• Journal of Welding and Joining
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• 제19권3호
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• pp.342-347
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• 2001

Recently, adhesive-bonding technique is wifely used in manufacturing structures. Stress and strain analysis of joints are essential to design adhesive-bonded joints structure. The single-lap adhesive joint is the design dominating the range of adhesive joints. In this study, single-lap specimens with different joint dimensions were used for the tensile-shear test and finite element calculation in of order to investigate the effect of overlap length and adhesive-bonding thickness on adhesive strength and stress distribution of the joints. Consequently, it was found that overlap lap size and thickness can be important parameters of structure joints using adhesive bonding, which is effected on adhesive strength.

• 한국생산제조학회지
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• 제21권3호
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• pp.439-445
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• 2012

The stress singularity for the excess adhesive on interface of adhesively bonded joint was investigated by using the 2-dimensional elastic boundary element method (BEM). To establish a reasonable strength evaluation method and a fracture criterion for the excess adhesive of interface in adhesively bonded joint, it is necessary to evaluate fracture parameters with various bonding conditions. Under the variations of adhesively bonded thickness (h) and diameter (d) for the excess adhesive, a stress analysis was performed, and from the results, the stress singularity index (${\lambda}$) and the stress singularity factor (${\Gamma}$) were calculated. The variations have a great influences on the stress singularity for the excess adhesive of interface in adhesively bonded joint, and the ${\Gamma}$ is reduced as the "h" and "d" increase.

• 한국재난정보학회 논문집
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• 제15권2호
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• pp.259-267
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• 2019

연구목적: 본 논문에서 접착제로 접착된 원통형 랩 접합부는 피착체가 탄성이고, 접착제가 선형 점탄성이라고 가정한다. 연구방법: 피착제의 응력 분포는 유한요소법을 사용하며, 4개의 아이소파라메터 점탄성 고체 접착제를 통해 피착제에 대한 해석결과를 검증한다. 연구결과: 접착층에서의 시간에 대한 응력분포와 피착제의 두께와 탄성율이 규격화에 미치는 응력의 영향을 검토한다. 결론: 본 연구는 접착제층의 점탄성을 고려한 랩접착된 원통체의 접착제층의 응력분포에 대해서 4요소 탄성체 모델을 사용하여 수치해석을 하였다.

• Computers and Concrete
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• 제15권3호
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• pp.337-355
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• 2015

In this scientific work, an improved analytical solution for adhesive stresses in a concrete beam bonded with the FRP plate is developed by including the effect of the adherend shear deformations. The analysis is based on the deformation compatibility approach where both the shear and normal stresses are assumed to be invariant across the adhesive layer thickness. The shear stress distribution is supposed to be parabolic across the depth of the adherends in computing the adhesive shear stress and Timoshenko's beam theory is employed in predicting adhesive normal stress to consider the shear deformation. Numerical results from the present analysis are presented both to demonstrate the advantages of the present solution over existing ones and to illustrate the main characteristics of adhesive stress distributions.

• 반도체디스플레이기술학회지
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• 제17권1호
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• pp.35-39
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• 2018

This paper deals with the relaxation of singular stresses developed in an epoxy adhesive at high temperature. The interface stresses are analyzed using BEM. The adhesive employed in this study is an epoxy which can be cured at room temperature. The adhesive is assumed to be linearly viscoelastic. First, the distribution of the interface stresses developed in the adhesive layer under the uniform tensile stress has been calculated. The singular stress has been observed near the interface corner. Such singular stresses near the interface corner may cause epoxy layer separated from adherent. Second, the interfacial thermal stress has been investigated. The uniform temperature rise can relieve the stress level developed in the adhesive layer under the external loading, which can be viewed as an advantage of thermal loading. It is also obvious that temperature rise reduces the bonding strength of the adhesive layer. Experimental evaluation is required to assess a trade-off between the advantageous and deleterious effects of temperature.

