• Title/Summary/Keyword: Wet bonding

Search Result 141, Processing Time 0.027 seconds

THE EFFECT OF THE REMOVAL OF CHONDROITIN SULFATE ON BOND STRENGTH OF DENTIN ADHESIVES AND COLLAGEN ARCHITECTURE (비교원성 단백질이 상아질 접착제의 결합강도와 교원질의 형태에 미치는 영향)

  • Kim, Jong-Ryul;Park, Sang-Jin;Choi, Gi-Woon;Choi, Kyoung-Kyu
    • Restorative Dentistry and Endodontics
    • /
    • v.35 no.3
    • /
    • pp.211-221
    • /
    • 2010
  • Proteoglycan is highly hydrophilic and negatively charged which enable them attract the water. The objective of study was to investigate the effects of Proteoglycan on microtensile bond strength of dentin adhesives and on architecture of dentin collagen matrix of acid etched dentin by removing the chondroitin sulphate attached on Proteoglycan. A flat dentin surface in mid-coronal portion of tooth was prepared. After acid etching, half of the specimens were immersed in 0.1 U/mL chondroitinase ABC (C-ABC) for 48 h at $37^{\circ}C$, while the other half were stored in distilled water. Specimens were bonded with the dentin adhesive using three different bonding techniques (wet, dry and re-wet) followed by microtensile bond strength test. SEM examination was done with debonded specimen, resin-dentin interface and acid-etched dentin surface with/without C-ABC treatment. For the subgroups using wet-bonding or dry-bonding technique, microtensile bond strength showed no significant difference after C-ABC treatment (p > 0.05). Nevertheless, the subgroup using rewetting technique after air dry in the Single Bond 2 group demonstrated a significant decrease of microtensile bond strength after C-ABC treatment. Collagen architecture is loosely packed and some fibrils are aggregated together and relatively collapsed compared with normal acid-etched wet dentin after C-ABC treatment. Further studies are necessary for the contribution to the collagen architecture of noncollagenous protein under the various clinical situations and several dentin conditioners and are also needed about long-term effect on bond strength of dentin adhesive.

Evaluation of Bonding Performance in UHPC-based Concrete Repair Materials Considering Surface of Structure Subject to Repair (보수대상 구조 표면 상태를 고려한 UHPC 기반 콘크리트 보수재료의 부착 성능 평가)

  • Yong-Sik Yoon;Kyong-Chul Kim;Kwang-Mo Lim;Gi-Hong An;Gum-Sung Ryu;Kyung-Taek Koh
    • Journal of the Korean Recycled Construction Resources Institute
    • /
    • v.11 no.4
    • /
    • pp.433-439
    • /
    • 2023
  • In this study, the bonding performance of repair materials was evaluated on concrete repair surface to develop concrete repair materials based on UHPC (Ultra High Performance Concrete) which has high mechanical and durability performance. The ten test variables were applied considering the roughness and wet condition of the concrete surface subject to repair, the addition of polymer, and the use PP and PVA fibers in repair materials. The addition of the polymer caused a significant decrease in strength, which was thought to be due to the effect of the additional super plasticizer used to adjust workability. Also, flow was reduced by up to 13.8 % with the use of plastic-based fibers. As a result of evaluating the bond strength of the repair material considering the condition of the surface subject to repair, it was thought that in the case of using UHPC-based repair material, high bonding performance could be secured without any additional surface treatment as long as the surface of the base material was sound. In addition, UHPC-based repair materials showed high bonding performance even when the attachment surface was wet. In the future, research will be conducted on shot-crete application and gradient pouring for the development of UHPC-based repair materials, and continuous improvement in the repair material mixing property will be carried out to ensure economic efficiency and performance as a concrete structural repair material.

