• Journal of the Institute of Electronics and Information Engineers
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• v.53 no.11
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• pp.66-70
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• 2016

This paper presents an 24 GHz I/Q LO generator for a heartbeat measurement radar system. In order to improve the mismatch performance between I and Q LO signals against process variation, a 24 GHz I/Q LO generator employing a low-pass phase shifter and a high-pass phase shifter composed of inductors and capacitors is proposed. The proposed 24 GHz I/Q LO generator consists of an LO buffer, a low-pass phase shifter and a high-pass phase shifter. It was designed using a 65 nm CMOS technology and draws 8 mA from a 1 V supply voltage. The proposed 24 GHz I/Q LO generator shows a gain of 7.5 dB, a noise figure of 2.3 dB, 0.1 dB gain mismatch and $4.3^{\circ}$ phase mismatch between I and Q-path against process and temperature variations for the operating frequencies from 24.05 GHz to 24.25 GHz.

• Journal of the Korea Convergence Society
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• v.7 no.6
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• pp.23-28
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• 2016

In this study, an investigation study on EMC(Electromagnetic Compatibility) is presented for power converter circuit. A DC-DC power converter circuit using LT3652 chip is designed and fabricated. The simulation results using ANSYS SIwave for far field radiation and unwanted emissions are presented. To minimize the unwanted emissions, we design a optimized circuit by using capacitors and ground posts. The conducted and radiation emissions are measured in the EMC test chamber based on standardized testing procedures of CISPR 22. The measured EMI emission values for a power converter circuit are presented and compared with the original circuit. The results show that the unwanted emissions from the circuit are tremendously diminished due to the applied EMI reduction techniques. The results proposed here can be usefully applied on designing power converter modules.

• Journal of the Korean Ceramic Society
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• v.55 no.3
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• pp.244-260
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• 2018

Issues in the electrical characterization of semiconducting photoanodes in a photoelectrochemical (PEC) cell, such as the cell geometry dependence, scan rate dependence in DC measurements, and the frequency dependence in AC measurements, are addressed, using the example of a $TiO_2$ photoanode. Contrary to conventional constant phase element (CPE) modeling, the capacitive behavior associated with Mott-Schottky (MS) response was successfully modeled by a Havriliak-Negami (HN) capacitance function-which allowed the determination of frequency-independent Schottky capacitance parameters to be explained by a trapping mechanism. Additional polarization can be successfully described by the parallel connection of a Bisquert transmission line (TL) model for the diffusion-recombination process in the nanostructured $TiO_2$ electrode. Instead of shunt CPEs generally employed for the non-ideal TL feature, TL models with ideal shunt capacitors can describe the experimental data in the presence of an infinite-length Warburg element as internal interfacial impedance - a characteristic suggested to be a generic feature of many electrochemical cells. Fully parametrized impedance spectra finally allow in-depth physicochemical interpretations.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.20 no.9
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• pp.1755-1762
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• 2016

In this paper, a small areal dual-output SC(switched capacitor) DC-DC converter with a improved range of an input voltage is presented. The conventional SC DC-DC converter has an advantage of low cost and small chip area. But, it has a narrow input voltage range to convert efficiently. Also, it has a lager chip area and a lower power efficiency from multiple outputs. The proposed SC DC-DC converter improves the power efficiency by using the capacitor array structure which efficiently converts the voltage according to the input voltage. By sharing two switch array, it reduces the number of switches and capacitors from 32 to 25. The proposed SC DC-DC converter was manufactured in a $0.18{\mu}m$ CMOS process. In the simulation, the range of the input voltage is 0.7~ 1.8V, the max. power efficiency is 90%, and the chip area is $0.255mm^2$.

