• Title/Summary/Keyword: adhesive area

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Study of Consolidation of Excavated Fabric with Golden Thread (출토 금직물의 강화처리에 관한 연구)

  • Hong, Moon-Kyung;Bae, Soon-Wha;Lee, Mee-Sik
    • Journal of the Korean Society of Clothing and Textiles
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    • v.33 no.8
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    • pp.1315-1324
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    • 2009
  • This study is on the consolidation process of the conservation process of fabric with golden thread found in relics. Gold film was glued to pieces of Korean paper and satin using hide glue, which is a natural adhesive and resin Paraloid B-72, which is a liquid type adhesive. This study examines the types and concentration of the adhesives that are appropriate for consolidating gold film on fabric. The advantage of hide glue is that it is harmless to humans and has a high stability. This glue is also believed to be the closest to the adhesive that was used when the relic was originally made. Its weakness is that it is stiff and weaker than chemical glues, but after being washed with water the adhesion level increases. Therefore, hide glue is appropriate in the following instances: a) when washing after consolidation b) when the substrate of gold threads are significantly damaged, and c) when treating greater sized relics that take a longer time to work on. However, Paraloid B-72 has a better adhesion and flexibility than hide glue, but tends to spread out into a greater area, and the area where it is applied tends to absorb less water than before the application. In addition, it is noxious and can be harmful in long-term exposure. Therefore, Paraloid-72 is appropriate in the following instances: a) when consolidating the fabric after washing, and b) when working on smaller relics and consolidating smaller parts of a relic. The necessary concentration levels for consolidants for gold film are 30% for liquid type hide glue and at least 10% for Paraloid B-72 in order for the gold film to stay intact on the fabric during washing, consolidation, exhibition, and conservation.

Effects of one or two applications of all-in-one adhesive on microtensile bond strength to unground enamel (Unground enamel에 대한 all-in-one adhesive의 1회 또는 2회 적용이 미세인장 결합강도에 미치는 영향)

  • Son, Chang-Yong;Kim, Hyeon-Cheol;Hur, Bock;Park, Jeong-Kil
    • Restorative Dentistry and Endodontics
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    • v.31 no.6
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    • pp.445-451
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    • 2006
  • The purposes of this study were to compare the effects of one or two applications of all-in-one adhesives on microtensile bond strengths (${\mu}$TBS) to unground enamel and to investigate the morphological changes in enamel surfaces treated with these adhesives using a scanning electron microscopy (SEM). Twenty-five noncarious, unrestored human mandibular molars were used. The unground enamel surfaces were cleansed with pumice. The following adhesives were applied to lingual, mid-coronal surfaces according to manufacture's directions; Clearfil SE bond in SE group, Adper Prompt L-Pop$^{TM}$1 coat in LP1 group, 2 coats in LP2 group, Xeno$^{\R}$III1 coat in XN1 group, and 2 coats in XN2 group. After application of the adhesives, a hybrid light-activated resin composite was built up on the unground enamel. Each tooth was sectioned to make a cross-sectional area of approximately 1.0 mm$^2$ for each stick. The microtensile bond strength was determined. Each specimen was observed under SEM to examine the morphological changes. Data were analyzed with one-way ANOVA. The results of this study were as follows; 1. The microtensile bond strength values were; SE (19.77 ${\pm}$ 2.44 MPa), LP1 (13.88 ${\pm}$ 3.67 MPa), LP2 (14.50 ${\pm}$ 2.52 MPa), XN1 (14.42 ${\pm}$ 2.51 MPa) and XN2 (15.28 ${\pm}$ 2.79 MPa). SE was significantly higher than the other groups in bond strength (p < 0.05). All groups except SE were not significantly different in bond strength (p < 0.05). 2. All groups were characterized as shallow and irregular etching patterns.

Reliability Issue in LOC Packages

  • Lee, Seong-Min
    • Proceedings of the Materials Research Society of Korea Conference
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    • 1995.11a
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    • pp.3-3
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    • 1995
  • Plastic IC encapsulation utilizing lead on chip(LOC) die attach technique allows higher device density per unit package area, and faster current speed and easter leadframe design. Nevertheless, since the top surface of the chip is directly attached to the area of the leadframe with a double-sided adhesive tape in the LOC package, it tends to be easily damaged by the leadframe, leading to limitation in its utilization. In this work, it is detailed how the damage of the chip surface occurs, and it is influenced and improved by the LOC construct.

