• Resources Recycling
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• v.10 no.6
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• pp.15-21
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• 2001

Shape-controlled copper oxides have been recovered from copper-containing waste etchant by neutralization with alkalihydroxide. Large amount of copper-containing waste etchant is generated from Printed Circuit Board industry. In an environmental and economic point of view, retrieve of the valuable natural resource from the waste is important. In recycling process of copper oxide from the waste etchant, reaction temperature controls shapes and sizes of the products. Copper oxide recovered below reaction temperature $40^{\circ}C$ was of a needle shape, while copper oxide comes in a platy shape above $40 ^{\circ}C$ . Physical properties of samples have been characterized using SEM, XRD, TGA and Atomic absorption spectroscopy.

• Resources Recycling
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• v.12 no.2
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• pp.3-10
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• 2003

Copper oxychloride used as an agricultural fungicide has been recovered from copper-containing waste etchant by the neutralization with alkali hydroxides. Large amount of copper-containing waste etchant is generated from Printed Circuit Board industry. In an environmental and economic point of view, retrieve of the valuable natural resource from the waste is important. Recycling process of copper oxychloride from the waste etchant is discovered through the our study. In the range of reaction temp. 2$0^{\circ}C$-4$0^{\circ}C$, pH 5-7, pure copper oxychloride was able to prepare and the yield of copper oxychloride was higher than 95%. Physical properties of the sample have been characterized using SEM, XRD, TGA, ICP and Atomic absorption spectroscopy.

• Applied Chemistry for Engineering
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• v.24 no.1
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• pp.67-71
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• 2013

$FeCl_3$ has been used as an etchant for metal etching such as Fe, Cu, and Al. In the process of metal etching, $Fe^{3+}$ is reducted to $Fe^{2+}$ and the etching rate becomes slow and etching efficiency decreased. Waste $FeCl_3$ etchant needs to be regenerated because of its toxicity and treatment cost. In this work, HCl was initially mixed with the waste $FeCl_3$ and then, strong oxidants, such as $O_2$ and $H_2O_2$, were added into the mixed solution to regenerate the waste etchant. During successive etching and regeneration processes, oxygen-reduction potential (ORP) was continuously measured and the relationship between ORP and etching capability was investigated. Regenerated etchant using a two vol% HCl of the total etchant volume and a very small amount of $H_2O_2$ was very effective in recovering etching capability. During the etching-regeneration process, the same oxygen-reduction potential variation cannot be repeated every cycle since concentrations of $Fe^{2+}$ and $Fe^{3+}$ ions were continuously changed. It suggested that the control of etching-regeneration process based on the etching time becomes more efficient than that of the process based on oxygen reduction potential changes.

• Clean Technology
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• v.15 no.3
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• pp.165-171
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• 2009

In this study, we found out the relation between $FeCl_3$ recovering-concentration and stage number of extraction process for invar (Fe+Ni) etching process. In order to get the desired $FeCl_3$ recovering-concentration economically, we developed the simulation program for designing the optimal $FeCl_3$ extraction process. We got the key parameter for this simulation program through pilot scale experiments. The process simulation by the developed program could reduce the emission of waste etching solution as well as the treatment costs. In addition, the developed program could calculate the number of stage of the etchant recovering system and the process time to get the desired concentration of $FeCl_3$. This program was used to compute the optimal capacity of the etchant recovering system and applied to the optimization of the stage of the etchant recovering system in real IT industry.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.27 no.6
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• pp.303-308
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• 2017

The $FeCl_3$ waste solution used to etch various metals contains valuable metal such as nickel. In this study, we recovered as high purity nickel carbonate crystalline powders from nickel-containing etching waste solution after regeneration of iron chloride. Firstly we eliminated about of the iron impurities under the condition of pH 4 using 5 % NaOH aqueous solution and then removed the remaining impurities such as Ca, Mn and Zn etc. by using solvent extractant D2EHPA (Di-(2-ethylhexyl) phosphoric acid). Thereafter, nickel carbonate powder having a purity of 99.9 % or more was obtained through reaction with sodium carbonate in a nickel chloride solution.