• Proceedings of the Korean Vacuum Society Conference
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• 2015.08a
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• pp.61.1-61.1
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• 2015

Nanoscale semiconductor plasma processing has become one of the most challenging issues due to the limits of physicochemical fabrication routes with its inherent complexity. The mission of future and emerging plasma processing for development of next generation semiconductor processing is to achieve the ideal nanostructures without abnormal profiles and damages, such as 3D NAND cell array with ultra-high aspect ratio, cylinder capacitors, shallow trench isolation, and 3D logic devices. In spite of significant contributions of research frontiers, these processes are still unveiled due to their inherent complexity of physicochemical behaviors, and gaps in academic research prevent their predictable simulation. To overcome these issues, a Korean plasma consortium began in 2009 with the principal aim to develop a realistic and ultrafast 3D topography simulator of semiconductor plasma processing coupled with zero-D bulk plasma models. In this work, aspects of this computational tool are introduced. The simulator was composed of a multiple 3D level-set based moving algorithm, zero-D bulk plasma module including pulsed plasma processing, a 3D ballistic transport module, and a surface reaction module. The main rate coefficients in bulk and surface reaction models were extracted by molecular simulations or fitting experimental data from several diagnostic tools in an inductively coupled fluorocarbon plasma system. Furthermore, it is well known that realistic ballistic transport is a simulation bottleneck due to the brute-force computation required. In this work, effective parallel computing using graphics processing units was applied to improve the computational performance drastically, so that computer-aided design of these processes is possible due to drastically reduced computational time. Finally, it is demonstrated that 3D feature profile simulations coupled with bulk plasma models can lead to better understanding of abnormal behaviors, such as necking, bowing, etch stops and twisting during high aspect ratio contact hole etch.

• Korean Journal of Materials Research
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• v.19 no.11
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• pp.576-580
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• 2009

$BaTiO_3$/epoxy composites have been widely investigated as promising materials for embedded capacitors in printed circuit boards. It is generally known that the dielectric constant (K) of the $BaTiO_3$/epoxy composites increases with improvement of the dispersion of $BaTiO_3$ particles in the epoxy matrix that comes from adding surfactant. The influences of surfactant addition on the dielectric properties of the $BaTiO_3$/epoxy composites are reported in the present study. The dielectric constant of the $BaTiO_3$/epoxy composites is not significantly affected by the surfactant addition. However, the temperature coefficient of capacitance increases and the peel strength decreases as the amount of added surfactant increases. The influences of surfactant addition on the dielectric properties of the neat epoxy are also very similar to those of the $BaTiO_3$/epoxy composites. The residual surfactant in the $BaTiO_3$/epoxy composites affects the temperature coefficient of capacitance and the peel strength of the epoxy matrix, which in turn affects the temperature coefficient of capacitance and the peel strength of the $BaTiO_3$/epoxy composites.

• JSTS:Journal of Semiconductor Technology and Science
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• v.1 no.2
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• pp.95-102
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• 2001

Hafnium oxide thin films for gate dielectric were deposited at $300^{\circ}C$ on p-type Si (100) substrates by plasma enhanced chemical vapor deposition (PECVD) and annealed in $O_2$ and $N_2$ ambient at various temperatures. The effect of hydrogen treatment in 4% $H_2$ at $350^{\circ}C$ for 30 min on the electrical properties of $HfO_2$for gate dielectric was investigated. The flat-band voltage shifts of $HfO_2$capacitors annealed in $O_2$ambient are larger than those in $N_2$ambient because samples annealed in high oxygen partial pressure produces the effective negative charges in films. The oxygen loss in $HfO_2$films was expected in forming gas annealed samples and decreased the excessive oxygen contents in films as-deposited and annealed in $O_2$ or $N_2$ambient. The CET of films after hydrogen forming gas anneal almost did not vary compared with that before hydrogen gas anneal. Hysteresis of $HfO_2$films abruptly decreased by hydrogen forming gas anneal because hysteresis in C-V characteristics depends on the bulk effect rather than $HfO_2$/Si interface. The lower trap densities of films annealed in $O_2$ambient than those in $N_2$were due to the composition of interfacial layer becoming closer to $SiO_2$with increasing oxygen partial pressure. Hydrogen forming gas anneal at $350^{\circ}C$ for samples annealed at various temperatures in $O_2$and $N_2$ambient plays critical role in decreasing interface trap densities at the Si/$SiO_2$ interface. However, effect of forming gas anneal was almost disappeared for samples annealed at high temperature (about $800^{\circ}C$) in $O_2$ or $N_2$ambient.

