• 제목/요약/키워드: Wafer Content

검색결과 53건 처리시간 0.033초

PV모듈의 cell crack 방지를 위한 EVA Sheet의 최적 Gel content 특성 (The Optimimum Gel Content Characteristics for Cell Cracks Prevention in PV Module)

  • 강경찬;강기환;김경수;허창수;유권종
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2008년도 제39회 하계학술대회
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    • pp.1108-1109
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    • 2008
  • To survive in outdoor environments, photovoltaic modules rely on packaging materials to provide requisite durability. We analyzed the properties of encapsulant materials that are important for photovoltaic module packaging. Recently, the thickness of solar cell gets thinner to reduce the quantity of silicon. And the reduced thickness make it easy to be broken while PV module fabrication process. Solar cell's micro cracks are increasing the breakage risk over the whole value chain from the wafer to the finished module, because the wafer or cell is exposed to tensile stress during handling and processing. This phenomenon might make PV module's maximum power and durability down. So, when using thin solar cell for PV module fabrication, it is needed to optimize the material and fabrication condition which is quite different from normal thick solar cell process. Normally, gel-content of EVA sheet should be higher than 80% so PV module has long term durability. But high gel-content characteristic might cause micro-crack on solar cell. In this experiment, we fabricated several specimen by varying curing temperature and time condition. And from the gel-content measurement, we figure the best fabrication condition. Also we examine the crack generation phenomenon during experiment.

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램프 가열 방식 LPCVD 장비의 설계 및 제작 (Design and Implementation of Lamp-Heated LPCVD System)

  • 하용민;김태성;김충기
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 1991년도 추계학술대회 논문집 학회본부
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    • pp.299-303
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    • 1991
  • A lamp heated LPCVD equipment has been made. Wafer is heated by an array of fifteen tungsten halogen lamps above the front side of a wafer and pyrometer views the back side of the wafer through $CaF_2$ window. Reactor which consisits of a quartz window and a water cooled-stainless steel plate can be evacuated to $5{\times}10^{-3}$ torr with a rotary vane pump. By pyrolysis of $SiH_4$ at about $600^{\circ}C$, polysilicon has been formed on the silicon dioxide film. The measured results show that thickness nonuniformity is 15% and temperature nonuniformity is 1.1%. Because activation energy of pyrolysis of $SiH_4$ is very high, about 1.8eV, small temperature variation will induce large thickness nonuniformity. The main cause of temperature nonuniformity is unsymmetry of lamp power and an unbalanced cooling structure. Charls & Evans' SIMS result shows that the oxygen content in the deposited polysilicon is comparable to that of silicon substrate but carbon content is ten times higher.

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MOCVD법에 의한 TiO2 박막의 제조에 미치는 산소의 영향 (Effects of Oxygen on Preparation of TiO2 Thin Films by MOCVD)

  • 유성욱;박병옥;조상희
    • 한국결정학회지
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    • 제6권2호
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    • pp.111-117
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    • 1995
  • 화학증착법에 의해 TiO2 박막을 Si-wafer(100)위에 제조하였다. Titanium tetraisopropoxide (TTIP)를 출발물질로 하여 200-500℃의 온도범위에서 증착을 행하였다. 증착된 박막의 두께는 Ellipsometry 및 SEM을 사용하여 측정하였으며, 산소의 함량에 따른 증착층의 성분분석은 ESCA를 사용하였다. TiO2 박막의 증착속도는 산소의 함량에 따라 증가하였고, 반응가스인 산소를 공급하지 않았을 때 증착층내에 불순물로 탄소가 존재하였으며, 증착층의 성분은 내부로 갈수록 TiO2에서 Ti로 변하였다. 산소를 600scm 공급하였을 때 증착층내에 소량의 탄소가 존재하였으며, 증착층의 성분은 내부로 갈수록 TiO2에서 TiO, Ti로 됨을 알 수 있었다. 산소를 1200scm공급하였을 때 증착층내에 탄소가 존재하지 않았으며, 증착층 성분은 표면에는 TiO2를 이루나 증착층 내부로 갈수록 Ti복합화합물을 이루고 있었다.

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대전 방지용 웨이퍼 캐리어의 전기적 특성 (The Electrical Characteristics of the Antistatic Wafer Carrier)

  • 채종윤;윤종국;강옥구;류봉조;구경완
    • 전기학회논문지
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    • 제63권2호
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    • pp.319-324
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    • 2014
  • The wafer carrier is made of PP, PC, PE resin which have excellent heat and chemical resistance and electrical properties. However, particle generation has become a problem due to static electricity generated in the carrier. Some conductive material such as carbon black (CB) and carbon fiber (CF) are added for the purpose of anti-static, however, additional for motility and particle contamination problems due to high carbon content occurs. In this paper, the electrical characteristics and workability are observed and compared by adding low Carbon Nono Tube(CNT) to each PP, PC and PE resin to solve the problem.