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Ultra-Clean Patterned Transfer of Single-Layer Graphene by Recyclable Pressure Sensitive Adhesive Films

  • Kim, Sang Jin;Lee, Bora;Choi, Yong Seok;Kim, Philip;Hone, James;Hong, Byung Hee;Bae, Sukang
    • Proceedings of the Korean Vacuum Society Conference
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    • 2016.02a
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    • pp.301.1-301.1
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    • 2016
  • We report an ultraclean, cost-effective, and easily scalable method of transferring and patterning large-area graphene using pressure sensitive adhesive films (PSAFs) at room temperature. This simple transfer is enabled by the difference in wettability and adhesion energy of graphene with respect to PSAF and a target substrate. The PSAF transferred graphene is found to be free from residues, and shows excellent charge carrier mobility as high as ${\sim}17,700cm^2/V{\cdot}s$ with less doping compared to the graphene transferred by thermal release tape (TRT) or poly(methyl methacrylate) (PMMA) as well as good uniformity over large areas. In addition, the sheet resistance of graphene transferred by recycled PSAF does not change considerably up to 4 times, which would be advantageous for more cost-effective and environmentally friendly production of large-area graphene films for practical applications.

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A Study on Correlation Peel Strength and the Efficiency of Shingled Modules According to Curing Condition of Electrically Conductive Adhesives (슁글드 모듈에서 경화조건에 따른 ECA 접합강도와 효율의 상관관계에 관한 연구)

  • Jun, Dayeong;Son, Hyoungin;Moon, Jiyeon;Cho, Seonghyeon;Kim, Sung hyun
    • Current Photovoltaic Research
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    • v.9 no.2
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    • pp.31-35
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    • 2021
  • Shingled module shows high ratio active area per total area due to more efficient packing without inactive space between cells. The module is fabricated by connecting the pre-cut cells into the string using electrically conductive adhesives (ECA). ECAs are used for electric and structural connections to fabricate the shingled modules. In this work, we investigated a correlation between ECA peel strength and the efficiency of pre-cut 5 cells module which are fabricated according to ECA interconnection conditions. The curing conditions are varied to determine whether ECA interconnection properties can affect module properties. As a result of the peel test, the highest peel strength was 1.27 N/mm in the condition of 170℃, the lowest peel strength was 0.89 N/mm in the condition of 130℃. The efficiency was almost constant regardless of the curing conditions at an average of 20%. However, the standard deviation of the fill factor increased as the adhesive strength decreased.

Study on Adhesive Properties by Hot-air Welding of Polyvinyl Chloride Waterproof Sheet Using used vinyl & used cable in Rural Area (농촌의 폐비닐과 폐전선을 활용한 폴리염화비닐 방수시트의 열풍용착에 의한 접착특성에 관한 연구)

  • Ko, Jin-Soo;Kim, Byung-Yun
    • Journal of the Korean Institute of Rural Architecture
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    • v.16 no.4
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    • pp.75-81
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    • 2014
  • In this study, we have intended to provide the related construction manuals with technical materials and to reduce the defects in the on-site construction, with reviewing the adhesive properties of joint parts according to change of temperature and speed of hot-air sealer for the products that have been made of polyvinyl chloride(PVC) materials in the single waterproof sheet. The result from the experiment is shown as following. 1) Bond strength was shown as high as the welding speed became slower. For the hot-air welding velocity with 3~6m/min, a stable bond strength has been shown in the range of the hot-air welding temperature with $175{\sim}210^{\circ}C$, while it has been shown in the range of the hot-air welding temperature with $210^{\circ}C$, when the hot-air welding velocity is between 9~12m/min. 2) If the hot-air welding temperature is lower, the adhesive strength has been shown as higher in the section where the hot-air welding velocity is low, while the adhesive strength has been also shown as higher in the section where the velocity is fast as the hot-air welding temperature becomes higher. The highest bond strength has been shown in the velocity with 3m/min for the hot-air welding temperature with $140{\pm}10^{\circ}C$, which is rather low. At $175{\pm}10^{\circ}C$, a high bond strength has been shown in the velocity with 3~6m/min, while the high bond strength has been shown in the velocity with 6~9m/min at $210{\pm}10^{\circ}C$.

