• Journal of Adhesion and Interface
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• v.10 no.3
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• pp.134-140
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• 2009

The acrylic copolymers with variation in side chain were synthesized based on molecular design. Wettability and adhesion properties on the wafer surface were investigated for these acrylic copolymer pressure sensitive adhesives. Three-dimensional networks of linear acrylic copolymers were produced with epoxy-type Tetra-DX cross-linking agent. The effect of cross-linking on adhesion characteristics was investigated. The side chain of acrylic copolymer played more important role in wettability than the interfacial interaction. As the degree of cross-linking increased, both probe tack and peel strength decreased. Also, heat resistance measured by SAFT increased with cross-linking; however, it showed the deterioration when excess cross-linking agent was added.

• Polymer(Korea)
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• v.34 no.3
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• pp.226-236
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• 2010

UV irradiated acrylic pressure sensitive adhesives(PSAs) are prepared to be used for thermal pad in plasma display panel(PDP). The effect of the chemical structure of side-chain in comonomer and of crosslinking agent on wet-out property of acrylic PSAs in wide temperature range were investigated. The correlationship between viscoelastic behavior and adhesion properties, such as tack and peel strength, was also studied. The experimental results supported that wet-out and adhesion properties of acrylic PSAs were enhanced inversely proportional to side-chain length of comonomer in wide temperature range. The peel energy clearly increased in acrylic PSAs prepared by using di(ethylene glycol) dimethylacrylate (DEGDMA) for crosslinking agent. The results might be due to the difference in the glass transition temperature and viscoelastic behavior of acrylic PSAs.

• Journal of Adhesion and Interface
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• v.11 no.4
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• pp.155-161
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• 2010

A series of ethylene vinyl acetate (EVA) based hot melt adhesives containing different types and compositions of tackifier resins were prepared to investigate their rheological behavior and T-peel adhesion strength on polyurethane (PU) elastomeric sheets. C5 aliphatic hydrocarbon resin (C5 resin), C9 aromatic hydrocarbon resin (C9 resin), hydrogenated dicyclopentadiene resin ($H_2$-DCPD resin), and dicyclopentadiene and acrylic monomer copolymer resin (DCPD-acrylic resin) were used as the tackifiers for the hot melt adhesives. To determine the polarity of the tackifiers, their oxygen contents were analyzed, and the DCPDacrylic resin was found to contain an oxygen content higher than the other tackifiers. Only the DCPD-acrylic resin showed complete miscibility with EVA and the homogeneous phase of the hot melt adhesive blends at all compositions. The T-peel adhesion strength between the hot melt adhesives and polyurethane elastomeric sheets was mainly affected by the polarity of the tackifier resins in the hot melt adhesives, rather than by the storage moduli, G', of the hot melt adhesives themselves.

• Macromolecular Research
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• v.17 no.11
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• pp.879-885
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• 2009

A macroazoinitiator (MAI) containing a poly(ethylene glycol) (PEG) segment was intercalated in the gallery of sodium montmorillonite (Na-MMT). Acrylic monomers were polymerized using this MAI intercalated in Na-MMT to prepare the acrylic copolymer nanocomposite (AN), which is a multiblock copolymer composed of two segments, an acrylic copolymer and PEG intercalated in Na-MMT (Na-MMT/PEG). When AN was used to modify the reactive hot melt polyurethane adhesive (RHA), the acrylic copolymer segment and Na-MMT/PEG synergistically enhanced the initial bond strength evolution and reduced the set time, even when the amount of Na-MMT in RHA was < 1 wt%. The viscosity of RHA increased and the tensile properties of the cured RHA film decreased due to modification with AN. These variations were more evident as the Na-MMT content in AN was increased.

• Journal of Adhesion and Interface
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• v.21 no.3
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• pp.93-100
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• 2020

3D printing technology enables proper objects to be made through an additive manufacturing method, but resulting in dimension deviation of the product due to contraction phenomenon as cooling melted filament resin injected from high-temperature use environment. In this research, we studied on acrylic adhesives for 3D printer build sheet in order to fabricate high-quality products with a precise shape and to well-mount without distortion. The solvent-free UV-curable acrylic adhesive formulation was designed by adding 4-acryloylmorpholine (ACMO) with high adhesion, toughness, glass transition temperature so that adhesion properties are stable at high temperature and products are easily mounted/detached from the adhesives. The designed formulation was polymerized through two-steps using post-addition of monomers. Using this, the acrylic adhesive was coated to make a film and then analyzed using various experimental techniques. As a result, the fabricated adhesive exhibited high glass transition temperature and there was little gap in peel strength before and after thermal treatment. Moreover, it was confirmed by rheological analysis that this adhesive can provide great bonding/debonding ability without distortion. We demonstrated the fabrication of a rectangular product using a 3D printing method using our acrylic adhesive as a build sheet. Mounting ability and workability were satisfactory and dimension deviation of the product was tiny. Because the product is easily detachable from the acrylic adhesive developed here than conventional build sheets, it is expected that this will provide work convenience to users who use the 3D printer.

