• Journal of Veterinary Clinics
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• v.39 no.5
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• pp.264-271
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• 2022

Two Korean short-haired cats were admitted to the Veterinary Medical Teaching Hospital, Chonnam National University, with severe lower lip avulsion. In the first case, the treatment was performed using the tension-free suture technique with rubber tube stents. The second case was treated using the tension-free suture technique with rubber tube stents for lip avulsion and using the cerclage wiring technique for alveolar fracture. The teeth around the alveolar fracture were extracted and bone graft and collagen membrane were applied at the alveolar fracture site to stabilize the mandibular alveolar fracture. Thereafter, the cerclage wire was placed circumferentially around the mandible. In both cases, normal function of the oral cavity was successfully recovered by repairing the anatomic abnormality. In conclusion, tension-free suture technique can be a treatment option for bilateral lower lip avulsion in cats.

• Journal of the Korean Society for Railway
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• v.3 no.3
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• pp.147-153
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• 2000

The train control and monitoring system (TCMS) is an on board computer system in railway vehicles performing the control, supervisory and diagnostic functions of the complete train system. This system replaces a lot of hard-wired relays and minimizes the necessary vehicle wiring thus increasing the reliability of the train. It is also one of more important equipment on vehicle to implement much higher safety and reliability train system. We studied a software design technique of TCMS using a CASE tool that is a kind of safety critical software engineering tool (SCADE). This tool has mainly four functions such as the graphical editor, the document maker, tile automatically code generator, and the test simulator. The several functions of TCMS are implemented in this software easily programmed using a functional block diagram and a graphic programming language. We applied to automatically generated TCMS modules on the SCADE each functional block for the Standard type EMU in Korea. We performed the combination test using TCMS simulator and the running test in Seoul subway 7 Line. We proved that this technique is more useful for the software design of TCMS in urban transit

• 제어로봇시스템학회:학술대회논문집
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• 2004.08a
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• pp.1474-1479
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• 2004

In this paper, the design of the network system using the CAN and the analysis of effects of time delay in the system are presented. A conventional implementation technique induces many problems because of the amount and complexity of wiring and maintenance problems. The network system reduces these problems, but it cause another problem; time delay. Time delay in a sampling time does not have much effects on the system, but time delay over the sampling time changes the control frequency and ended up makes the system unstable. It is verified that time delay between each parts has different effects on the entire system. The results from this paper will be a base for studying algorithms to reduce effects of time delay in the system using the CAN.

• Proceedings of the KSR Conference
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• 2007.05a
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• pp.1062-1067
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• 2007

This study presents an experimental technique to monitor the dynamic behavior of the railway bridge system simultaneously using multiplexed fiber Bragg grating (FBG) sensors. The measuring quantities include stains, curvatures, vertical deflections, and vertical accelerations. The strains are directly measured from multiplexed FBG sensors at various locations of the test bridge followed by curvature calculations based on the plane section assumption. Vertical deflections are then estimated using the Bernoulli beam theory and regression analysis. Finally, vertical accelerations are obtained from the numerical differentiation in time domain. In order to verify the proposed method, several conventional electric strain gauges, displacement transducers, and accelerometers are installed at the mid-span of the bridge for comparisons. A test train is passed over the bridge to monitor the dynamic response of the bridge. The monitoring results show that the multiplexed FBG sensing system is able to capture the essential behavior of the test bridge while resolving wiring problem in practice.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.33A no.11
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• pp.128-139
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• 1996

In this paper, we propose an algorithm to solve the problem of placement of rectangular blocks whose sizes and shpaes are pre-determined. The proposed method solves the placement of many retangular blocks of different sizes and shapes in a hierarchical manner, so as to minimize the chip area. The placement problem is divided into several sub-problems: hierarchical partioning, hierarchical area/shape estimation, hierarchical pattern pacement, overlap removal, and module rotation. After the circuit is recursively partitioned to build a hierarchy tree, the necessary wiring area and module shpaes are estimated using the resutls of the partitioning and the pin information before the placement is performed. The placement templaes are defined to represent the relative positions of the modules. The area and the connectivity are optimized separately at each level of hierachy using the placement templates, so the minimization of chip area and wire length can be achieved in a short execution time. Experiments are made on the MCNC building block benchmark circuits and the results are compared with those of other published methods. The proposed technique is shown to produce good figures in tems of execution time and chip area.

