• Title/Summary/Keyword: all-solution-processed electronics

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Functional Inks for Printed Electronics

  • Choi, Young-Min;Jeong, Sun-Ho
    • Proceedings of the Materials Research Society of Korea Conference
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    • 2012.05a
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    • pp.63.1-63.1
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    • 2012
  • In recent years, the functional inks for printed electronics that can be combined with a variety of printing techniques have attracted increasingly significant interest for use in low cost, large area, high performance integrated electronics and microelectronics. In particular, the development of solution-processable conductor, semiconductor and insulator materials is of great importance as such materials have decisive impacts on the electrical performance of various electronic devices, and, therefore, need to meet various requirements including solution processability, high electrical performance, and environmental stability. Semiconductor inks such as IGO, CIGS are synthesized by chemical solution method and microwave reaction method for TFT and solar cell application. Fine circuit pattern with high conductivity, which is valuable for flexible electrode for PCB and TSP devices, can be printed with highly concentrated and stabilized conductor inks such as silver and copper. Solution processed insulator such as polyimide derivatives can be use to all printed TFT device. Our research results of functional inks for printed electronics provide a recent trends and issues on this area.

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Colluders Tracing on the Collusion Codes of Multimedia Fingerprinting Codes based on BIBD (BIBD 기반의 멀티미디어 핑거프린팅 코드의 공모코드들에 대한 공모자 추적)

  • Rhee, Kang-Hyeon
    • Journal of the Institute of Electronics Engineers of Korea CI
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    • v.46 no.6
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    • pp.79-86
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    • 2009
  • In this paper, it has the performance metrics and the utility evaluation of the collusion codes about multimedia fingerprinting code based on BIBD and then the tracing algorithm of all colluders is proposed. Among the collusion codes, the bit stream of "all 0" or "all 1" are generated, also same collusion code and bit reversed code with user's fingerprinting code are generated. Thus there was occurred some problems, in which a colluder is deciding to anti-colluder or anti-colluder is deciding to colluder. In this paper, for the performance metrics and the utility evaluation of the collude codes, the experiment onto the total solution is processed by the logical collusion operation added with a partially processed averaging attack in the past papers. The proposed performance metrics and the utility evaluation about the collusion code generated from multimedia fingerprinting code based on BIBD is operated. Through the experiment, it confirmed that the ratio of colluder tracing is 100%.

Three-dimensional Gelator for All Solution-processed and Photopatterned Electronic Devices (전용액공정 전자소자 제작용 3D 가교제에 관한 연구)

  • Kim, Min Je;Cho, Jeong Ho
    • Prospectives of Industrial Chemistry
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    • v.23 no.6
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    • pp.25-36
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    • 2020
  • 용액공정을 통해 유기 전자소자를 대면적으로 제조하는 것은 다양한 장치 구성 요소(반도체, 절연체, 도체)의 패터닝 및 적층이 필요하기 때문에 매우 어려운 과제이다. 본 연구에서는 4개의 광 가교 기능기를 가지는 3차원 사면체 가교제인 (2,2-bis(((4-azido-2,3,5,6-tetrafluorobenzoyl)oxy)methyl)propane-1,3-diyl bis(4-azido-2,3,5,6-tetrafluorobenzoate) (4Bx)를 활용하여 용액공정을 기반으로 형성된 전자재료 박막을 고해상도로 패터닝 및 적층하는 기술을 개발하고, 이를 사용하여 고분자 박막 트랜지스터(PTFTs) 및 논리회로 어레이 제작을 진행하였다. 4Bx는 다양한 용액공정이 가능한 전자재료와 용매에 쉽게 혼합될 수 있으며, 자외선(UV)에 의해 가교제가 광 활성화되어 전자재료와 가교 결합을 형성할 수 있다. 4Bx는 기존의 2개의 광 가교 기능기를 갖는 가교제에 비해 높은 가교 효율로 인해 적은 양을 첨가하여도 완전하게 가교된 전자재료 박막을 형성할 수 있어 전자재료의 고유한 특성을 보존할 수 있다. 더욱이, 가교된 전자재료 박막은 화학적 내구성이 향상되어 고해상도 미세 패터닝을 할 수 있을 뿐만 아니라 용액공정을 통해 전자소자를 구성하는 전자재료의 적층이 가능하다. 4Bx의 광 가교 방법은 전용액공정을 통한 전자소자의 제작에 대한 혁신적인 방안을 제시한다.

All printed organic thin film transistors with high-resolution patterned Ag nanoparticulate electrode using non-relief pattern lithography

  • Eom, You-Hyun;Park, Sung-Kyu;Kim, Yong-Hoon;Kang, Jung-Won;Han, Jeong-In
    • 한국정보디스플레이학회:학술대회논문집
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    • 2009.10a
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    • pp.568-570
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    • 2009
  • Octadecyltrichlorosilane (OTS) self-assembled monolayer was selectively patterned by deep ultraviolet exposure, resulting in differential surface state, hydrophilic area with OTS hydrophobic surroundings. High-resolution (<10 ${\mu}m$) nanoparticulate Ag electrodes and organic semiconductors were patterned from simple dip-casting and ink-jetting on the pre-patterned hydrophilic surface, forming all solution-processed organic thin film transistors. The devices typically have shown a mobility of 0.065 $cm^2/V{\cdot}s$ and on-off current ratio of $8{\times}10^5$.

