• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.05a
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• pp.497-502
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• 2002

This paper describes a design methodology of a tri-axial silicon-based farce sensor with square membrane by using micromachining technology (MEMS). The sensor has a maximum farce range of 5 N and a minimum force range of 0.1N in the three-axis directions. A simple beam theory was adopted to design the shape of the micro-force sensor. Also the optimal positions of piezoresistors were determined by the strain distribution obtained from the commercial finite element analysis program, ANSYS. The Wheatstone bridge circuits were designed to consider the sensitivity of the force sensor and its temperature compensation. Finally the process for microfabrication was designed using micromachining technology.

• Journal of Biosystems Engineering
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• v.5 no.2
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• pp.40-57
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• 1980

The aim of this study was to promote extensive use of strain gage for accurate measurement in the area of farm machinery research. The results are summarized as follows. 1. Although many strain gate transducers commercially available such as load-cells , accelerometers and pressure transducers have been used in the area of farm machinery research, many types of transducers had to be developed due to the inadaptability or high cost commercial transducers, in many instances. 2. A strain -gaged cantilever beam could be used as a good educational material to demonstrate the methods of Wheatstone bridge arrangement, calibration and theoreticval computation. A ring type load-cell and shaft torque transducer also could be used for the same purpose. 3. The torque and angular speed transducers for an auto-feed thresher and the displacement and pressure transducers for a rice whitener were made and gave satisfactory results. 4. Based on the above results, it is possible to develop simple and low-cost transducers to measure displacement, angular speed , torque and pressure of farm machine elements.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.07a
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• pp.181-184
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• 2002

This paper describes fabrication and characteristics of ceramic pressure sensor for working at high temperature. The proposed pressure sensor consists of a Ta-N thin-film, patterned on a Wheatstone bridge configuration, sputter deposited onto thermally oxidized Si membranes with an aluminium interconnection layer. The fabricated pressure sensor presents a low temperature coefficient of resistance, high sensitivity, low non-linearity and excellent temperature stability The sensitivity is 1.097∼1.21 mV/V$.$kgf/$\textrm{cm}^2$ in the temperature range of 25∼200$^{\circ}C$ and the maximum non-linearity is 0.43 %FS.

• Proceedings of the KIEE Conference
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• 2001.07c
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• pp.1372-1374
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• 2001

This paper describes fabrication and characteristics of metal thin-film pressure sensor for working at high temperature. The proposed pressure sensor consists of a chrom thin-film, patterned on a Wheatstone bridge configuration, sputter-deposited onto thermally oxidized Si membranes with an aluminium interconnection layer. The fabricated pressure sensor presents a low temperature coefficient of resistance, high-sensitivity, low non-linearity and excellent temperature stability. The sensitivity is 1.097 $\sim$ 1.21 mV/V kgf/$cm^2$ in the temperature range of 25 $\sim$ $200^{\circ}C$ and the maximum non-linearity is 0.43 %FS.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.07b
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• pp.884-887
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• 2003

Strain gages were widely used transducers. Essentially a strain gage was an electric element to which an appropriate type was attached. Strain was sensed by gages and provided electrical output proportional to applied forced. This paper describes the recent development of a thick film strain gage ceramic pressure sensors. The thick film resistors as strain gage in the Wheatstone bridge were fabricated with a novel mixture of ruthenium. The thick-film technology of resistors were printed on the ceramic diaphragm back side by screen printing and cured at $850^{\circ}C$. The mechanical measurements were performed with the computer simulation results(ANSYS 5.1). The output sensitivity was 1.2mV/V, of which max. nonlinearity was less than 0.29%, hysteresis was less than 0.38%FS.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2001.04a
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• pp.32-36
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• 2001

Recently, reaction injection molding has been used broadly for rapid prototyping, because of its convenience and versatility. Since the properties of molded products are dependent on the process variables and the production is very short(less than 2minutes), the control of process variables is important. Generally, the two significant process variables are degree of cure and temperature of the reactants. In this paper, the relation between the degree of cure and the temperature of reactants was investigated to find the optimal curing condition of reaction injection molding for rapid prototyping. The degree of cure during reaction injection molding was measured by the Lacomtech sensor and dielectrometry equipment employing Wheatstone bridge type circuit.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1996.04a
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• pp.724-728
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• 1996

The instrumented Charpy impact test is generally used to evaluate the dynamic fracture toughness for varying engineering materials. However, the test is known to be difficult to evaluate the dynamic fracture toughness for very brittle materials because of the small crack initiation load. To evaluate the dynamic fracture toughness of verybrittle materials, it is necessary to develop a load sensitive instrumented tup. In this study, a polymer tup, which has small Young's modulus, is used for the instrumented Charpyimpact test and a proper testing method is developed. The results show that the developed method can measure rapidly changing loads from the moment of contact between the tup and the specimen to dynamic crack initation of the very brittle materials.

• Proceedings of the KIEE Conference
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• 1995.11a
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• pp.342-344
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• 1995

Using piezoresistive effects of single-crystal and poly-crystalline silicon, pressure sensors of the same pattern were fabricated for comparison of temperature characteristics. Optimum size and aspect ratio of rectangular sensor diaphragm were calculated by FEM. For polsilicon pressure sensor, polysilicon resistors of Wheatstone bridge were deposited by LPCVD to be used in a wide' temperature range. Polysilicon pressure sensors showed more stable temperature characteristics than single-crysta1 silicon in the range of $-20\sim125[^{\circ}C]$. To get low TCO (Temperature Coefficient of Offset), below $\pm$3 [${\mu}V/V/^{\circ}C$], it is needed for each TCR of piezoresistors to have a deviation within $\pm25[ppm/^{\circ}C]$ less than $\pm500[ppm/^{\circ}C]$ of resistors for polysilicon pressure sensor can result in low TCS(Temperature Coefficient of Sensitivity) of -0.1[%FS/$^{\circ}C$].

• Journal of Mechanical Science and Technology
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• v.20 no.5
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• pp.692-709
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• 2006

Nucleate pool boiling experiments with constant wall temperature were performed using pure R1l3 for subcooled, saturated, and superheated pool conditions. A microscale heater array and Wheatstone bridge circuits were used to maintain the constant wall temperature and to measure the instantaneous heat flow rate accurately with high temporal and spatial resolutions. Images of bubble growth were taken at 5,000 frames per second using a high-speed CCD camera synchronized with the heat flow rate measurements. The bubble geometry was obtained from the captured bubble images. The effect of the pool conditions on the bubble growth behavior was analyzed using dimensionless parameters for the initial and thermal growth regions. The effect of the pool conditions on the heat flow rate behavior was also examined. This study will provide good experimental data with precise constant wall temperature boundary condition for such works.

• Journal of Mechanical Science and Technology
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• v.18 no.5
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• pp.798-807
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• 2004

A testing system was developed to improve the reliability of printhead and several printheads were tested. We developed a thermally driven monolithic inkjet printhead comprising dome-shaped ink chambers, thin film nozzle guides, and omega-shaped heaters integrated on the top surface of each chamber. To perform a fatigue test of an inkjet printhead, the testing system automatically detects a heating failure using a Wheatstone bridge circuit. Various models were designed and tested to develop a more reliable printhead. Two design parameters of the width of reinforcing layer and heater were investigated in the test. Specially., the reinforcing layer was introduced to improve the fatigue life of printhead. The life-span of heater with a reinforcing layer was longer than that without a reinforcing layer. The wider the heater was, the longer the life of printhead was.