• Economic and Environmental Geology
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• v.32 no.2
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• pp.161-167
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• 1999

Electric and electromagnetic surveys were conducted to investigate the deep structure of the Ulsan fault in Ipsil area, south of Kyeongju. On this study, especially high-frequency magnetotelluric method of electromagnetic survey in the frequency range of 10~100,000 Hz was mainly employed to study the deep subsurface configuration. High-frequency MT survey was performed at 70 points of spacing 30~50 m, making 3.8 km survey line. As a survey result, a 2-km-depth 2-D cross-section was achieved. It shows vertical and horizontal subsurface variations of resistivity values. Near-surface layer having low resistivity value becomes thicker eastward up to 800m. There is a steep low resistivity zone in the west side of survey line, and there exists two low resistivity zones dipping west in the east side of survey line. Two low resistivity zones are interpreted to be related to major movement pattern of the Ulsan fault. This suggests that major fault lines are developed on both peripheral sides of the broad fault zone.

• Journal of Surface Science and Engineering
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• v.30 no.4
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• pp.272-280
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• 1997

The Thermal Barrier Coation(TBC) to improve the that barrier and wear resistant propenrty in high temperature ofthe aircraftength between the accumlation of the aircraft engine and the automobile engine has usually the two layer structure. One is a creamic top layer for heat insulation and the other is a metal bond layer to facilitate the bond strength between the top ceramic layer and the substrate. But, the coated layers should be peeled off because of the accumulation of the thermal stress by the differance of the thermal expantion coefficient between metal and ceramics in a hrat cyclic environment. In this study, the intermediate layer by plasm spray process was introduced to reduce the thermal stress. The powders of plasm spray coating were the Yttria Stabilized Zirconia (YSZ), the Magnesia Stabillized Zirconia(MSZ) and NiCrAlY. the intermediate layer was sprayed with the powders of the bond cast for the purpose of test were executed. The high temperature wear resistance tends to decreasnceee wear and thermal shock test were exeucuted. The high temperature were resistance of the YSZ TBC is better that of the MSZ TBC. The wearrsistance tends to decrease accoring to incresing the temperature between $400^{\circ}C$to $600^{\circ}C$. The thermal shock life of the 3 layer TBC with YSZ top casting was the most outstanding thermal shock rsisstasnce. This means that the intermediate layer should play an importnat roll to alleviate the diffrerence of the thermal expansion coef frcients between metallic layer and cermics layer.

• Journal of computational fluids engineering
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• v.4 no.2
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• pp.17-30
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• 1999

The unsteady transitional boundary layer due to rotor-stator interaction was studied at two operation points, the design and one off design points. The off design point leads to lower blade loading and lower Reynolds number. A Navier-Stokes code developed in the previous study was parallelized to expedite computations. A low Reynolds number turbulence model was used to close the momentum equations. All computations show good agreement with experimental data. The wake induced transitional strip on the suction side of the stator is clearly captured at design point operation. There is no noticeable change in shape and phase angle of the wake induced strip even in the laminar sublayer. The wake induced transitional strip at off design point shows more complex structure. The wake induced transitional strip is observed only in the turbulent layer, and becomes obscure in the laminar sublayer and buffer layer. This behavior is probably consequent upon that the transition is governed by both wake induced strip and natural transition mechanism by Tollmien-Schlichting wave.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.21 no.7
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• pp.1850-1860
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• 1996

We present the results for the design ofantireflection (AR) coatings on facets of a multilayered structure waveguide device. The method, whose results agree very well with the reusults of the rigorous method in the case of a symmetric three layer structure deveice, is extended for the design of AR coatings on the facets of a multilayered structure waveguide device. the field profile in a multilayered structure waveguide necessary for the use of the extended method is obtained from the transfer matrix method. The virtual four layered structure method (VFLM) is proposed to reduce the time for the design ofAR coatings because the time for the design of AR coatings using the extended method increases as the number of layers increases. The optimum coating parameters and tolerance mapsfor two different six layered waveguide devices in Ref. [9] and [10] are obtained using the extendedmethod and the VFLM,and for the three different cases approximated as three layered waveguide devices to compare the results of each case. The results of the VFLM are similar to those of the extended methodcompared to those of the three layered structure waveguide. The main reason for the above results is that the field profile in the device calculated usingthe VFLM is similar to that calculated using the extended method compared to that for three layered structure wavegjide. We conclude that the extended method or VFLM should be used for the design of AR coatings on facets of a deice required for the facet reflectivity less than 10$^{-3}$ such as a semiconductor otical amplifier.

• Journal of Broadcast Engineering
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• v.8 no.2
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• pp.181-197
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• 2003

Notion Compensation(MC) technique using Sub-Band Coding with the hierarchical structure is efficient to estimate real motion. In the hierarchical pyramid method, low-band MC pyramid method is popular, where the upper layer estimate the glover motion and next lower layer estimate the local motion. The low-band MC pyramid scheme has two problems. First, because the quantization errors at lower layer are accumulated when using coding and quantizing, it is impossible to search the exact Motion Vector(MV) Second, because of the top-down search problem in the hierarchical structure, MV mismatch in upper layer causes serious MV in lower layer So. we propose new hierarchical MC pyramid method based on edge classification. In this Paper, we show that the performance of proposed Pass-band motion compensation pyramid technique is better than low-band motion compensation pyramid. Also, in the pyramid motion estimation, we propose initial MV estimation scheme based on the edge-pattern classification. As a result, we find that PSNR was increased.

