• Journal of Adhesion and Interface
• /
• v.8 no.3
• /
• pp.16-23
• /
• 2007

Polyester fabrics and knits were corona treated with different current intensity (5, 10, 15, 20 A) and feeding speed (5, 10, 15 m/min). We confirmed the surface change of polyester fabrics and knits using scanning electron microscopy (SEM) and X-ray photoelectron spectrometer (XPS). And the change of physical properties through measuring the tensile strength, dry and wet bonding strength. Thermosetting reactive polyurethane hot melt adhesive was used in the adhesion of polyester fabrics and knits. Functional groups were introduced on PET fabrics and knits surface by treating the PET fabrics and knits in air atmosphere with corona discharge, and take placed unevenness, the result adhesion was improved. When consider both dry and wet bonding strength, we think that appropriate conditions in the PET fabrics corona treatment are feeding speed 10 m/min, current intensity 15 A and appropriate conditions in the mesh type PET knits corona treatment are feeding speed 10 m/min, current intensity above 10 A.

• Journal of Korean Dental Science
• /
• v.17 no.1
• /
• pp.36-44
• /
• 2024

Purpose: This study investigated the effect of dentin bonding agent acidity on surface microhardness of MTA. Materials and Methods: Forty cylindrical molds (3 mm×5 mm) were prepared, and three dentin bonding agents with different acidities: Adper Single Bond 2 (ASB), Single Bond Universal (SBU), and Clearfil SE bond 2 (CSE) were applied to the inner surface of the molds (n=10). No bonding agent was applied in the control group. MTA was mixed and inserted into the molds and sealed with a wet cotton pellet for 4 days. After setting, the Vickers microhardness (HV) test was done at 200, 400, 600 ㎛ from the inner surface of the mold. One-way ANOVA was conducted for all samples. A P-value of less than .05 was considered significant. Tukey HSD test was performed for post-hoc analysis. Results: The mean HV values and standard deviations were 67.02±11.38 (Con), 48.76±11.33 (ASB), 43.78±11.19 (CSE), 37.84±9.36 (SBU), respectively. The difference between the control group and the experimental groups was statistically significant (P<0.001). The difference between ASB and SBU was statistically significant (P<0.001), while the difference between SBU and CSE was not. There were no statistically significant differences between the various points from the inner surface of the mold within each group (P>0.05). Conclusion: Results of the current study indicate that use of dentin bonding agents with MTA can reduce the surface microhardness of MTA. Moreover, there is a direct relationship between the acidity of dentin bonding agents and the surface microhardness of MTA.

• Journal of the Korean Wood Science and Technology
• /
• v.27 no.3
• /
• pp.63-72
• /
• 1999

For the purpose of improving the wet strength properties of paper, cellulosic fibers were modified by the processes of carbarmoylethylation and N-chlorocarbamoylethylation. Carbamoylethylated cellulose was prepared by the reaction of acrylamide with cellulosic fibers under the alkali catalyst, and N-chlorocarbamoylethylated cellulose was prepared by the addition of sodium hypochlorite into the carbamoylethylated cellulose. In carbamoylethylation reaction, the conditions of NaOH concentration, temperature and acrylamide addition rate were considered to be important factors. An initial reactivity and degree of substitution(DS) in carbamoylethylation of cellulosic fibers were effective according to increasing the addition rates of alkali, acrylamide and the temperature condition of $40^{\circ}C$. The effective wet strength properties by N-chlorocarbamoylethylation of cellulosic fibers were indicated under the conditions of DS 0.06. The wet strength of sheet was improved to 85% at the 100% basis of dry strength. From the photograph of scanning electron microscopy, fiber cuttings on the edge of sheet sample used in tensile strength testing were found in the N-chlorocarbamoylethylated sheet, due to the improvement of fiber bonding strength. The hypochlorite treatment was effective in the recycling of N-chlorocarbamoylethylated sheet, and was reduced the wet strength of sheet to be able to reslush.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.21 no.2
• /
• pp.111-117
• /
• 2008

We have studied surface roughness, contamination of impurity, bonding with some gas element, reflectance and zeta potential on masks to be generated or changed during photolithography/dry or wet etching process. Mask surface roughness was not changed after photolithography/dry etching process. But surface roughness was changed on some area under MoSi film of Cr/MoSi/Qz. There was not detected any impurity on mask surface after plasma dry etching process. Reflectance of mask was increased after variable plasma etching treatment, especially when mask was treated with plasma including $O_2$ gas. Blank mask was positively charged when the mask was treated with Cr plasma etching gas($Cl_2:250$ sccm/He:20 $sccm/O_2:29$ seem, source power:100 W/bias power:20 W, 300 sec). But this positive charge was changed to negative charge when the mask was treated with $CF_4$ gas for MoSi plasma etching, resulting better wet cleaning. There was appeared with negative charge on MoSi/Qz mask treated with Cr plasma etching process condition, and this mask was measured with more negative after SC-1 wet cleaning process, resulting better wet cleaning. This mask was charged with positive after treatment with $O_2$ plasma again, resulting bad wet cleaning condition.

