• Proceedings of the KIEE Conference
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• 1991.07a
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• pp.213-216
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• 1991

In this study, PZT powder was synthesized by coprecipitation method us ing $Pb(NO_3)2$, $ZrOCl_2{\cdot}8H_2O$ and $TiCl_4$ as starting raw materials. Homogeneous and fine-grained PZT powder was obtained by the coprecipitation method. PZT powder was characterized by DTA, SEM and XRD analysis. The XRD peaks were observed at $600(^{\circ}C)$ and over.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.07a
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• pp.709-712
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• 2001

The effects of post annealing temperature by the Rapid Thermal Annealing(RTA) on the electrical properties of Pb(Zr,Ti)O$_3$(PZT) thin film were investigated. Analyses by the RTA treatments reveled that the leakage current of PZT thin films strongly depend on heating temperature and time. It was found that leakage current properties of PZT capacitor were changed by heating temperature during the RTA annealing. On Pt/Ti/Si substrates, PZT films are deposited at 350 $^{\circ}C$ by rf magnetron sputtering. The X-ray diffusion (XRD) was confirmed the formation of PZT thin film. Leakage current characteristics were improved with decreasing the post annealing temperature of PZT thin film. RTA annealed film on the 700$^{\circ}C$ shows ferroelectric and electrical properties with a remanent polarization of 12.4${\mu}$C/$\textrm{cm}^2$ coercive field of 117kV/cm, leakage current J= 6.2${\times}$10$\^$-6/ A/$\textrm{cm}^2$

• The Transactions of the Korean Institute of Electrical Engineers P
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• v.51 no.2
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• pp.77-81
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• 2002

In this study, PZT thin films were fabricated using sol-gel processing onto Si/$SiO_2$/Ti/Pt substrates. PZT sol with different Zr/Ti ratio(20/80, 30/70, 40/60, 52/48) were prepared, respectively. The films were fabricated by using the spin-coating method on substrates. The films were heat treated at $450^{\circ}C$, $650^{\circ}C$ by rapid thermal annealing(RTA). The preferred orientation of the PZT thin films were observed by X-ray diffraction(XRD), and Scanning electron microscopy(SEM). All of the resulting PZT thin films were crystallized with perovskite phase. The fine crystallinity of the films were fabricated. Also, we found that the ferroelectric properties from the dielectric constant of the PZT thin films were over 600 degrees, P-E hysteresis constant. And the leakage current densities of films were lower than $10^{-8}A/cm^2$. It is concluded that the PZT thin films by sol-gel process to be convinced of application for ferroelectric memory device.

• Ceramist
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• v.21 no.4
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• pp.378-387
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• 2018

The optimal fabrication conditions for $Gd_{0.1}Ce_{0.9}O_{2-{\delta}}$(GDC) buffer layer and $La_{0.6}Sr_{0.4}Co_{0.2}Fe_{0.8}O_{3-{\delta}}$ (LSCF) cathode on 1mol% $CeO_2-10mol%\;Sc_2O_3$ stabilized $ZrO_2$ (CeScSZ) electrolyte were investigated for application of IT-SOFCs. GDC buffer layer was used in order to prevent undesired chemical reactions between LSCF and CeScSZ. These experiments were carried out with $5{\times}5cm^2$ anode supported unit cells to investigate the tendencies of electrochemical performance, Microstructure development and interface reaction between LSCF/GDC/CeScSZ along with the variations of GDC buffer layer thickness, sintering temperatures of GDC and LSCF were checked, respectively. Electrochemical performance was analyzed by DC current-voltage measurement and AC impedance spectroscopy. Microstructure and interface reaction were investigated by scanning electron microscopy (SEM) and energy dispersive spectroscopy (EDS). Although the interfacial reaction between these materials could not be perfectly inhibited, We found that the cell, in which $6{\mu}m$ GDC interlayer sintered at $1200^{\circ}C$ and LSCF sintered at $1000^{\circ}C$ were applied, showed good interfacial adhesions and effective suppression of Sr, thereby resulting in fairly good performance with power density of $0.71W/cm^2$ at $800^{\circ}C$ and 0.7V.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.104-104
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• 2009

Critical dimensions has rapidly shrunk to increase the degree of integration and to reduce the power consumption. However, it is accompanied with several problems like direct tunneling through the gate insulator layer and the low conductivity characteristic of poly-silicon. To cover these faults, the study of new materials is urgently needed. Recently, high dielectric materials like $Al_2O_3$, $ZrO_2$ and $HfO_2$ are being studied for equivalent oxide thickness (EOT). However, poly-silicon gate is not compatible with high-k materials for gate-insulator. To integrate high-k gate dielectric materials in nano-scale devices, metal gate electrodes are expected to be used in the future. Currently, metal gate electrode materials like TiN, TaN, and WN are being widely studied for next-generation nano-scale devices. The TaN gate electrode for metal/high-k gate stack is compatible with high-k materials. According to this trend, the study about dry etching technology of the TaN film is needed. In this study, we investigated the etch mechanism of the TaN thin film in an inductively coupled plasma (ICP) system with $O_2/BCl_3/Ar$ gas chemistry. The etch rates and selectivities of TaN thin films were investigated in terms of the gas mixing ratio, the RF power, the DC-bias voltage, and the process pressure. The characteristics of the plasma were estimated using optical emission spectroscopy (OES). The surface reactions after etching were investigated using X-ray photoelectron spectroscopy (XPS) and auger electron spectroscopy (AES).