Fabrication of a Superhydrophobic Surface with Adjustable Hydrophobicity and Adhesivity Based on a Silica Nanotube Array

  • Yu, Jae-Eun;Son, Sang-Jun
    • Bulletin of the Korean Chemical Society
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    • v.33 no.10
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    • pp.3378-3382
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    • 2012
  • A superhydrophobic surface with a water contact angle > $150^{\circ}$ has attracted great interest from both fundamental and practical aspects. In this study, we demonstrated that hydrophobicity of a silica nanotube (SNT) array can be easily controlled by the SNT aspect ratio. In addition, the adhesive and anti-adhesive properties were controlled without modifying the hydrophobic surface. Various silica structures on a polydimethylsiloxane substrate were prepared using the desired alumina template. Bundle-arrayed and bowl-arrayed silica surfaces exhibited extraordinary superhydrophobicity due to the large frontal surface area and hierarchical micro/nanostructure. As the strategy used in this study is biocompatible and a wide range of hydrophobicities are capable of being controlled by the SNT aspect ratio, a hydrophobic surface composed of an SNT array could be an attractive candidate for bioapplications, such as cell and protein chips.

Study on the Adhesive Properties of Polyesters Reinforcing Materials

  • Krump, H.;Hudec, I.;Cernak, M.;Janypka, P.
    • Elastomers and Composites
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    • v.37 no.3
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    • pp.192-194
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    • 2002
  • Polyester cord yarns have been treated in an atmospheric-pressure nitrogen plasma reactor in order to enhance their adhesion to rubber. A thin layer or the plasma was generated in the close vicinity of the yam surface using various types or surface discharge. To assess the effect of the plasma treatment on fiber surface properties, the cord thread/rubber matrix adhesion values measured using the untreated and threads cord threads were compared. The static and dynamic adhesion of the cord thread to rubber was characterized by using the standard Henley test. The dynamic adhesion values for the reference and plasma treated fiber were $7,3{\pm}1,2\;N$ and $83,5{\pm}3,5\;N$. The surface properties were investigated by scanning electron microscopy, infrared spectroscopy and electron spin resonance spectroscopy. It is concluded that both polar group interactions and increased surface area of the fibers are responsible for the improved adhesive strength.

Experimental Study on Bonding Properties of Reinforced Concrete with Water-Cement Ratio and Blending of Mineral Admixture (물-시멘트비 및 혼화재 혼입에 따른 철근콘크리트의 부착 특성에 관한 연구)

  • Choi, Yoon-Suk;Kim, Myung-Yu;Yang, Eun-Ik;Yi, Seong-Tae
    • Proceedings of the Korea Concrete Institute Conference
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    • 2006.05b
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    • pp.225-228
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    • 2006
  • To clarify the one body behavior of reinforcing bar and concrete, it is important to investigate bond characteristics between two materials. Bond strength is decided by applied force and interface area between reinforcing bar and concrete. And, the resultant force of chemical adhesive force, frictional force, and mechanical interaction are to be main factors. Property of concrete influences on chemical adhesive force and frictional force; bond strength is decreased by corrosion of reinforcing bar, as the result, durability is also decreased. In this study, to confirm bond characteristics with property of concrete, w/c ratio and blending of mineral admixture were selected as the main test parameters. The results obtained from this study will be used as the basic data for bond characteristics with corrosion.

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Research on Materials Characteristics of high adhesive Self Adhesion Waterproofing Material using by the Eco-friendly Resource Recycling and Resource Waste (친환경 자원재활용 재료와 폐자원을 이용한 고점착 자착식 방수시트재의 재료적 특성에 관한 실험적 연구)

  • Heo, Neung-Hoe;Choi, Eun-Gyu;Kim, Su Ryon;Kim, Jin-Sung;Lee, Jong-Yong;Oh, Sang-Keun
    • Proceedings of the Korean Institute of Building Construction Conference
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    • 2012.05a
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    • pp.291-293
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    • 2012
  • Recently, environmental pollution and global warming and greenhouse gases are increasing, because Efforts to improve are continued throughout the world. As part of the resource recycling industry has become an important research area. In the field of waterproofing industry, focus on the resource recycling is growing, due to serious resource depletion and sharp price. Therefore, in this research on the resource recycling such as reclaimed rubber and rubber waste is enable and these eco-friendly materials are applied high adhesive flexible non-exposed type self adhesion compound waterproofing material was measured eco-friendly performance and field application was evaluated.

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