• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.11a
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• pp.205-208
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• 2001

Steady state and transient thermal analysis has been done by a finite element method in a diode of 12kV blocking voltage for microwave oven. The diode was fabricated by soldering ten pieces of 1200V diodes in series, capping a dummy wafer at the far end of diode series, and finally copper wire bonded for building anode and cathode terminal. In order to achieve high voltage and reliability, the edge of each diode was beveled and passivated by resin and epoxy with a thickness of 25$\mu\textrm{m}$ and 3,700$\mu\textrm{m}$, respectively. The chip size, thickness and material properties were very important factor for high voltage diode package. And also, thermal stress value was highest in the edge of diode and solder. So, design of edge in silicon was very important to thermal stress.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.07a
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• pp.262-263
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• 2005

For mechanical and electrical stability and environment protection, Cu and stainless steel stabilizer is laminated to Ag layer to produce a composite neutral-axis(N-A) architecture in which the YBCO layer is centered between the oxide buffered metallic substrate and stabilizer strip lamination. this architecture allows the wire to meet operational requirements including stresses at cryogenic temperature, winding tensions, mechanical bending requirements thermal and electrical stability under fault conditions. we have experimentally studied mechanical properties of laminated stainless steel stabilizer on YBCO coated conductors. we have laminated YBCO coated conductors by continuous dipping soldering process. we have investigated lamination interface between solder and stabilizer, YBCO coated conductor. we evaluated bonding properties tensile / shear bonding strength, peeling strength laminated YBCO coated conductors.

• Journal of Sensor Science and Technology
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• v.30 no.2
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• pp.88-93
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• 2021

In this paper, a folding sensor based on capacitance is proposed. The sensor was developed to sense the length and angle data for the milli-scale actuators without causing any interference to the actuating joints. For the sensing and testing the robotic joint with reducing the cost and complexity aspects of manufacturing, a simple composition was adopted. The sensor comprises a pair of copper tapes, papers, and wires. The complete sensing unit is constructed by bonding the tapes with the papers and soldering the wire to the copper parts. For accuracy, a teensy 4.0 board, which has a 12-bit ADC resolution, is employed. Furthermore, the sensed analog data is not translated into the unit of capacitance for accuracy; however, it is filtered using a low-pass filter and subsequently, a Butter-worth filter. The data obtained demonstrate a periodic waveform, which implies that the data are in good agreement with the hypothesis set prior to the experiments. Compared to other milli-scale sensors, this could be a better option for sensing the length and angle data for milliscale actuators.

• Progress in Superconductivity and Cryogenics
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• v.8 no.3
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• pp.23-26
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• 2006

For mechanical and electrical stability and environment protection. Cu and stainless steel stabilizers are laminated to a Ag layer to produce a composite neutral-axis(N-A) architecture in which the YBCO layer is centered between the oxide buffered metallic substrate and stabilizer strip lamination. This architecture allows the wire to meet operational requirements including stresses at cryogenic temperature. winding tensions as well as mechanical bending requirements including thermal and electrical stability under fault current conditions. We have experimentally studied mechanical properties of the laminated stainless steel and Cu stabilizers on YBCO coated conductors. We have laminated YBCO coated conductors by continuous dipping soldering process. We have investigated lamination interface between solder and stabilizer of the YBCO coated conductor. We evaluated bonding properties. tensile / shear bonding strength. and peeling strength laminated YBCO coated conductors.

• Progress in Superconductivity and Cryogenics
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• v.9 no.3
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• pp.9-12
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• 2007

In this study. we searched for the mechanical and electrical properties of laminated coated conductors with stabilizer tape. Stabilizer tape plays a role for mechanical and electrical stability and environmental protection. Cu material stabilizer was laminated to Ag capping layer on SmBCO conductor layer. This architecture allows the wire to meet operational requirements including the stressless at cryogenic temperature and winding tension as well as mechanical bending requirements including thermal and electrical stability under fault current conditions. First, we have experimentally studied mechanical bonding properties of the laminated Cu stabilizers on SmBCO coated conductors. We have laminated SmBCO coated conductors by continuous dipping soldering process, Second, we have investigated electrical properties of the SmBCO coated conductors with stabilizer lamination. We evaluated bonding properties, peeling strength and critical current for laminated SmBCO coated conductors with Cu stabilizers.