Improvement of Paper Bulk and Stiffness by Using Drying Shrinkage Analysis (건조수축 해석을 통한 종이의 벌크 및 강직성 향상)

  • Lee, Jin-Ho;Park, Jong-Moon
    • Journal of Korea Technical Association of The Pulp and Paper Industry
    • /
    • v.43 no.4
    • /
    • pp.49-58
    • /
    • 2011
  • The maximum drying shrinkage velocity was proposed to verify bulk and stiffness improvement mechanism during drying according to papermaking parameters. It was based on the wet-web shrinkage behavior without the restraint of wet-web during drying, so intact drying impact could be measured. Bulking agent reduced the drying shrinkage and the maximum drying shrinkage velocity, so paper bulk increased and paper strength decreased. When adding cationic starch to stock with the bulking agent for strengthening, the bulk was increased further with additional decreasing of the drying shrinkage and the maximum drying shrinkage velocity. Paper strength also increased except tensile stiffness index with decreasing the drying shrinkage and the maximum drying shrinkage velocity. When using additional strength additives for strengthening of fiber interfaces extended by bulking agent and cationic starch, amphoteric strength additive increased paper stiffness without loss of paper bulk. It was considered that the added amphoteric strength additives were cross-linked to the stretched cationic starch and this cross-linking increased elasticity of fiber-polymer-fiber interfaces without changing the drying behavior. Paper bulk could be increased with decreasing the maximum drying shrinkage velocity. The drying shrinkage of paper also could be controlled by fiber-to-fiber bonding interfaces by the bulking agent. In this case, paper strength including stiffness was decreased by reducing fiber-to-fiber bonding but it could be improved by strengthening fiber-to-fiber interfaces with polymer complex without loss of bulk.

Effect of pMDI or HDI Content in UMF Resin on Bonding High Moisture Content Veneers

  • Xu, Guang-Zhu;Eom, Young-Geun;Lee, Byoung-Ho;Kim, Hyun-Joong
    • Journal of the Korean Wood Science and Technology
    • /
    • v.38 no.5
    • /
    • pp.414-420
    • /
    • 2010
  • The effect of polymeric diphenyl methane-4,4-diisocyanate (pMDI) or 1,6-hexamethylene diisocyanate (HDI) in the UMF resin was discussed for improvement of the dry and wet shear strengths of plywood manufactured from high moisture content veneers. The curing behavior of UMF resin by pMDI or HDI content was examined by DSC and TGA, and its adhesion performance was evaluated by dry and wet shear strength tests of plywood. With the increase of pMDI content in the UMF resin, the curing temperature, reaction enthalpy (${\Delta}H$), and thermal stability consistently increased. With the increase of HDI content in the UMF resin, however, the curing temperature and reaction enthalpy (${\Delta}H$) decreased consistently and the thermal stability slightly increased in the range of 200 to $400^{\circ}C$ but decreased beyond $400^{\circ}C$. Also, the dry tensile shear strength increased up to the pMDI content of 5% and then decreased with its further addition but the wet tensile shear strength showed slight tendency to increase with the increase of pMDI content in the UMF resin. As the HDI content increased, however, the dry and wet tensile shear strengths of plywood consistently increased.

Physical Properties of Poly(vinyl alcohol) with Polyamide-epichlorohydrin as a Wet Strength Additive for Paper (Polyamide-epichlorohydrin 지력 증강제 함유 폴리비닐알코올의 물성 연구)

  • Jang, Yunjae;Lee, Hwaljong;Kang, Ho-Jong
    • Polymer(Korea)
    • /
    • v.37 no.6
    • /
    • pp.730-735
    • /
    • 2013
  • The physical properties of poly(vinyl alcohol) (PVA) with polyamide-epichlorohydrin (PAE) for wet strength additives in paper industry were investigated. Upon introducing PAE to PVA, not only melting and crystallization enthalpy in DSC but also the area of diffraction peaks in XRD decreased, which represented the fact that PAE acted as a crosslinking agent for PVA. However, this crosslinking seemed to be physical crosslinking having relatively less bonding energy compared to chemical crosslinking since the crystallization in PVA was able to take place by thermal annealing. This physical crosslinking and crystallization by thermal annealing enhanced the thermal stability and mechanical strength in PVA and consequently, these improvements are desired in the paper manufacturing process to increase the dry and wet strength in the paper.