• Journal of the Korean Society for Precision Engineering
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• v.31 no.10
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• pp.873-879
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• 2014

UV curable adhesives with different acrylic functionalities were synthesized for temporary bonding and debonding process in 3D multi-chip packaging process. The aim is to study various factors which have an influence on UV curing. The properties and curing behaviors were investigated by gel fraction, peel strength, probe tack, and shear adhesion failure temperature. The results show that the properties and curing behaviors are dependent on not only acrylic functionalities of binders but also UV doses and coating thickness.

• Macromolecular Research
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• v.14 no.5
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• pp.517-523
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• 2006

The effects of particle content, size and shape on the thermal conductivity (k) and adhesion properties of thermally conductive, pressure-sensitive adhesives (PSAs) were investigated. The matrix resins were thermally crosslinkable, 2-ethylhexyl acrylic polyol and ultraviolet (UV)-curable, random copolymer consisting of acrylic oligomer and various acrylates. We found that k increased with increasing diameter and particle aspect ratio, and was further enhanced due to the reduction of the interfacial thermal barrier when the coupling agent, which increases the adhesion between particles and the matrix resin, was used. On the other hand, adhesion properties such as peel strength and tack of the thermally crosslinkable resin decreased sharply with increasing particle content. However, for UV curable resin, increased particle addition inhibited the decrease in adhesion properties.

• Journal of Adhesion and Interface
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• v.17 no.2
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• pp.49-55
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• 2016

In this study, we designed an environment friendly, water-based adhesive using the acrylic emulsion method as a replacement for solvent-based adhesives, which are most commonly used in layered laminates for flexible food packaging. We designed adhesives with different combinations of anionic, non-ionic, and phosphoric ester surfactants, and with different concentrations of chain transfer agent (CTA). We also examined the effect of the degree of cross-linking by synthesizing and comparing 8 test group adhesives with different types of functional monomers. Additionally, we synthesized 2 other test group pressure-sensitive adhesives (PSA) using styrene/alpha-methyl styrene/acrylic acid (SAA) semipolymer dispersing agents (with molecular weights of 13,000 g/mol and 8,600 g/mol, respectively) to replace the conventional surfactants. We evaluated whether the 10 test group pressure-sensitive adhesives met the basic physical property criteria required for flexible food packaging by carrying out a physical analysis of their glass transition temperature (Tg), particle size, adhesion, and molecular weight. In our test, 2 test group adhesives manufactured with the combination of anionic and non-ionic surfactants, CTA concentration of 0.2%, and functional monomers of hydroxyethyl acrylate (HEA) and glycidyl methacrylate (GMA) demonstrated molecular weight and flexibility suitable for flexible packaging, with low adhesiveness and small particle size.

• Journal of Adhesion and Interface
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• v.5 no.4
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• pp.1-8
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• 2004

UV-curable pressure sensitive adhesives were prepared by blending acrylic copolymer, copolymerized with butyl acrylate, acrylic acid and methyl methacrylate by solution polymerization, and trimethylolpropane triacrylate. The PSAs were evaluated by adhesion strength with varying UV dose, and also glass transition temperature ($T_g$) of PSAs were measured. When exposed on UV irradiation, the PSAs showed the decreased adhesion strength and increased $T_g$. And following UV irradiation, the PSAs did not leave any residue on wafer after peel off PSA.

• Applied Chemistry for Engineering
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• v.34 no.5
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• pp.522-528
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• 2023

In this work, adhesive tapes were prepared for the dicing process in semiconductor manufacturing. Compounds with different numbers of photoreactive groups (f = 1 to 3) were synthesized and incorporated into acrylic copolymers to formulate UV-curable acrylic adhesives. Structural confirmation of the synthesized photoreactive compounds (f = 2 or 3) was performed using nuclear magnetic resonance (NMR) spectroscopy. The introduction of the photoreactive compounds into the acrylic adhesive was accomplished by urethane reactions, and the successful synthesis of the UV-curable acrylic adhesive was verified by Fourier transform infrared (FT-IR) measurements. To evaluate the performance of the adhesive, the peel strength was evaluated before and after UV irradiation using a silicon wafer as a substrate. The adhesive exhibited high peel strength (~2000 gf/25 mm) before UV exposure, which was significantly reduced (~5 gf/25 mm) after UV exposure. Interestingly, the adhesive containing multifunctional photoreactive compounds showed the most significant reduction in peel strength. In addition, surface residue measurements by field emission scanning electron microscopy (FE-SEM) showed minimal surface residue (~0.2%) after UV exposure. Overall, these results contribute to the understanding of the behavior of UV-curable acrylic adhesives and pave the way for potential applications in semiconductor manufacturing processes.