• Journal of the Korean Institute of Telematics and Electronics D
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• v.36D no.5
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• pp.44-53
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• 1999

This paper are reported a methodology and application for extracting parasitic capacitances in a multi-level interconnect semiconductor structure by a numerical technique. To calculate the parasitic capacitances between the interconnect lines, we employed finite element method (FEM) and calculated the distrubution of electric potential in the inter-metal layer dielecric(ILD) by solving the Laplace equation. The three-dimensional multi-level interconnect structure is generated directly from two-dimensional mask layout data by specifying process sequences and dimension. An exemplary structure comprising two metal lines with a dimension of 8.0$\times$8.0$\times$5.0$\mu\textrm{m}^3/TEX>, which is embedded in three dielectric layer, was simulated to extract the parasitic capacitances. In this calculation, 1960 nodes with 8892 tetrahedra were used in ULTRA SPARC 1 workstation. The total CPU time for the simulation was 28 seconds, while the memory size of 4.4MB was required.

• Applied Microscopy
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• v.52
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• pp.13.1-13.6
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• 2022

Microscopic structure of skin in two amphibious mudskipper fish; Boleophthalmus dussumieri Valenciennes, 1837 (B. dussumeri) and Periophthalmus waltoni Koumans, 1941 (P. waltoni) were investigated in relation to their lifestyle. The general structure of skin is the same among the two species. Epidermis in B. dussumeri was thicker significantly than P. waltoni. The dermal bulges were only well developed in the skin of B. dussumeri. Mucous cells were absent in the epidermis of P. waltoni but present in B. dussumeri. Both B. dussumeri and P. waltoni have well-developed swollen middle cells as a shared epidermal feature. The thickness of the middle cell layer of the epidermis in B. dussumeri was significantly greater than in P. waltoni. Capillaries in the dorsal and ventral parts of the body are more closely distributed to the epidermal surface in P. waltoni than in B. dussumeri. The diffusion distance in the dorsal epidermis of P. waltoni was less than that in the ventral epidermis of B. dussumeri. A comparative examination of the skin of mudskipper species suggests that, due to the more terrestrial lifestyle adopted by P. waltoni, the skin contributes more to respiration.

• Proceedings of the KSME Conference
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• 2001.11b
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• pp.300-305
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• 2001

The unsteady flow structure and the related noise generation, which are caused by the separation of a two-dimensional, incompressible, laminar boundary-layer on the flat plate under the influence of local adverse pressure gradient, are numerically examined. The characteristic lines of the wall pressure are examined to understand the unsteady behavior of vortex shedding near the reattachment point of the separation bubble. Also, the generation and propagation of the vortex-induced noise in the separated boundary-layer are calculated by the method of computational aero-acoustics (CAA), and the effects of Reynolds number, Mach number and the strength of the adverse pressure gradient on the unsteady flow and noise characteristics are examined.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.19 no.2
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• pp.639-643
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• 2018

As electronic systems become smaller and more portable, the need for power conversion continues to increase. In addition, system stability must be ensured from switching noise due to power conversion efficiency and power conversion system miniaturization. Therefore, countermeasures to reduce switching noise during power conversion are essential. In this paper, a DC/DC buck converter circuit is constructed, and the characteristics of switching noise generated when changing the parts layout in a four-layer printed circuit board (PCB) structure with a reference plane are compared and analyzed. In addition, switching noise characteristics were compared and analyzed through simulations when the parts layout was different in a two-layer PCB structure from which the reference planes were removed. As a result, it was confirmed that the radiated emissions characteristic is reduced by 12dB and the conducted emissions characteristic decreased by 7dB to 8dB, according to the current return path in the four-layer PCB structure. Thus, it was confirmed that the noise characteristics can be improved according to the configuration of the current return path when the power conversion circuit is designed.

• Journal of Sensor Science and Technology
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• v.1 no.2
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• pp.131-145
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• 1992

This paper has been described a process technology for the fabrication of Si-on-insulator(SOI) transducers and circuits. The technology utilizes Si-wafer direct bonding(SDB) and mechanical-chemical(M-C) local polishing to create a SOI structure with a high-qualify, uniformly thin layer of single-crystal Si. The electrical and piezoresistive properties of the resultant thin SOI films have been investigated by SOI MOSFET's and cantilever beams, and confirmed comparable to those of bulk Si. Two kinds of pressure transducers using a SOI structure have been proposed. The shifts in sensitivity and offset voltage of the implemented pressure transducers using interfacial $SiO_{2}$ films as the dielectrical isolation layer of piezoresistors were less than -0.2% and +0.15%, respectively, in the temperature range from $-20^{\circ}C$ to $+350^{\circ}C$. In the case of pressure transducers using interfacial $SiO_{2}$ films as an etch-stop layer during the fabrication of thin Si membranes, the pressure sensitivity variation can be controlled to within a standard deviation of ${\pm}2.3%$ from wafer to wafer. From these results, the developed SDB process and the resultant SOI films will offer significant advantages in the fabrication of integrated microtransducers and circuits.