• 제목/요약/키워드: Vth

검색결과 86건 처리시간 0.028초

액상공정으로 제작된 ZrInZnO 박막 트랜지스터의 전기적 특성에 관한 연구 (Study on the Electrical Characteristics of Solution-processed ZrInZnO Thin-film Transistors)

  • 정태훈;김시준;윤두현;정웅희;김동림;임현수;김현재
    • 한국전기전자재료학회논문지
    • /
    • 제24권6호
    • /
    • pp.458-462
    • /
    • 2011
  • Soution-processed ZrInZnO (ZIZO) thin-film transistors (TFTs) with varying Zr content were fabricated. The ZIZO TFT (Zr=20 at. %/Zn) has an optimal performance with the saturation field effect mobility of 0.77 $cm^2/Vs$, the threshold voltage (Vth) of 2.1 V, the on/off ratio of $4.95{\times}10^6$, and subthreshold swing (S.S) of 0.73 V/decade. Using this optimized ZIZO TFT, the positive and negative gate bias stress according to annealing temperature was also investigated. While the Vth shifts dramatically after 1,000 s of both gate bias stresses, variations in the S.S are negligible. It suggests that electrons or holes are tem porarily trapped in the gate insulator, the semiconductor, or the interface between both layers.

4H-SiC UMOSFET의 gate dielectric 물질에 따른 온도 신뢰성 분석 (Temperature reliability analysis according to the gate dielectric material of 4H-SiC UMOSFET)

  • 정항산;허동범;김광수
    • 전기전자학회논문지
    • /
    • 제25권1호
    • /
    • pp.1-9
    • /
    • 2021
  • 본 논문에서는 고전압, 고전류 동작에 적합한 4H-SiC UMOSFET에 대해서 연구하였다. 일반적으로 SiO2는 SiC MOSFET에서 gate dielectric으로 가장 많이 사용되는 물질이다. 하지만 4H-SiC보다 유전 상수 값이 2.5배 낮아서 높은 전계를 갖게 되므로 SiO2/SiC 접합 부분에서 열악한 특성을 갖는다. 따라서 high-k 물질을 gate dielectric으로 적용한 소자를 SiO2를 적용한 소자와 TCAD 시뮬레이션을 통해 전기적 특성을 비교하였다. 그 결과 BV 감소, VTH 감소, gm 증가, Ron 감소를 확인하였다. 특히 온도가 300K일 때, Al2O3와 HfO2의 Ron은 66.29%, 69.49%가 감소하였으며 600K일 때도 39.71%, 49.88%가 감소하였다. 따라서 Al2O3와 HfO2가 고전압 SiC MOSFET의 gate dielectric 물질로써 적합함을 확인하였다.

Degradation Pattern of Black phosphorus Field Effect Transistor

  • 이병철;주민규;진준언;이재우;김규태
    • 한국진공학회:학술대회논문집
    • /
    • 한국진공학회 2015년도 제49회 하계 정기학술대회 초록집
    • /
    • pp.120.1-120.1
    • /
    • 2015
  • We investigate the degradation pattern of Black phosphorus (BP) field effect transistor (FETs) investigated by using an mechanically exfoliated BP that react O2 and water vapor in ambient condition, degradation. The BP FETs was electrically measured every 20 minutes (1cycle) in the air, the total cycle is 100. We show electrical changes with Mobility, On/off ratio, Current and a significant positive shift in the threshold voltage. We extracted the current level at Vgs-Vth = 0, -10, -20 and fitting with Swiss-cheese model. This model suggested that Swiss-cheese model is well fitted with degradation pattern of BP FETs.

  • PDF

Degradation Pattern of Black phosphorus Field Effect Transistor

  • 이병철;주민규;진준언;이재우;김규태
    • 한국진공학회:학술대회논문집
    • /
    • 한국진공학회 2015년도 제49회 하계 정기학술대회 초록집
    • /
    • pp.167.1-167.1
    • /
    • 2015
  • We investigate the degradation pattern of Black phosphorus (BP) field effect transistor (FETs) was investigated by using an mechanically exfoliated BP that react O2 and water vapor in ambient condition, degradation. The BP FETs was electrically measured every 20 minutes (1cycle) in the air, the total cycle is 100. We show electrical changes with Mobility, On/off ratio, Current and a significant positive shift in the threshold voltage. We extracted the current level at Vgs-Vth = 0, -10, -20 and fitting with Swiss-cheese model. This model suggested that Swiss-cheese model is well fitted with degradation pattern of BP FETs.

