• Journal of Surface Science and Engineering
• /
• v.34 no.5
• /
• pp.510-515
• /
• 2001

It was first time that low frequency R.F. derived plasma enhanced MOCVD with frimethylborate precursor was used to fabricate a new ternary compound $BO_{x}$ $N_{y}$ . The formation of BON molecule was resulted from nitrogen nitrifying B-O, and forming the angular molecule structure proved by XPS and FT-IR results. The relationship between hardness and film thickness was studied. An thickness-independent hardness was fond about 10 GPa. The empirical calculation of band-gap and UV test result showed that our deposited $BO_{x}$ $N_{y}$ thin film was semiconductor material with 3.4eV of wide band gap. The electrical conductivity, $4.8$\times$10^{-2}$ /($\Omega$.cm)$^{-1}$ also confirmed that $BO_{x}$ $N_{y}$ has a semiconductor property. The roughness detected from the as-grown films showed that there was no serious bombarding effect due to anion in the plasma occurring in the RF frequency derived plasma.

• Electronics and Telecommunications Trends
• /
• v.29 no.6
• /
• pp.53-62
• /
• 2014

본고는 최근 화두가 되고 있는 에너지 절감을 위해 고효율, 친환경의 WBG(Wide Band-Gap) 화합물반도체인 SiC(Silicon Carbide), GaN(Gallium Nitride) 전력반도체 소자 및 전력변환 모듈의 기술동향과 ETRI에서 연구개발 진행 중인 GaN 전력반도체 관련 기술에 대해 기술한다. WBG 전력반도체는 기존의 실리콘 전력반도체와 비교하여 열 특성 향상, 고속 스위칭, 고전압/고전류 특성 및 스위칭 손실 최소화 등이 가능하고 이에 따른 시스템의 소형화 및 전력효율 향상 효과를 얻을 수 있다. 특히, GaN 전력반도체 소자는 시장이 가장 넓게 형성되어 있는 900V 이하에 적용이 가능하며, 앞으로 시장이 커질 것으로 예상되는 HEV(Hybrid Electric Vehicle)/EV(Electric Vehicle)의 친환경 자동차에도 활용될 것으로 기대되고 있다. 본고는 최근의 일본과 미국에서의 WBG 전력반도체에 대한 관심 및 투자 방향과 GaN 전력반도체 소자에 대한 해외 기업의 업계동향에 대해서도 함께 살펴본다. 이러한 WBG 전력반도체에 대한 해외 선진업체의 산업동향과 더불어 ETRI에서 연구개발 중인 GaN 전력반도체 기술현황에 대해 전력소자 설계 및 제조공정, 패키징, 전력모듈 설계 제작 기술을 포함하여 기술한다.

• The Transactions of the Korean Institute of Power Electronics
• /
• v.19 no.3
• /
• pp.283-289
• /
• 2014

This paper carries out a series of analysis of power system using Gallium Nitride (GaN) FET which has wide band gap (WBG) characteristics comparing to conventional Si MOSFET-used power system. At first, for comparison of each semiconductor device, the switching-transient parameter is quantitatively extracted from released information of GaN FET. And GaN FET model which reflect this dynamic property is configured. By using this model, the performance of GaN FET is analyzed comparing to Si MOSFET. Also, in order to enable a representative assessment on the power system level, Si MOSFET and GaN FET are applied to the most common structure of power system, full-bridge, and each power systems are compared based on various criteria, such as performance, efficiency and power density. The entire process is verified with the aid of mathematical analysis and simulation.

• Journal of the Korean Electrochemical Society
• /
• v.14 no.3
• /
• pp.145-151
• /
• 2011

ZnSe, as a II-VI compound semiconductor which has a wide band gap in the visible region is applicable to the various fields such as laser diode, display and solar cell. By using the electrochemical deposition method, ZnSe thin film was synthesized on the ITO glass substrate. The synthesis of ZnSe grains and their structure having zinc blende shape were verified through the analysis of XRD and SEM. UV spectrophotometric method determined the band gap as the value of 2.76 eV. Applying the DFT (Density Functional Theory) in the molecular dynamics, the band structure of ZnSe grains was analyzed. For ZnSe grains with zinc blende structure, the band structure and its density of state were simulated using LDA (Local Density Approximation), PBE (Perdew Burke Ernzerhof), and B3LYP (Becke, 3-parameter, Lee-Yang-Parr) functionals. Among the calculations of energy band gap upon each functional, the simulated one of 2.65 eV based on the B3LYP functional was mostly near by the experimental measurement.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2003.07a
• /
• pp.259-262
• /
• 2003