• Transactions of the Korean Society of Mechanical Engineers A
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• v.26 no.3
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• pp.428-435
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• 2002

Pyroelectric $Pb(Zr_{0.3}Ti_{0.7})O_3$ (PZT30/70) thin film IR detectors has been fabricated and characterised. The PZT30/70 thin film was deposited onto $Pt/Ti/Si_3N_4/SiO_2/Si$ substrate by the sol-gel process. Four different substrate conditions were studied for their effects on the pyroelectric responses of the IR detectors. The substrate conditions were the combinations of the Si etching and the Pt/Ti patterning. In the Si etched substrate, the $Si_3N_4/SiO_2$ composite layer was used as silicon etch-stop, and was used as the membrane to support the PZT pyroelectric film element as well. The measured pyroelectric current and voltage responses of detectors fabricated on the micro-machined thin $Si_3N_4/SiO_2$ membrane were two orders higher than those of the detectors on the bulk-silicon. For detectors on the membrane substrate, the Pt/Ti patterned detectors showed a 2-times higher pyroelectric response than that of not-patterned detectors. On the other hand, the pyroelectric response of the detectors on the not-etched Si substrate was almost the same, regardless of the Pt/Ti patterning. It was also found that the rise time strongly depended on the substrate thickness: the thicker the substrate was, the longer the rise-time.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.191-191
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• 2008

강유전성 세라믹스 재료로써는 PZT계열의 세라믹재료가 널리 쓰이고 있다. 이는 우수한 유전 및 압전특성을 가지고 있으나, PbO을 다량 함유하고 있어 $1000^{\circ}C$이상에서 PbO가 급격하게 휘발되는 성질 때문에 조성의 변동이 생겨 재현성이 어려우며 이를 방지하기 위하여 PbO를 과잉 첨가시키기 때문에 PbO휘발로 인한 강한 독성이 인체에 유해하고, 비환경 친화적인 물질로 최근에는 환경문제가 대두됨에 따라 대체 또는 보완 할 수 있는 방안에 검토되고 있다. 본 연구는 그 해결책의 한 방안으로 압전특성이 우수한 $(Pb_{0.94}Sr_{0.06})[(Ni_{1/2}W_{1/2})_{0.02}(Mn_{1/3}Nb_{2/3})_{0.07}(Zr_{0.51}Ti_{0.49})_{0.91}]O_3$계 조성을 설계하고 Glass frit(0~1.1 wt%)를 소량 첨가하여 액상 소결 특성을 부여하고 $1000^{\circ}C$ 이하의 저온에서 소결하여 유전 및 압전 특성을 평가하였다. 실험방법은 일반적인 세라믹스 제조공정으로 24시간 ball milling하고 $850^{\circ}C$에서 2시간 하소 후 Glass frit를 소결조제로 소랑 첨가하여 $1000^{\circ}C$ 이하 온도에서 소결을 진행하여 각 소결온도에 따른 유전 및 압전 특성을 평가하였다. 최종 소결된 시편의 밀도와 수축율을 분석하여 최적의 소결온도를 확립하였으며 XRD분석을 통해 perovskite구조를 확인하고 미세구조확인을 위해 SEM으로 관찰하였다. 압전 특성을 평가하였다.

• Proceedings of the Materials Research Society of Korea Conference
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• 2010.05a
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• pp.6.1-6.1
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• 2010