• Proceedings of the Materials Research Society of Korea Conference
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• 2009.11a
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• pp.36.2-36.2
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• 2009

Low dielectric materials have been great attention in the semiconductor industry to develop high performance interlayer dielectrics with low k for Cu interconnect technology. In our study, the dielectric properties of SiOC /SiO2 thin film derived from polyphenylcarbosilane were investigated as a potential interlayer dielectrics for Cu interconnect technology. Polyphenylcarbosilane was synthesized from thermal rearrangement of polymethylphenylsilane around $350^{\circ}C{\sim}430^{\circ}C$. Characterization of synthesized polyphenylcarbosilane was performed with 29Si, 13C, 1H NMR, FT-IR, TG, XRD, GPC and GC analysis. From FT-IR data, the band at 1035 cm-1 is very strong and assigned to CH2 bending vibration in Si-CH2-Si group, indicating the formation of the polyphenylcarbosilane. Number average of molecular weight (Mn) of the polyphenylcarbosilane synthesized at $400^{\circ}C$ for 6hwas 2, 500 and is easily soluble in organic solvent. SiOC/SiO2 thin film was fabricated on ton-type silicon wafer by spin coating using 30wt % polyphenylcarbosilane incyclohexane. Curing of the film was performed in the air up to $400^{\circ}C$ for 2h. The thickness of the film is ranged from $1{\mu}m$ to $1.7{\mu}m$. The dielectric constant was determined from the capacitance data obtained from metal/polyphenylcarbosilane/conductive Si MIM capacitors and show a dielectric constant as low as 2.5 without added porosity. The SiOC /SiO2 thin film derived from polyphenylcarbosilane shows promising application as an interlayer dielectrics for Cu interconnect technology.

• Journal of the Semiconductor & Display Technology
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• v.6 no.4
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• pp.69-73
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• 2007

The MIM(metal-insulator-metal) capacitors with the Al/PMMA/ITO/Glass structures were manufactured according to various PMMA concentration of 1, 2, 4, 6, 8 wt%. The lowest leakage current and the largest capacitance were found to be 2.3 pA and 1.2 nF, respectively, for the device with 2 wt% PMMA concentration. The measured capacitance of the devices was almost same values with the calculated one. The optimum film thickness was obtained at the value of 48 nm, showing that the capacitance and leakage current were 1.92 nF, 0.3 pA at 2 wt%, respectively. From this experiment, the PMMA gate insulator films can be applicable to the organic thin film transistors.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.38 no.11
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• pp.765-770
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• 2001

Metal-ferroelectric-insulator- semiconductor(MFTS) devices by using rapid thermal annealed (RTA) LiNbO$_3$/AIN/Si(100) structures were successfully fabricated and demonstrated nonvolatile memory operations. Metal-insulator-semiconductor(MIS) C-V properties with high dielectric AIN thin films showed no hysteresis and good interface properties. The dielectric constant of the AIN film calculated from the capacitance at the accumulation region in the capacitance-voltage(C-V) characteristics was about 8. The C-V characteristics of MFIS capacitor showed a hysteresis loop due to the ferroelectric nature of the LiNbO$_3$ thin films. Typical dielectric constant value of LiNbO$_3$ film of MFIS device was about 23. The memory window width was about 1.2 V at the gate voltage of $\pm$5 V ranges. Typical gate leakage current density of the MFIS structure was the order of 10$^{-9}$ A/$\textrm{cm}^2$ at the range of within $\pm$500 kV/cm. The ferroelectric capacitors showed no polarization degradation up to about 10$^{11}$ switching cycles when subjected to symmetric bipolar voltage pulse(peak-to-peak 8 V, 50 % duty cycle) in the 500 kHz.