• Journal of Korean Foot and Ankle Society
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• v.15 no.2
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• pp.107-109
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• 2011

We report here on a case of Achilles tendon rupture associated with ipsilateral bimalleolar fracture that was caused by ski injury. The association of an ankle fracture with rupture of the Achilles tendon is even more infrequent, although both injuries alone are extremely common. We treated as a operation of Achilles tendon repair with Krackow method and open reduction with Tension-band wiring technique for bimalleolar fracture.

• Journal of the Korean Society for Precision Engineering
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• v.13 no.11
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• pp.46-56
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• 1996

Planarization technique is rapidly recognized as a critical step in chip fabrication due to the increase in wiring density and the trend towards a three dimensional structure. Global planarity requires the preferential removal of the projecting features. Also, the several materials i.e. Si semiconductor, oxide dielectric and sluminum interconnect on the chip, should be removed simultaneously in order to produce a planar surface. This research has investihgated the development of the chemical mechanical polishing(CMP) machine with uniform pressure and velocity mechanism, and the pad insensitive to pattern topography named hard grooved(HG) pad for global planarization. Finally, a successful result of uniformity less than 5% standard deviation in residual oxide film and planarity less than 15nm in residual step height of 4 inch device wafer, is achieved.

• Journal of the Korean Electrochemical Society
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• v.2 no.3
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• pp.138-143
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• 1999

Recently, miniaturization of large scale integrated circuits (LSI) and printed circuit board (PCB) have become essential with the downsizing of electronic devices. Gold electroplating is applied of conductivity wiring or terminals for improvement of conductivity and corrosion resistance. However, electroplating is not applicable since the circuits are becoming finer and denser. Accordingly, electroless plating is recently highly attractive method because of the simplicity of the operation requiring no external source of current and no elaborate equipment. In this work, we tried to develop a plating technique on electroless Ni/Au plating. First, the electroless Ni plating was deposited on the PCB with agitation in the bath at $85^{\circ}C$. Then the Au layer was deposited on the Ni layer surface by same method at $90^{\circ}C$. The bonderability were tested in order to evaluate the stability of the electroless Ni/Au by gold wire or solder ball test.

• Journal of Applied Reliability
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• v.5 no.2
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• pp.241-259
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• 2005

The environmental problem is a main subject of the 21C and an environment destruction phenomenon by various kinds of environmental materials is reaching serious level. Nations to be classified as the environmental developed country, are born again environmental rich country. And they earn a large income by trade Every kind environmental resource in an international commercial transaction. Especially, the study that a reliability assessment method to prevent to reliability problem to be happened when the solder lead(lead-free solder), non-cd component, non-bromide component(without the polybrominated biphenyls(PBB) and polybrominated diphenyl ethers(PBDE))and hexavalent chromium(Cr VI) clearance component and mercury-free applied to electronic equipment is progressed. As the result of the study for applying of a reliability assessment technique of lead-free solder that recognized the most of urgent problem at the company, combination accelerated life test could taken by adding and appling the part of a humidity acceleration part to Eyring Model which is proposed by R.E.Thomas. The reliability assessment methods study of PWB clean environmental materials is expected to respond to a reliability elevation and environmental material regulation policy spreading all over the world by beginning form Europe.

• The Journal of the Korea institute of electronic communication sciences
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• v.7 no.2
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• pp.409-415
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• 2012

Recently in industry communication, the efforts that use robot and automation system increased by cooperation with optical communication and industrial Ethernet. In this paper, in order to solve the problem that total network blocking when network fault happens and wiring problem of optical cable, which were big serious disadvantage in industrial optical network systems, we propose bi-directional optical EtherCAT communication technique based on single optical core, which applying WDM method. We describe the content for implementation of WDM bi-directional optical EtherCAT communication module and performance evaluation to verify the performance of related technology as a whole.