Effect of RTA temperature on the leakage current characteristics of PZT thin films

RTA 온도가 PZT 박막의 누설전류에 미치는 영향

  • 김현덕 (성균관대학교 전기전자 및 컴퓨터공학부) ;
  • 여동훈 ((주) 한원 마이크로 웨이브) ;
  • 임승혁 (성균관대학교 전기전자 및 컴퓨터공학부) ;
  • 송준태 (성균관대학교 전기전자 및 컴퓨터공학부)
  • Published : 2001.07.01

Abstract

The effects of post annealing temperature by the Rapid Thermal Annealing(RTA) on the electrical properties of Pb(Zr,Ti)O$_3$(PZT) thin film were investigated. Analyses by the RTA treatments reveled that the leakage current of PZT thin films strongly depend on heating temperature and time. It was found that leakage current properties of PZT capacitor were changed by heating temperature during the RTA annealing. On Pt/Ti/Si substrates, PZT films are deposited at 350 $^{\circ}C$ by rf magnetron sputtering. The X-ray diffusion (XRD) was confirmed the formation of PZT thin film. Leakage current characteristics were improved with decreasing the post annealing temperature of PZT thin film. RTA annealed film on the 700$^{\circ}C$ shows ferroelectric and electrical properties with a remanent polarization of 12.4${\mu}$C/$\textrm{cm}^2$ coercive field of 117kV/cm, leakage current J= 6.2${\times}$10$\^$-6/ A/$\textrm{cm}^2$

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