• Journal of the Korean Institute of Gas
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• v.16 no.6
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• pp.102-106
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• 2012

The purpose of this paper is to study the failure cases in relation to system of Air Bag in vehicle happened in the field. In the first example, it was separated the soldering parts connected the wire pin between air bag module and clock spring of air bag. Whenever the pin shake by the car's vibration, the driver verified the malfunction phenomenon appeared air bag warning lamp on instrument panel in front of driver's seat. in car inside room. The second example, it verified the warning lamp lighting phenomenon of air bag by produced the circuit plate non-contacting of single an element in air bag electronic control unit. The third example, it verified the light of air bag warning indicator lamp by separated with soldering parts connecting inner pin and resistance terminal of seat belt pretensioner using passenger seat. The fourth example, when the passenger car crash a back of truck, the former bumper get jammed under the latter as the roof height of car low less than that. Therefore, the impact of Car's collision verified that don't transfer with body frame of vehicle because of no attachment impact sensor in it.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.7 no.4
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• pp.525-530
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• 2006

Recently companies which do not use the heavy metals such as lead, chrome, mercury to the electronic goods and alternate the materials environment-friendly are increasing. In advanced country, lead-free solder without lead is developed and soldering process almost disappeared. The lead-free solder is environment-friendly but is expensive and lack of tack and durability than lead, the improvement is necessary. To solve this problem, the welding process that uses TIG welding and the welding technology between different kind metals for lead-in wire of room lamp and base department was developed. To do this, previous room lamp manufacturing process was analysed and which process can be alternate was proposed. And the test for selection of optimal value of TIG welding parameter was done. Finally the lamp aging test and earthquake resistant test was done to check the reliability of welded room lamp.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.431-432
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• 2012

In the era of 20 nm scaled semiconductor volume manufacturing, Microelectronics Manufacturing Engineering Education is presented in this paper. The purpose of microelectronic engineering education is to educate engineers to work in the semiconductor industry; it is therefore should be considered even before than technology development. Three Microelectronics Manufacturing Engineering related courses are introduced, and how undergraduate students acquired hands-on experience on Microelectronics fabrication and manufacturing. Conventionally employed wire bonding was recognized as not only an additional parasitic source in high-frequency mobile applications due to the increased inductance caused from the wiring loop, but also a huddle for minimizing IC packaging footprint. To alleviate the concerns, chip bumping technologies such as flip chip bumping and pillar bumping have been suggested as promising chip assembly methods to provide high-density interconnects and lower signal propagation delay [1,2]. Aluminum as metal interconnecting material over the decades in integrated circuits (ICs) manufacturing has been rapidly replaced with copper in majority IC products. A single copper metal layer with various test patterns of lines and vias and $400{\mu}m$ by $400{\mu}m$ interconnected pads are formed. Mask M1 allows metal interconnection patterns on 4" wafers with AZ1512 positive tone photoresist, and Cu/TiN/Ti layers are wet etched in two steps. We employed WPR, a thick patternable negative photoresist, manufactured by JSR Corp., which is specifically developed as dielectric material for multi- chip packaging (MCP) and package-on-package (PoP). Spin-coating at 1,000 rpm, i-line UV exposure, and 1 hour curing at $110^{\circ}C$ allows about $25{\mu}m$ thick passivation layer before performing wafer level soldering. Conventional Si3N4 passivation between Cu and WPR layer using plasma CVD can be an optional. To practice the board level flip chip assembly, individual students draw their own fan-outs of 40 rectangle pads using Eagle CAD, a free PCB artwork EDA. Individuals then transfer the test circuitry on a blank CCFL board followed by Cu etching and solder mask processes. Negative dry film resist (DFR), Accimage$^{(R)}$, manufactured by Kolon Industries, Inc., was used for solder resist for ball grid array (BGA). We demonstrated how Microelectronics Manufacturing Engineering education has been performed by presenting brief intermediate by-product from undergraduate and graduate students. Microelectronics Manufacturing Engineering, once again, is to educating engineers to actively work in the area of semiconductor manufacturing. Through one semester senior level hands-on laboratory course, participating students will have clearer understanding on microelectronics manufacturing and realized the importance of manufacturing yield in practice.