Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference (한국전기전자재료학회:학술대회논문집)
- 2001.11a
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- Pages.205-208
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- 2001
Heat Dissipation Analysis of High Voltage Diode Package for Microwave oven
전자레인지용 고압다이오드의 방열특성
- Kim, Sang-Cheol ;
- Kim, Nam-Kyun ;
- Bahng, Wook ;
- Seo, Gil-Soo ;
- Moon, Seoung-Ju ;
- Oh, Bang-Won
- 김상철 (한국전기연구원 전력반도체그룹) ;
- 김남균 (한국전기연구원 전력반도체그룹) ;
- 방욱 (한국전기연구원 전력반도체그룹) ;
- 서길수 (한국전기연구원 전력반도체그룹) ;
- 문성주 (삼성전기) ;
- 오방원 (삼성전기)
- Published : 2001.11.01
Abstract
Steady state and transient thermal analysis has been done by a finite element method in a diode of 12kV blocking voltage for microwave oven. The diode was fabricated by soldering ten pieces of 1200V diodes in series, capping a dummy wafer at the far end of diode series, and finally copper wire bonded for building anode and cathode terminal. In order to achieve high voltage and reliability, the edge of each diode was beveled and passivated by resin and epoxy with a thickness of 25