical properties of the specimen with smaller cross-section were higher than those with langer one, when copper was not added. When the magnesium only was added, the nodularity was decreased with decreased residual magnesium content and the C. V, graphite was obtained with the magnesium content in the range of 0.010~0.015wt.%. When the magnesium and aluminum were added together, the nodularity was decreased with decreased residual magnesium and increased aluminum contents. When copper was added, the volume fraction of pearlite in the matrix, strength and hardness were higher and elongation was lower for specimen with smaller cross-section. The volume fraction of pearlite, strength and hardness were increased and the elongation was decreased with increased copper content for the specimen with C, V, graphite.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2014년도 추계학술대회 논문집
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• pp.75-76
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• 2014

Copper는 2차 전지 및 PCB 등 Electrical Device에 빠짐없이 들어가는 핵심 부품이다. 반도체 배선재료 또한 Aluminum에서 Copper로 대체되어 Electrical Conductivity 및 Electro-migration 문제를 해결할 수 있었다. 최근 배선의 미세화 및 전지용량 증가로 인해 보다 얇으면서, 동시에 높은 기계적 강도를 가지는 Copper Film의 필요성이 요구되고 있다.

• E2M - 전기 전자와 첨단 소재
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• 제8권3호
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• pp.340-351
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• 1995

Electrical, physical and optical properties of Aluminum(Al), Copper(Cu) thin films were investigated in order to establish the optimum sputtering parameters in Liquid Crystal Display (LCD) panel applications. DC-magnetron sputtered film on coming 7059 samples were fabricated with variations of deposition power densities, deposition pressures and substrate temperatures. Low resistivity films(AI;2.80 .mu..ohm.-cm, Cu:1.84 .mu..ohm-cm),which lower than the reported values, were obtained under sputtering parameters of power density(250W), substrate temperature(450-530.deg. C) and 5*10$\^$-3/ Torr deposition pressure. Expected columnar growth and stable grain growth of both films was observed through the Scanning Electron Microscope(SEM) micrographs. Dependency of the applicable defect-free film density upon depositon power and temperature was also characterized. Not too noticable variations in X-ray diffraction patterns were remarked under the alterations of sputtering parameters. High optical reflectivities of Al, Cu films, approximately 70-90 %, showed high degree of surface flatness.

• 자원리싸이클링
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• 제30권5호
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• pp.3-9
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• 2021

우리나라에서 연, 아연, 동, 주석, 니켈, 알루미늄 등의 베이스메탈의 수급구조는 양극화된 특성을 지니고 있다. 연, 아연, 동 등은 국내에 세계적 규모의 생산기업이 있는 반면, 주석, 니켈, 알루미늄 등은 국내 생산기업이 전무하거나, 생산량이 미비하여 내수량의 대부분을 수입에 의존하고 있다. 따라서 베이스메탈의 수입중단 또는 국내생산기업의 생산 중단 등의 공급중단에 따른 리스크에 대한 대비가 필요하다. 본 연구에서는 베이스메탈 6종(구리, 연, 아연, 알루미늄, 니켈, 주석)을 대상으로 수입중단 리스크 발생 시 대응이 필요한 물량과 시장이 대응할 수 있는 물량, 정부가 대응해야 하는 물량(전략비축)을 정량화하였다.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2003년도 추계학술대회논문집
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• pp.55-59
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• 2003

Rotor in small-medium induction motor has been usually manufactured by aluminum diecasting. In order to improve efficiency of induction motors, however, it is desirable that pure aluminum is replaced by high electrical conductivity copper alloy. For this purpose, a rotor is thixoformed with Cu-Ca alloy. Thermomechanical processing(TMP) is carried out to modify the semi-solid microstructure of the alloy and final microstructures and filling defects of thixoformed Cu- rotors are investigated. The characteristics of thixoformed Cu-rotor such as motor efficiency and torque are compared with those of Al rotor.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2003년도 하계학술대회 논문집 A
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• pp.488-490
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• 2003

As aluminum becomes more widely used in power distribution systems, so the corrosion caused by bimetallic contacts of aluminum and copper becomes more serious problem. In particular, the poor contact of the commonly used compression type bimetal connections may bring about the disastrous interruption of the power supply resulted from the increased corrosion within the joints, which is accelerated by the permeation of water and electrolyte into the interface. In this paper, the corrosion characteristics of aluminum and copper are investigated to improve the reliability of Al-Cu connectons.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2005년도 하계학술대회 논문집 Vol.6
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• pp.125-126
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• 2005

Recently semiconductor devices are required more smaller scale and more powerful performance. For smaller scale of device, multilayer structure is proposed. And, for the higher performance, interconnection material is change to copper, because copper has high EM(Electro-migration)and low resistivity. Then copper CMP process is a great role in a multilayer formation of semiconductor. Copper process is different from aluminum process. ECP process is one of the copper processes. In this paper, we focused on the defects tendency by copper thickness which filled using ECP process. we observed hump high and dishing. Conclusively, hump hight reduced at copper thickness increased Also dishing reduced.

• 한국분말재료학회지
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• 제21권5호
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• pp.343-348
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• 2014

A powder-in-sheath rolling (PSR) process utilizing a copper alloy tube was applied to a fabrication of a multi-walled carbon nanotube (CNT) reinforced aluminum matrix composite. A copper tube with an outer diameter of 30 mm and a wall thickness of 2 mm was used as a sheath material. A mixture of pure aluminum powders and CNTs with the volume contents of 1, 3, 5 vol% was filled in the tube by tap filling and then processed to 93.3% height reduction by a rolling mill. The relative density of the CNT/Al composite fabricated by the PSR decreased slightly with increasing of CNTs content, but showed high value more than 98%. The average hardness of the 5%CNT/Al composite increased more than 3 times, compared to that of unreinforced pure Al powder compaction. The hardness of the CNT/Al composites was some higher than that of the composites fabricated by PSR using SUS304 tube. Therefore, it is concluded that the type of tube affects largely on the mechanical properties of the CNT/Al composites in the PSR process.

• 비파괴검사학회지
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• 제19권5호
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• pp.340-346
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• 1999

액체/고체 경계면에 표면파가 발생할 때 나타나는 최소반사 및 후방복사 현상을 이용하여 brass와 aluminum 시편 그리고 copper/stainless steel, nickel/brass, nickel/aluminum 도금시편에 대한 표면 탄성파 속도의 주파수 의존성이 측정되었다. 측정된 속도의 분산관계는 일반화 램 표면파의 분산 특성과 잘 일치하였다. 시편들의 분산 특징에 따라 최소반사와 후방복사에 의해 결정된 속도 차이의 경향이 다르게 나타났다. 이러한 대응 관계는 두 현상의 생성 메커니즘과 군속도의 도입으로 설명되었다.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2003년도 춘계학술발표강연 및 논문개요집
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• pp.86-86
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• 2003

Copper has attracted much attention in the deep submicron ULSI metallization process as a replacement for aluminum due to its lower resistivity and higher electromigration resistance. Electroless copper deposition method is appealing because it yields conformal, high quality copper at relatively low cost and a low processing temperature. In this work, it was investigated that effect of the microstructure of the substrate on the electroless deposition. The mechanism of the nucleation and growth of the palladium nuclei during palladium activation was proposed. Electroless copper deposition on TiN barriers using glyoxylic acid as a reducing agent was also investigated to replace toxic formaldehyde. Furthermore, electroless copper deposition on TaN$\sub$x/ barriers was examined at various nitrogen flow rate during TaN$\sub$x/ deposition. Finally, it was investigated that the effect of plasma treatment of as-deposited TaN$\sub$x/ harriers on the electroless copper deposition.