THE EFFECT OF PRIMING ETCHED DENTIN WITH SOLVENT ON THE MICROTENSILE BOND STRENGTH OF HYDROPHOBIC DENTIN ADHESIVE (산 부식된 상아질에 대한 용매를 이용한 프라이밍이 소수성 상아질 접착제의 미세인장접착강도에 미치는 영향)

  • Park, Eun-Sook;Bae, Ji-Hyun;Kim, Jong-Soon;Kim, Jae-Hoon;Lee, In-Bog;Kim, Chang-Keun;Son, Ho-Hyun;Cho, Byeong-Hoon
    • Restorative Dentistry and Endodontics
    • /
    • v.34 no.1
    • /
    • pp.42-50
    • /
    • 2009
  • Deterioration of long-term dentin adhesion durability is thought to occur by hydrolytic degradation within hydrophilic domains of the adhesive and hybrid layers. This study investigated the hypothesis that priming the collagen network with an organic solvent displace water without collapse and thereby obtain good bond strength with an adhesive made of hydrophobic monomers and organic solvents. Three experimental adhesives were prepared by dissolving two hydrophobic monomers, bisphenol-A-glycidylmethacrylate (Bis-GMA) and triethyleneglycol dimethacrylate (TEGDMA), into acetone, ethanol or methanol. After an etching and rinsing procedure, the adhesives were applied onto either wet dentin surfaces (wet bonding) or dentin surfaces primed with the same solvent (solvent-primed bonding). Microtensile bond strength (MTBS) was measured at 48 hrs, 1 month and after 10,000 times of thermocycles. The bonded interfaces were evaluated using a scanning electron microscope (SEM). Regardless of bonding protocols, well-developed hybrid layers were observed at the bonded interface in most specimens. The highest mean MTBS was observed in the adhesive containing ethanol at 48 hrs. With solvent-primed bonding, increased MTBS tendencies were seen with thermo cycling in the adhesives containing ethanol or methanol. However, in the case of wet bonding, no increase in MTBS was observed with aging.

The Study on the Dry Floor Tile Unit System used Resin Mat (수지매트를 이용한 바닥타일 건식공법 시스템에 관한 연구)

  • 김성식;임남기;정병훈;정재영;정상진
    • Journal of the Korea Institute of Building Construction
    • /
    • v.1 no.2
    • /
    • pp.185-190
    • /
    • 2001
  • The purpose of this study is the development of practical Dry floor tile unit method that settle the defect of a wet method and designed for resin mat. With use of PE resin which is confirmed the basic property, it is developed that resin mat, joint-sealing compound with fixed form and space management to Dry floor tile unit method. The result of this study is below. 1) To acquire above the 4kgf/$\textrm{cm}^2$ - construction specification criterion, the bonding space that between resin mat and tile has to occupy the 50% of resin mat module space(10,000$\textrm{cm}^2$). 2) Criteria of bonding part plane is below. simpleness of metal form. productivity, uniform quality after injection molding cooling, easy cutting for remain space management, adhesive property, construction ability, transformation of a severed piece under pressure and so on. 3) To get the shape that could protect the interfacial breakdown, it is designed that resin mat and tile are unified after the bond input. 4) Adapted joint-sealing compound is the material of urethane kinds wedge form. Resin mat has the water passageway that could drain the water. 5) To manage the severed piece of tile, the resin mat is likely to divide the half and the quarter and the plastic drainage is developed in the severed piece.