• Clean Technology
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• v.18 no.2
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• pp.183-190
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• 2012

Electrochemical regeneration of the iron chloride waste solution from PCB etching reduces environmental contamination and produces copper as by-product, so the economic feasibility is high. But iron chloride waste solution contains iron and copper and the reactions occurring in the electrolytic cell are complicated. In this work, the oxidation of iron chloride and copper deposition were examined through batch electrolysis and the optimum conditions of the process parameters were found. The oxidation of ferrous chloride was achieved easily to the desired level. The copper deposition efficiency was high in the reaction using the carbon cathode when the copper density was 12 g/L with the electric current density of $350mA/cm^2$, and the ratio of the $Fe^{2+}$ ion was high. In addition, the possibility of the scale-up was confirmed in continuous operation of bench reactor using the optimum conditions obtained.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.21 no.5
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• pp.397-401
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• 2008

Most of the topic in PCB industry was about increasing the volume of product for the development of electronics in numerous industrial application area. However, it has been emerged that yield improvement quality manufacturing via detecting any suspicious process in order to minimize the scrapped product and material waste. In addition, recently, restriction of hazardous substances (RoHS) claims that electronic manufacturing environment should reduce the harmful chemicals usage, thus the importance of monitoring copper etchant and detecting any mis-processing is crucial for electronics manufacturing. In this paper, we have developed real-time chemical monitoring system using RGB sensor, which is simpler but more accurate method than commercially utilized oxidation reduction potential (ORP) technique. The developed Cu etchant monitoring system can further be utilized for copper interconnect process in future nano-semiconductor process.

• Proceedings of the Korean Radioactive Waste Society Conference
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• 2005.11b
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• pp.300-315
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• 2005

Recently plasma surface-cleaning or surface-etching techniques have been focused in the respect of decontamination of spent or used nuclear parts and equipment. In this study decontamination rate of metallic cobalt surface was experimentally investigated via its surface etching rate with a $CF_4-O_2$ mixed gas plasma and metallic surface wastes of cobalt oxides were simulated and decontaminated with $NF_3$ - Ar mixed gas plasma. Experimental results revealed that a mixed etchant gas with about $80{\%}\;CF_4-20{\%}\;O_2$ gives the highest reaction rate of cobalt disk and the rate reaches with a negative 300 DC bias voltage up to $0.43\;{\mu}m$/min at $380^{\circ}C$ and $20{\%}\;NF_3-80\%$ Ar mixed gas gives $0.2\;{\mu}m$/min of reaction rate of cobalt oxide film.

• Resources Recycling
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• v.19 no.5
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• pp.44-49
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• 2010

SiC powders have been recovered from silicon-containing waste slurry by carbothermal reduction method with carbon black. Large amount of silicon-containing waste slurry is generated from Solar Cell industry. In an environmental and economic point of view, retrieve of the valuable natural resource from the silicon waste is important. In this study, SiC powder recovered by the reaction ball-milled silicon powder from waste and carbon black at $1350^{\circ}C$ for 3h under vacuum condition. Physical properties of samples have been characterized using SEM, XRD, Particle size analyzer and FT-IR spectroscopy.

• Proceedings of the Korean Radioactive Waste Society Conference
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• 2004.06a
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• pp.32-42
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• 2004

Recently, plasma surface-cleaning or surface-etching techniques have been focused in respect of the decontamination of spent or used nuclear parts and equipment. In this study the removal rate of metallic cobalt surface is experimentally investigated via its surface etching rate with a $CF_4-o_2$mixed gas plasma. Experimental results reveal that a mixed etchant gas with about 80% $CF_4$-20% $O_2$ (molar) gives the highest reaction rate and the rate reaches 0.06 ${\mu}m$/min at $380^{\circ}C$ and ion-assisted etching dramatically enhances the surface reaction rate. With a negative 300 V DC bias voltage applied to the substrate, the surface reaction initiation temperature lowers and the rate increases about 20 times at $350^{\circ}C$ and up to 0.43 ${\mu}m$/min at $380^{\circ}C$, respectively. Surface morphology analysis confirms the etching rate measurements. Auger spectrum analysis clearly shows the adsorption of fluorine atoms on the reacted surface. From the current experimental findings and the results discussed in previous studies, mechanistic understanding of the surface reaction, fluorination and/or fluoro-carbonylation reaction, is provided.