DOI QR코드

DOI QR Code

Effect of Surfactant Addition on the Dielectric Properties of BaTiO3/epoxy Composites

분산제가 BaTiO3/에폭시 복합체의 유전특성에 미치는 영향

  • 이동호 (한국과학기술연구원 에너지재료연구단) ;
  • 김병국 (한국과학기술연구원 에너지재료연구단) ;
  • 제해준 (한국과학기술연구원 에너지재료연구단)
  • Published : 2009.11.27

Abstract

$BaTiO_3$/epoxy composites have been widely investigated as promising materials for embedded capacitors in printed circuit boards. It is generally known that the dielectric constant (K) of the $BaTiO_3$/epoxy composites increases with improvement of the dispersion of $BaTiO_3$ particles in the epoxy matrix that comes from adding surfactant. The influences of surfactant addition on the dielectric properties of the $BaTiO_3$/epoxy composites are reported in the present study. The dielectric constant of the $BaTiO_3$/epoxy composites is not significantly affected by the surfactant addition. However, the temperature coefficient of capacitance increases and the peel strength decreases as the amount of added surfactant increases. The influences of surfactant addition on the dielectric properties of the neat epoxy are also very similar to those of the $BaTiO_3$/epoxy composites. The residual surfactant in the $BaTiO_3$/epoxy composites affects the temperature coefficient of capacitance and the peel strength of the epoxy matrix, which in turn affects the temperature coefficient of capacitance and the peel strength of the $BaTiO_3$/epoxy composites.

Keywords

References

  1. J. Prymark, Fundamentals of Microsystems Packaging, p.420, ed. R. R. Tummala, Mcgraw-Hill Book Company, New York, USA, (2001)
  2. S. -D. Cho, J. -Y. Lee and K. -W. Paik, J. Microelectron. Packag. Soc., 8(4), 59 (2001) (in Korean)
  3. H. -Y. Lee, J. Microelectron. Packag. Soc., 9(2), 55 (2002) (in Korean)
  4. S. K. Bhattacharya and R. R. Tummala, J. Mater. Sci :Materials in Electronics, 11(3), 253 (2000) https://doi.org/10.1023/A:1008913403211
  5. Y. Rao, S. Ogitani, P. Kohl and C. P. Wong, J. Appl. Polym Sci., 83(5), 1084 (2002) https://doi.org/10.1002/app.10082
  6. Y. Lao and C. P. Wong, J. Appl. Polym. Sci. 92, 2228 (2004) https://doi.org/10.1002/app.13690
  7. J. Xu, S. K. Bhattacharya, P. Pramanik and C. P. Wong, J. Electron. Mater. 35(11), 2009 (2006) https://doi.org/10.1007/s11664-006-0307-6
  8. R.N. Das, J. M. Lauffer and V.R. Markovich, J. Mater. Chem. 18, 537 (2008) https://doi.org/10.1039/b712051f
  9. J. Lu and C. P. Wong, IEEE Trans. Dielectr. Electr. Insul. 15(5), 1322 (2008) https://doi.org/10.1109/TDEI.2008.4656240
  10. D. -H. Kuo, C. -H. Chang, T. -Y. Su and B. -Y. Lin, Mater. Chem. Phys. 85, 201 (2004) https://doi.org/10.1016/j.matchemphys.2004.01.003
  11. J. -W. Han, B. -K. Kim and H. -J. Je, Kor. J. Mater. Res., 18(10), 542 (2008) https://doi.org/10.3740/MRSK.2008.18.10.542
  12. D. -H. Lee, D. -W. Kim, B. -K. Kim and H. -J. Je, to be published in J. Ceram. Soc. Jpn. (2009)