  • PDF

Evaluating the bond strength between concrete substrate and repair mortars with full-factorial analysis

  • Felekoglu, Kamile Tosun;Felekoglu, Burcu;Tasan, A. Serdar;Felekoglu, Burak
    • Computers and Concrete
    • /
    • v.12 no.5
    • /
    • pp.651-668
    • /
    • 2013
  • Concrete structures need repairing due to various reasons such as deteriorative effects, overloading, poor quality of workmanship and design failures. Cement based repair mortars are the most widely used solutions for concrete repair applications. Various factors may affect the bond strength between concrete substrate and repair mortars. In this paper, the effects of polymer additives, strength of the concrete substrate, surface roughness, surface wetness and aging on the bond between concrete substrate and repair mortar has been investigated. Full factorial experimental design is employed to investigate the main and interaction effects of these factors on the bond strength. Analysis of variance (ANOVA) under design of experiments (DOE) in Minitab 14 Statistical Software is used for the analysis. Results showed that the interaction bond strength is higher when the application surface is wet and strength of the concrete substrate is comparatively high. According to the results obtained from the analysis, the most effective repair mortar additive in terms of bonding efficiency was styrene butadiene rubber (SBR) within the investigated polymers and test conditions. This bonding ability improvement can be attributed to the self-flowing ability, high flexural strength and comparatively low air content of SBR modified repair mortars. On the other hand, styrene acrylate rubber (SAR) modified mortars was found incompatible with the concrete substrate.

Performance of steel beams strengthened with pultruded CFRP plate under various exposures

  • Gholami, M.;Sam, A.R. Mohd;Marsono, A.K.;Tahir, M.M.;Faridmehr, I.
    • Steel and Composite Structures
    • /
    • v.20 no.5
    • /
    • pp.999-1022
    • /
    • 2016
  • The use of Carbon Fiber Reinforced Polymer (CFRP) to strengthen steel structures has attracted the attention of researchers greatly. Previous studies demonstrated bonding of CFRP plates to the steel sections has been a successful method to increase the mechanical properties. However, the main limitation to popular use of steel/CFRP strengthening system is the concern on durability of bonding between steel and CFRP in various environmental conditions. The paper evaluates the performance of I-section steel beams strengthened with pultruded CFRP plate on the bottom flange after exposure to diverse conditions including natural tropical climate, wet/dry cycles, plain water, salt water and acidic solution. Four-point bending tests were performed at specific intervals and the mechanical properties were compared to the control beam. Besides, the ductility of the strengthened beams and distribution of shear stress in adhesive layer were investigated thoroughly. The study found the adhesive layer was the critical part and the performance of the system related directly to its behavior. The highest strength degradation was observed for the beams immersed in salt water around 18% after 8 months exposure. Besides, the ductility of all strengthened beams increased after exposure. A theoretical procedure was employed to model the degradation of epoxy adhesive.

Fabrication of Field-Emitter Arrays using the Mold Method for FED Applications

  • Cho, Kyung-Jea;Ryu, Jeong-Tak;Kim, Yeon-Bo;Lee, Sang-Yun
    • Transactions on Electrical and Electronic Materials
    • /
    • v.3 no.1
    • /
    • pp.4-8
    • /
    • 2002
  • The typical mold method for FED (field emission display) fabrication is used to form a gate electrode, a gate oxide layer, and emitter tip after fabrication of a mold shape using wet-etching of Si substrate. However, in this study, new mold method using a side wall space structure was developed to make sharp emitter tips with the gate electrode. In new method, gate oxide layer and gate electrode layer were deposited on a Si wafer by LPCVD (low pressure chemical vapor deposition), and then BPSG (Boro phosphor silicate glass) thin film was deposited. After then, the BPSG thin film was flowed into the mold at high temperature in order to form a sharp mold structure. TiN was deposited as an emitter tip on it. The unfinished device was bonded to a glass substrate by anodic bonding techniques. The Si wafer was etched from backside by KOH-deionized water solution. Finally, the sharp field emitter array with gate electrode on the glass substrate was formed.