• Journal of the Microelectronics and Packaging Society
• /
• v.19 no.1
• /
• pp.39-45
• /
• 2012

Three-dimensional integrated circuit(3D IC) technology has become increasingly important due to the demand for high system performance and functionality. In this work, BOE and HF wet etching of Cu line surfaces after CMP were conducted for Cu-Cu pattern direct bonding. Step height of Cu and $SiO_2$ as well as Cu dishing after Cu CMP were analyzed by the 3D-Profiler. Step height increased and Cu dishing decreased with increasing BOE and HF wet etching times. XPS analysis of Cu surface revealed that Cu surface oxide layer was partially removed by BOE and HF wet etching treatment. BOE treatment showed not only the effective $SiO_2$ etching but also reduced dishing and Cu surface oxide rather than HF treatment, which can be used as an meaningful process data for reliable Cu-Cu pattern bonding characteristics.

• Journal of the korean academy of Pediatric Dentistry
• /
• v.30 no.4
• /
• pp.545-553
• /
• 2003

To achieve good dentin bonding, we must obtain proper wet dentin surface. The purpose of this study was to compare dentin surface according to different wetness degree by AFM image as studying how to obtaining proper wet dentin surface. Intact recently extracted primary teeth were used in the study. The extracted teeth were stored in distilled water at $4^{\circ}C$ until prepared. The teeth were used to prepare 1mm thick dentin disks with exposed surfaces parallel to the occlusal surfaces. The surface of the dentin were polished with polishing disk. The sample were ultrasonically cleaned with distilled water. The sample of each group were treated by different ways. We compared dentin surface of each group by AFM image. From the experiment, the following results were obtained. 1. Acid etching in the dentin surface of primary teeth, resulted in the removal of the smear layer, which opened dentinal tubules, caused the demineralization of peritubular and intertubular dentin, and exposed a collagen-rich transition zone. 2. If the etched dentin was so dehydrated, the intertubular dentin surfaces deceased in height and the diameters of the dentinal tubules decreased slightly. 3. In the group dried with compressed air for 20 seconds at 2 cm, the dentin surfaces were too excessive dried and dehydrated. 4. In the group dried with compressed air for 3 seconds at 2 cm, dry cotton, wet cotton, microbrush and absorbent tissue paper, the dentin surfaces were properly wet.

• Journal of the Korean Ceramic Society
• /
• v.15 no.2
• /
• pp.89-97
• /
• 1978

The basic mechanism of adherence in sintered high purity alumina ceramic-to-metal bonding was studied. Emphasis was placed on flux composition, porosity of the fired ceramics, and metallizing mixtures. The study was conducted on 95 and 99.5% alumina, using molydbenum-manganese, molybdenum-manganese-silicon dioxide metallizing compositions. Metallizing was performed in wet hydrogen (dew point, ＋17$^{\circ}C$) at 145$0^{\circ}C$ for 45min. This experiment indicated that adhernece mechanism of ultra high purity alumina ceramic was attributed to formation of $MnAl_2O_$4, and in the case of 95% alumina containing glass, the migration of glass from the interface into the void of the metal coating was the main role to the adhrence. It showed also that greater the bond-strength was resulted as porosity was increased.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2001.07a
• /
• pp.347-350
• /
• 2001

A typical Mold method is to form a gate electrode, a gate oxide, and emitter tip after fabrication of mold shape using wet-etching of Si substrate. In this study, however, new Mold method using a side wall space structure is used in order to make sharper emitter tip with a gate electrode. Using LPCVD(low pressure chemical vapor deposition), a gate oxide and electrode layer are formed on a Si substrate, and then BPSG(Boro phospher silicate glass) thin film is deposited. After, the BPSG thin film is flowed into a mold as high temperature in order to form a sharp mold structure. Next TiN thin film is deposited as a emitter tip substance. The unfinished device with a glass substrate is bonded by anodic bonding techniques to transfer the emitters to a glass substrate, and Si substrate is etched using KOH-deionized water solution. Finally, we made sharp field emitter array with gate electrode on the glass substrate.

• Transactions on Electrical and Electronic Materials
• /
• v.1 no.1
• /
• pp.6-11
• /
• 2000

The hydrogen plasma treatment of silicon wafers in the reactive ion-etching mode was studied for the application to silicon-on-insulator wafers which were prepared using the wafer bonding technique. The chemical reactions of hydrogen plasma with surface were used for both surface activation and removal of surface contaminants. As a result of exposure of silicon wafers to the plasma, an active oxide layer was found on the surface. This layer was rendered hydrophilic. The surface roughness and morphology were examined as functions of the plasma exposing time and power. In addition, the surface became smoother with the shorter plasma exposing time and power. The value of initial surface energy estimated by the crack propagation method was 506 mJ/㎡, which was up to about three times higher as compared to the case of conventional direct using the wet RCA cleaning method.

• Journal of the Korean Wood Science and Technology
• /
• v.39 no.1
• /
• pp.21-27
• /
• 2011

This study was carried out to examine properties of water resistant plywood by using serum protein adhesive which is natural, environment-friendly and human-friendly. For the preparation of the serum protein adhesive, pig blood from slaughterhouse was centrifuged and serum was separated from corpuscles and concentrated to 30% by dry weight basis. This concentrated serum protein was modified with PF resin (50% NVC) with the ratio of 9 : 2.5. Plywood made by this modified serum protein gave 1.21 N/$mm^2$ of dry bonding strength, 0.80 N/$mm^2$ of wet boil bonding strength, 0% of cyclic delamination test value, and 0.025 ppm of HCHO emission, which met the excellent super $E_0$ grade and water resistant plywood.