원자층 증착 기술 (Atomic Layer Deposition)은 기판 표면에서 한 원자층의 화학적 흡착 및 탈착을 이용한 nano-scale 박막 증착 기술이기 때문에, 표면 반응제어가 우수하며 박막의 물리적 성질의 재현성이 우수하고, 대면적에서도 균일한 두께의 박막 형성이 가능하며 우수한 계단 도포성을 확보 할 수 있다. 최근 ALD에 의한 박막증착 방법 중 플라즈마를 이용한 ALD 증착 방법에 대한 다양한 연구가 진행되고 있다. 플라즈마는 반응성이 좋은 이온과 라디컬을 생성하여 소스간 반응성을 좋게 하여, 소스 선택의 폭을 넓어지게 하고, 박막의 성질을 좋게 하며, 생산성을 높일 수 있는 장점이 있다. 그러나 플라즈마를 사용함으로써 플라즈마 내에 이온들이 가속되서 박막 증착 중에 기판 및 박막에 손상을 입혀 박막 특성을 열화 시킬 가능성이 있다. 따라서 플라즈마 발생 영역을 기판으로부터 멀리 떨어뜨린 원거리 플라즈마 원자층 공정이 개발 되었다. 이 기술은 플라즈마에서 생성된 ion이 기판이나 박막에 닫기 전에 전자와 재결합 되거나 공정 chamber에서 소멸하여 그 영향을 최소하고 반응성이 좋은 라디칼과의 반응만을 유도하여 향상된 막질을 얻을 수 있도록 하였다. 따라서 이 원거리 플라즈마 원자층 증착기술은 나노 테크놀러지 소자 개발하기 위한 나노 박막 기술에 있어서 그 활용이 점점 확대될 것이다. 그 적용으로써 리모트 플라즈마 원자층 증착 방법을 이용한 고유전 물질 개발이 있다. 반도체 소자의 고집적화 및 고속화가 요구됨에 따라 집적회로의 크기를 혁신적으로 축소하여 스위칭 속도(switching speed)를 증가시키고, 전력손실 (power dissipation)을 줄이려는 시도가 이루어지고 있다. 그 중 하나로 고유전율 절연막은 트렌지스터 소자의 스케일링 과정에 수반하여 커지는 게이트 누설 전류를 억제하기 위한 목적으로 도입되었다. 유전율이 크면 동일한 capacitance를 내는데 필요한 물리적인 두께를 늘릴 수 있어 전자의 tunneling을 억제할 수 있고 전력손실을 줄일 수 있기 때문이다. 이와 같은 고유전율 물질이 게이트 산화막으로 사용되기 위해서 높은 유전상수 열역학적 안정성, 낮은 계면 전하밀도, 낮은 EOT, 전극 물질과의 양립성 등의 특성이 요구되는데, 이에 따라 많은 유전물질에 대한 연구가 진행되었다. 기존 gata oxide를 대체하기 위한 가장 유력한 후보 재료로 주목 받고 있는 high-k 물질들로는 Al2O3, HfO2, ZrO2, La2O3 등이 있다. 본 발표에서는 ALD의 종류에 따른 기술을 소개하고 그 응용으로 고유전율 물질 개발 연구 (고유전율 산화물 박막의 증착, 고유전율 산화물의 열적 안정성 평가, Flatband 매카니즘 규명, 전기적 물리적 특성 분석)에 대해서 발표 하고자 한다.

• Proceedings of the Korea Institute of Applied Superconductivity and Cryogenics Conference
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• 2002.02a
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• pp.340-340
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• 2002

In an effort to develop alternative single buffer layer technology for YBa$_2$Cu$_3$O$_{7-{\delta}}$ (YBCO) coated conductors, we have investigated both LaMnO$_3$, (LMO) and La$_2$Zr$_2$O$_{7}$ (LZO) as potential buffer layers. High-quality LMO films were grown directly on textured Ni and Ni-W (3%) substrates using rf magnetron sputtering. Highly textured LZO buffers were grown on textured Ni substrates using sol-gel alkoxide processing route. YBCO films were then grown on both LMO and LZO buffers using pulsed laser deposition. Detailed X-ray studies have shown that YBCO films were grown on both LMO and LZO layers with a single epitaxial orientation. A high J$_{c}$ of over 1 MA/cm$^2$ at 77 K and self-field was obtained on YBCO films grown on both LMO-buffered Ni or Ni-W substrates, and also on LZO-buffered Ni substrates. We have identified LaMnO$_3$ as a good diffusion barrier layer for Ni and it also provides a good template for growing high current density YBCO films. Similarly we have also demonstrated the growth of high J$_{c}$ YBCO films on all solution buffers. We will discuss in detail about our buffer deposition processes. processes.s.s.s.s.

• Korean Journal of Materials Research
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• v.19 no.4
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• pp.198-202
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• 2009

For use in ultrasonic actuators, we investigated the structural and piezoelectric properties of $(1\;-\;x)Pb(Zr_{0.515}Ti_{0.485})O_3$ - $xPb(Sb_{1/2}Nb_{1/2})O_3$ + 0.5 wt% $MnO_2$ [(1 - x)PZT - xPSN + $MnO_2$] ceramics with a variation of x (x = 0.02, 0.04, 0.06, 0.08). All the ceramics, which were sintered at $1250^{\circ}C$ for 2 h, showed a typical perovskite structure, implying that they were well synthesized. A homogeneous micro structure was also developed for the specimens, and their average grain size was slightly decreased to $1.3{\mu}m$ by increasing x to 0.8. Moreover, a second phase with a pyrochlore structure appeared when x was above 0.06, which resulted in the deterioration of their piezoelectric properties. However, the 0.96PZT-0.04PSN+$MnO_2$ ceramics, which corresponds with a morphotropic phase boundary (MPB) composition in the (1 - x)PZT - xPSN + $MnO_2$ system, exhibited good piezoelectric properties: a piezoelectric constant ($d_{33}$) of 325 pC/N, an electromechanical coupling factor ($k_p$) of 70.8%, and a mechanical quality factor ($Q_m$) of 1779. The specimens with a relatively high curie temperature ($T_c$) of $305^{\circ}C$ also showed a significantly high dielectric constant (${\varepsilon}_r$) value of 1109. Therefore, the 0.96PZT - 0.04PSN + $MnO_2$ ceramics are suitable for use in ultrasonic vibrators.