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Oxide/Organic Hybrid TFTs for Flexible Devices

  • Yang, Shin-Hyuk;Cho, Doo-Hee;KoPark, Sang-Hee;Lee, Jeong-Ik;Cheong, Woo-Seok;Yoon, Sung-Min;Ryu, Min-Ki;Byun, Chun-Won;Kwon, Oh-Sang;Cho, Kyoung-Ik;Chu, Hye-Yong;Hwang, Chi-Sun;Ahn, Taek;Choi, Yoo-Jeong;Yi, Mi-Hye;Jang, Jin
    • 한국정보디스플레이학회:학술대회논문집
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    • 2009.10a
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    • pp.393-395
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    • 2009
  • We fabricated oxide and oxide/organic hybrid TFTs on a glass substrate using the photolithography process under $200^{\circ}C$. We adopt the solution processed organic ferroelectric materials of P(VDF-TrFE) and polyimide (KSPI) insulator for 1-T structure memory and flexible device, respectively. All devices have successfully operated and showed the possibility of hybrid TFTs for the application to the flexible electronic devices.

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A flexible OTFT-OLED display using solution-processed organic dielectrics

  • Hirai, Nobukazu;Katsuhara, Mao;Yagi, Iwao;Yasuda, Ryoichi;Ushikura, Shin-Ich;Noda, Makoto;Moriwaki, Toshiki;Imaoka, Ayaka;Yoneya, Nobuhide;Yumoto, Akira;Nomoto, Kazumasa;Urabe, Tetsuo
    • 한국정보디스플레이학회:학술대회논문집
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    • 2009.10a
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    • pp.131-134
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    • 2009
  • We have developed a flexible OTFT backplane in which all the dielectrics are formed by solutionprocess in order to achieve low-cost and highthroughput manufacturing. The backplane successfully drives a flexible AM-OLED display with peak brightness of > 200 nit and the contrast ratio of > 1000:1 with great mechanical flexibility.

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Ball Grid Array Solder Void Inspection Using Mask R-CNN

  • Kim, Seung Cheol;Jeon, Ho Jeong;Hong, Sang Jeen
    • Journal of the Semiconductor & Display Technology
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    • v.20 no.2
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    • pp.126-130
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    • 2021
  • The ball grid array is one of the packaging methods that used in high density printed circuit board. Solder void defects caused by voids in the solder ball during the BGA process do not directly affect the reliability of the product, but it may accelerate the aging of the device on the PCB layer or interface surface depending on its size or location. Void inspection is important because it is related in yields with products. The most important process in the optical inspection of solder void is the segmentation process of solder and void. However, there are several segmentation algorithms for the vision inspection, it is impossible to inspect all of images ideally. When X-Ray images with poor contrast and high level of noise become difficult to perform image processing for vision inspection in terms of software programming. This paper suggests the solution to deal with the suggested problem by means of using Mask R-CNN instead of digital image processing algorithm. Mask R-CNN model can be trained with images pre-processed to increase contrast or alleviate noises. With this process, it provides more efficient system about complex object segmentation than conventional system.

A New Alternative Hole-transporting Layer to PEDOT:PSS for Realizing Highly Efficient All Solution-processable PLEDs

  • Kang, Beom-Goo;Kang, Hong-Kyu;Lee, Kwang-Hee;Lee, Chang-Lyoul;Lee, Jae-Suk
    • Proceedings of the Korean Vacuum Society Conference
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    • 2012.02a
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    • pp.362-363
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    • 2012
  • A new cross-linkable polymer, cross-linked d-PBAB, which has the triphenylamine as the hole transporting moiety and ethynyl group as the thermal cross-linker is firstly synthesized by the combination of anionic polymerization and deprotection process. The thermal cross-linking reaction was performed at $240^{\circ}C$ for 50 min and cross-linked d-PBAB layer showed smooth surface and is not soluble at organic solvent under spin-coating of emitting layer (EML). The solution-processed PLED which was fabricated with cross-linked d-PBAB as HTL showed approximately two times higher Lmax and four times higher LEmax than those obtained from PLED with PEDOT:PSS as the HTL. These result is ascribed to better ability of cross-linked d-PBAB to block electrons and to prevent exciton-quenching than those of PEDOT : PSS at the EML interface. This results strongly suggested that cross-linked d-PBAB can be a promising material to replace conventional PEDOT : PSS. It can be suspected that PLEDwith cross-linked d-PBAB would show longer lifetime compared with that of PLED with PEDOT : PSS, and thus further studies are under investigation.

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Improvement of the Positioning Accuracy of a Single Frequency Receiver Using Observables of the Dual GPS Reference Stations (이중 GPS 기준국 관측정보를 이용한 단일주파수 수신기의 측위 정확도 향상)

  • Choi, Byung-Kyu;Park, Jong-Uk;Lee, Sang-Jeong
    • Journal of Astronomy and Space Sciences
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    • v.25 no.3
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    • pp.291-298
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    • 2008
  • With the growth of civil and commercial applications, the Global Navigation Satellite System(GNSS) that provides the positioning, navigation, and timing information affects to our life. In order to meet all the requirements of civilian user, new positioning technology with the accuracy of 10cm level has been applied and the positioning accuracy is getting improved. In this study, dual coverage(DAEJ, SUWN) GPS measurements were applied to improve the positioning accuracy for GPS L1 single frequency users. We processed some GPS data obtained from the distributed test sites in the wide area over Korea Peninsula. As a result, the combined solution output using dual coverage showed more improved positioning accuracy than that of single coverage.