The surface electronic state of rutile $TiO_2$, which is an oxide semiconductor and has a wide band gap of 3.1 $\sim$ 3.5 eV, was calculated by DV-$X_{\alpha}$ method, which is a sort of the first principle molecular orbital method and uses Hartre-Fock-Slater approximation. The $[Ti_{15}O_{56}]^{-52}$ cluster model was used for the calculation of bulk state and the $[OTi_{11}O_{34}]^{-24}$ model for the surface state calculation. After calculations, the energy level diagrams and the deformation electron density distribution map were compared in both models. As results, it was identified that the surface energy levels are found between the valence and conduction band of bulk $TiO_2$ on the surface area. The energy values of these surface-induced levels are lower than conduction band of bulk $TiO_2$ by 0.1 $\sim$ 1 eV. From this fact, it is expected that the surface energy levels act as donar levels in n-type semiconductor.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.14 no.2
• /
• pp.117-122
• /
• 2001

In this paper, we report on photoelectrochemical etching process of 6H-SiC semiconductor wafer. The etching was performed in two-step process; anodization of SiC surface to form a deep porous layer and thermal oxidation followed by an HF dip. Etch rate of about 615${\AA}$/min was obtained during the anodization using a dilute HF(1.4wt% in H$_2$O) electrolyte with the etching potential of 3.0V. The etching rate was increased with the bias voltage. It was also found out that the adition of appropriate portion of H$_2$O$_2$ into the HF solution improves the etching rate. The etching process resulted in a higherly anisotropic etching characteristics and showed to have a potential for the fabrication of SiC devices with a novel design.

• Journal of Advanced Engineering and Technology
• /
• v.10 no.2
• /
• pp.203-208
• /
• 2017

Due to global climate change issues, there is a growing demand for systems throughout the industry. In the case of power conversion, studies have been actively conducted to change the structure of the power conversion circuit and to apply new power devices. In particular, the WBG (Wide Band Gap), which is newly emerged device in the market for developing semiconductor technology, has demonstrated advantages in applying for various aspects in comparison to the existing Si (Silicon) Semiconductor. Recent research centers in the railway industry are focusing on developing technologies suitable for railway vehicles by utilizing these new developments in railway countries such as Japan and Europe. This paper researches the WBG device that is applicable to the auxiliary power supplies (APS) in railway system, and analyzes the downsizing effects to APS in high-speed railway by conducting a theoretical analysis and simulation.

• The Transactions of the Korean Institute of Electrical Engineers
• /
• v.31 no.9
• /
• pp.74-81
• /
• 1982

One of the stable thin film transistor fabricated by cadmium suifide with the anodized aluminium oxide as gate material. The principle of the operation for the device is based on the control mechanism of injected majority carricrs to the wide band gap semiconductor, that is cadmium sulfide, by means of the function of the gate control. The fabricated device constructed by evaporating CdS layer in the form of microcrystalline on the oxided thin film characterized by ea, 80 as voltage amplification factor, 1/100 mho as transconductance, 8 kohm as dynamic output resistance, furthermore gain band width products is about 15 MHz.

• Journal of Energy Engineering
• /
• v.22 no.1
• /
• pp.58-81
• /
• 2013

Recently, the technological progress in manufacturing power devices based on wide bandgap materials, for example, silicon carbide(SiC) or gallium nitride(GaN), has resulted in a significant improvement of the operating-voltage range and switching speed and/or specific on resistance compared with silicon power devices. This paper will give an overview of the status on The Next generation Power Devices such as SiC/GaN with a focus on commercialization and research.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2008.04c
• /
• pp.58-61
• /
• 2008

$TiO_2$ is a wide band-gap semiconductor (3.4 eV) and can only absorb about 5% of sun light in the ultraviolet light region, which largely limits its practical applications because of the lower utility of sun light and quantum yield. In order to move the absorption edge of $TiO_2$ fims to visible spectrum range, we have made the impurity level within a band-gap of $TiO_2$ thin film by introduction of oxygen vacancy. Oxygen-defected $TiO_2$ thin film have prepared by reactive sputtering with the partial pressure of $Ar:O_2=10:90{\sim}99.33:0.66$ ratio. As a result, we could have the impurity level of about 2.75 eV on condition that oxygen partial pressure is below 7%.