• Structural Engineering and Mechanics
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• 제83권5호
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• pp.693-707
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• 2022

Bonded joints have proven their performance against conventional joining processes such as welding, riveting and bolting. The single-lap joint is the most widely used to characterize adhesive joints in tensile-shear loadings. However, the high stress concentrations in the adhesive joint due to the non-linearity of the applied loads generate a bending moment in the joint, resulting in high stresses at the adhesive edges. Geometric optimization of the bonded joint to reduce this high stress concentration prompted various researchers to perform geometric modifications of the adhesive and adherends at their free edges. Modifying both edges of the adhesive (spew) and the adherends (bevel) has proven to be an effective solution to reduce stresses at both edges and improve stress transfer at the inner part of the adhesive layer. The majority of research aimed at improving the geometry of the plate and adhesive edges has not considered the effect of temperature and water absorption in evaluating the strength of the joint. The objective of this work is to analyze, by the finite element method, the stress distribution in an adhesive joint between two 2024-T3 aluminum plates. The effects of the adhesive fillet and adherend bevel on the bonded joint stresses were taken into account. On the other hand, degradation of the mechanical properties of the adhesive following its exposure to moisture and temperature was found. The results clearly showed that the modification of the edges of the adhesive and of the bonding agent have an important role in the durability of the bond. Although the modification of the adhesive and bonding edges significantly improves the joint strength, the simultaneous exposure of the joint to temperature and moisture generates high stress concentrations in the adhesive joint that, in most cases, can easily reach the failure point of the material even at low applied stresses.

• Structural Engineering and Mechanics
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• 제88권6호
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• pp.609-623
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• 2023

The objective of this study is to investigate the distribution of von Mises stress, peeling stress, and shear stress in the adhesive layer used to bond two composite panels, considering various parameters using a three-dimensional finite element method. The stiffness of the materials and the effect of the stacking order on the amount of load transferred to the adhesive layer were examined to determine which type of laminate generates less stress at the bond line. The study analyzed six different stacking sequences, all with a common first layer in contact with the adhesive and a 0° orientation. Additionally, the impact of using hybrid composites on reducing bond line stress was investigated.

• 한국공작기계학회논문집
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• 제17권3호
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• pp.14-19
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• 2008

In the semiconductor IC(Integrated Circuit) package, the top surface of silicon chip is directly attached to the area of the leadframe with a double-sided adhesive layer, in which the base layer have the upper adhesive layer and the lower adhesive layer. The IC package structure has been known to encounter a thermo-mechanical failure mode such as delamination. This failure mode is due to the residual stress on the adhesive surface of silicon chip and leadframe in the curing-cooling process. The induced thermal stress in the curing process has an influence on the cooling residual stress on the silicon chip and leadframe. In this paper, for the minimization of the chip surface damage, the adhesive topologies on the silicon chip are studied through the finite element analysis(FEA).

• 한국추진공학회:학술대회논문집
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• 한국추진공학회 2011년도 제37회 추계학술대회논문집
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• pp.933-937
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• 2011

돔 분리형 복합재 연소관의 접합 체결부 최적의 설계 길이를 결정하기 위해 접합부 길이변화에 따른 구조해석을 수행하였다. 이때, 접착 체결부의 길이는 50mm에서 300mm의 범위를 갖는다. 무응력상태의 초기 접합부 길이대비 응력구배가 발생하는 구간의 길이를 "응력구배 길이 비"로 정의하고 이를 목적함수로 선정하였다. 구조해석 결과 접착 체결부의 길이가 200mm 이상으로 증가할 경우 응력구배 길이 비의 증가가 서서히 나타남을 확인하였다. 이는, 접착 체결부에 적용되는 2,500psi 내압에서 구조적 안전성을 확보하는 최적화된 접착 체결부의 길이가 200mm임을 의미한다.

• 대한기계학회논문집
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• 제16권10호
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• pp.1841-1852
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• 1992

본 연구에서는 Fig.1과 같이 원형튜브 형태로된 시편과 실린더 형태의 시편을 Single Lap Joint의 형태로 접착하여 접착제의 두께에 대한 정적 비틀림 강도특성을 실험하였으며, 접착제의 경화시 외부에서 가해주는 열로 인한 열 잔류응력의 영향에 대한 연구를 수행하였다. 또한 이론적인 해석과 상용 프로그램인 ANSYS를 이용하여 유한요소해석을 병형하여 실험결과와 비교 검토하였다.