Optical and Electrical Properties of $Ti_xSi_{1-x}O_y$ Films

  • Lim, Jung-Wook;Yun, Sun-Jin;Kim, Je-Ha
    • ETRI Journal
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    • 제31권6호
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    • pp.675-679
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    • 2009
  • $Ti_xSi_{1-x}O_y$ (TSO) thin films are fabricated using plasma-enhanced atomic layer deposition. The Ti content in the TSO films is controlled by adjusting the sub-cycle ratio of $TiO_2$ and $SiO_2$. The refractive indices of $SiO_2$ and $TiO_2$ are 1.4 and 2.4, respectively. Hence, tailoring of the refractivity indices from 1.4 to 2.4 is feasible. The controllability of the refractive index and film thickness enables application of an antireflection coating layer to TSO films for use as a thin film solar cell. The TSO coating layer on an Si wafer dramatically reduces reflectivity compared to a bare Si wafer. In the measurement of the current-voltage characteristics, a nonlinear coefficient of 13.6 is obtained in the TSO films.

니페디핀을 함유한 생분해성 PLGA 웨이퍼의 제조와 특성분석 (Characteristics of Nifedipine Loaded PLGA Wafer)

  • 서선아;최학수;이동헌;강길선;이해방
    • 폴리머
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    • 제25권6호
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    • pp.884-892
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    • 2001
  • 고혈압 치료제로 사용되는 니페디핀을 지속적으로 방출하는 제형을 제조하기 위하여 poly(L-lactide-co-glycolide) 글리코리드와 랙티드의 몰비 50: 50, 분자량:5000 g/mole)를 이용하여 직접 압축성형 방법으로 생분해성 웨이퍼를 제조하였다. 약물과 고분자의 함량비, 웨이퍼의 두께, 하이드록실 메틸셀룰로오스 (HPMC) 함유량 등을 조절하여 PLGA 웨이퍼를 제조하였고, 이들의 형태학적 특성과 방출거동 및 분해거동을 조사하였다. 제조된 웨이퍼는 11일동안 영차의 안정한 방출거동을 보였고, HPMC를 첨가함으로써 초기 방출거동을 제어하는 등 조건을 달리함으로써 방출거동을 조절할 수 있었다. 수분흡수율과 무게변화를 조사한 결과, 방출 실험 4일부터 웨이퍼의 무게 감소가 현저하게 발생하였고, 방출이 완료된 후에는 무게가 약 40% 감소하였다. 이러한 약물전달 시스템은 압축성형방법에 의해 제조하므로 제조가 간단하고, 약물방출 속도를 정확하게 제어할 수 있으므로 이식을 위한 제형으로 제조시 유용하게 쓰일 것으로 예상되었다.

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SiNx 층이 코팅된 Si Wafer에 바인더 종류에 따른 Ag 페이스트의 인쇄 특성 (Printing Properties of Ag Paste with the Variation of Binder on the SiNx Coated Si Wafer)

  • 강재원;신효순;여동훈;정대용
    • 한국전기전자재료학회논문지
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    • 제27권2호
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    • pp.85-90
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    • 2014
  • Ag paste has been used in the front electrode of the Si-solar cell. It is composed by Ag powder, glass frit, binder, solvent and dispersant. The role of the binder and the solvent is to make a flow and a printing property. However, it was not enough to report the printing properties with the variation of binder in the controled viscosity. In this study, we selected 3 kinds of typical binder which were used as binder for the paste in the industry, such as Ethyl cellulose, Hydroxypropyl cellulose and Acrylic. Ag pastes using these were prepared, controled viscosity and printed on the SiNx coated Si wafer. In the 'A paste' used Acrylic binder, printed hight was highest and 'H paste' used Hydroxypropyl cellulose binder was lowest. Because 'H paste' was high viscosity due to the molecular weight, the solvent was added in the paste to control the viscosity. Therefore, the content of solid was lower in 'H paste'. The relative pattern width which is related to the spreading of paste was the best in the case of 'H paste' and 'EH paste' at $30^{\circ}C$. It is thought that the optimization of the relative pattern width is possible for a paste by the controling shear thinning phenomenon. In the case of 'A paste', though printing hight was best, the pattern width was dependant on the temperature.

실리콘 태양전지용 Ag pastes 에서의 무연 프릿에 따른 Ag, Si간 접촉 형성 (Contact Formation Between Ag and Si With Lead-Free Frits in Ag Pastes For Si Solar Cells)

  • 김동선;황성진;김종우;이정기;김형순
    • 한국신재생에너지학회:학술대회논문집
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    • 한국신재생에너지학회 2010년도 춘계학술대회 초록집
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    • pp.61.2-61.2
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    • 2010
  • Ag thick-film has usually been used for the front electrode of Si solar cells with the outstanding electrical properties. Ag paste consists of Ag powers, vehicles, frits and additives. Ag paste has broadly been screen-printed on the front side of Si wafer with the merits of low cost and simplicity. The optimal contact formation between Ag electrodes and Si wafer in the front electrode during a fast firing has been considered as the key factor for high efficiency. Although the content of frit in Ag pastes is less than 5wt%, it can profoundly influence the contact formation between Ag and Si under the fast firing. In this study, the effects of lead-free frits on the contacts between Ag and Si were studied with the thermal properties and compositions of various frits. Our experimental results showed that the electrical properties of cells were related to the interface structures between Ag and Si. It was found that current path of electrons from Si to Ag would be possible through the tunneling mechanism assisted by tens of nano-Ag recrystals on $n^+$ emitter as well as Ag recrystals penetrated into $n^+$ emitter layers. These preliminary studies will be helpful for designing the proper frits for the Ag pastes with considering the properties of various Si wafers.

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Effect of Doping Si in DLC Thin Films Growth on Their Mechanical Properties

  • 김대영;박민석;진인태
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
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    • pp.369.2-369.2
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    • 2014
  • Diamond-like Carbon(DLC) films doping Si were deposited by linear ion source(LIS)-physical vapor deposition method on Si wafer. We have studied the effects of Si content on friction and wear properties of DLC films and the characteristics of the films were investigated using Nano-indentation, Micro raman spectroscopy, Field Emission-Scanning Electron Microscope (FM-SEM) and X-ray Photoelectron Spectroscopy (XPS). The films has been various low-friction and low-stress by varying the flow rates of silane gas. Under the about 2% of Si doping is very suitable for improving the adhesion of films and reducing internal stress while maintaining the surfaces hardness of DLC films. Linear ion source (LIS)를 사용하여 Si wafer위에 Si 이온이 첨가된 DLC 박막을 증착하였다. 참가된Si 이온의 양에 따라 DLC 박막에 미치는 영향을 분석하기 위하여 마찰 계수 및 경도를 비교하였고, Micro raman spectroscopy, Field Emission-Scanning Electron Microscope (FM-SEM) and X-ray Photoelectron Spectroscopy (XPS)를 통하여 표면 상태를 분석하였다. 천체 주입된 가스량의 약 2%까지 Si 이온 주입이 늘어날수록 DLC 박막의 마찰계수는 낮아졌고, 경도는 Si 이온이 주입되지 않았을 경우와 비슷한 값(약 20~23 GPa)을 가졌다. 2% 이상의 주입량에서는 마찰계수는 주입량이 늘어날수록 높아졌으며 경도는 떨어지는 경향을 보였다. 이는 Si이온이 2%이하로 첨가되었을 경우, DLC 박막의 생성시 탄소 이온들의 결합 Stress를 줄여 마찰계수가 줄어든다고 볼 수 있으며, 그 양이 2%이상이 되면 오히려 불순물로 작용하여 DLC 박막의 Stress는 급격히 증가하고 마찰계수도 높아짐을 알 수 있다.

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개발 웨이퍼 검사위한 Confocal 이미징 시스템의 개발 (Development of Confocal Imaging System for Wafer Inspection)

  • 고국원;다이 느엔 콩;고경철
    • 한국산학기술학회:학술대회논문집
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    • 한국산학기술학회 2010년도 춘계학술발표논문집 1부
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    • pp.108-112
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    • 2010
  • Confocal Imaging System is an essential machine for a wide range of inspection wafer. For concurrent and fast acquiring the image data of four channels, the new image acquisition system used the protocol of camera-link standard with the full mode of configuration in interconnection with a frame grabber integrated in a computer, which is popularly used for many cameras, so the programming environment of image processing is optional such as Visual C++, Matlab. In addition, many conventional methods were coordinately used for contribution to build the high quality of images for precise processing analog signals of PhotoMutiplier Tubes(PMTs), accurate control of scanning device, sensitivity of PMTs, and laser source. The prototype of new image acquisition system, could meet the goal of development, it is used in LSCM for high content screening to investigation the processes of elements of living specimens at the same time by simultaneous grab image data on 4 PMTs channels.

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