  • PDF

500 V급 Unified Trench Gate Power MOSFET 공정 및 제작에 관한 연구 (The Process and Fabrication of 500 V Unified Trench Gate Power MOSFET)

  • 강이구
    • 한국전기전자재료학회논문지
    • /
    • 제26권10호
    • /
    • pp.720-725
    • /
    • 2013
  • Power MOSFET operate voltage-driven devices, design to control the large power switching device for power supply, converter, motor control, etc. We have analyzed trench process, field limit ring process for fabrication of unified trench gate power MOSFET. And we have analyzed electrical characteristics of fabricated unified trench gate power MOSFET. The optimal trench process was based on SF6. After we carried out SEM measurement, we obtained superior trench gate and field limit ring process. And we compared electrical characteristics of planar and trench gate unified power MOSFET after completing device fabrication. As a result, the both of them was obtained 500 V breakdown voltage. However trench gate unified power MOSFET was shown improved Vth and on state voltage drop characteristics than planar gate unified power MOSFET.

A New Voltage Driving Method for Large Size and High Resolution AMOLED Displays with a-Si:H Backplane

  • Yu, S.H.;Hong, Y.J.;Lee, J.D.;Kim, H.S.;Lee, S.J.;Tak, Y.H.
    • 한국정보디스플레이학회:학술대회논문집
    • /
    • 한국정보디스플레이학회 2008년도 International Meeting on Information Display
    • /
    • pp.197-200
    • /
    • 2008
  • We propose a novel n-type a-Si:H TFT pixel circuit which is proper to AMOLED display for the large size and high resolution. Proposed pixel circuit will be suit to panel for the high resolution because of different threshold sampling method. Driving method of proposed pixel circuit is very simple like an AMLCD. Our simulation indicates that the proposed pixel circuit can compensate the Vth shift and IR rising of power line so that provide better quality image.

  • PDF

New Voltage Programming LTPS-TFT Pixel Scaling Down VTH Variation for AMOLED Display

  • Nam, Woo-Jin;Lee, Jae-Hoon;Choi, Sung-Hwan;Jeon, Jae-Hong;Han, Min-Koo
    • 한국정보디스플레이학회:학술대회논문집
    • /
    • 한국정보디스플레이학회 2006년도 6th International Meeting on Information Display
    • /
    • pp.399-402
    • /
    • 2006
  • A new voltage-scaled compensation pixel which employs 3 p-type poly-Si TFTs and 2 capacitors without additional control line has been proposed and verified. The proposed pixel does not employ the $V_{TH}$ memorizing and cancellation, but scales down the inevitable $V_{TH}$ variation of poly-Si TFT. Also the troublesome narrow input range of $V_{DATA}$ is increased and the $V_{DD}$ supply voltage drop is suppressed. In our experimental results, the OLED current error is successfully compensated by easily controlling the proposed voltage scaling effects.

  • PDF

Bootstrapped CMOS Differential Logic 기술을 채용한 Near-$V_{TH}$ Supply에서 동작하는 64-Bit Adder 설계 (Near-$V_{TH}$ Supply 64-Bit Adder using Bootstrapped CMOS Differential Logic)

  • 오재혁;정병화;공배선
    • 대한전자공학회:학술대회논문집
    • /
    • 대한전자공학회 2008년도 하계종합학술대회
    • /
    • pp.581-582
    • /
    • 2008
  • This paper describes novel bootstrapped CMOS differential logic family operating at near-Vth supply voltage. The proposed logic family provides improved switching speed by utilizing voltage bootstrapping for the supply voltage approaching device thresholds. The circuit is configured as differential structure having single bootstrapping capacitor, minimizing area overhead and providing complete logic composition capability. A 64-bit adder designed using the proposed technique in a 0.18um CMOS process provides up to 79% improvement in terms of power-delay product as compared to the conventional adder designed with DCVS.

  • PDF

저전압 저전력 혼성신호 시스템 설계를 위한 800mV 기준전류원 회로의 설계 (A Novel 800mV Beta-Multiplier Reference Current Source Circuit for Low-Power Low-Voltage Mixed-Mode Systems)

  • 권오준;우선보;김경록;곽계달
    • 대한전자공학회:학술대회논문집
    • /
    • 대한전자공학회 2008년도 하계종합학술대회
    • /
    • pp.585-586
    • /
    • 2008
  • In this paper, a novel beta-multiplier reference current source circuit for the 800mV power-supply voltage is presented. In order to cope with the narrow input common-mode range of the OpAmp in the reference circuit, shunt resistive voltage divider branches were deployed. High gain OpAmp was designed to compensate intrinsic low output resistance of the MOS transistors. The proposed reference circuit was designed in a standard 0.18um CMOS process with nominal Vth of 420mV and -450mV for nMOS and pMOS transistor respectively. The total power consumption including OpAmp is less than 50uW.

  • PDF

Silicon Thin-body를 이용한 100nm 이하 SOI-NMOSFET에서의 제작 (Fabrication of Sub-100nm FD SOI nMOSFET using Silicon thin-body)

  • 양종헌;백인복;오지훈;안창근;조원주;이성재;임기주
    • 대한전자공학회:학술대회논문집
    • /
    • 대한전자공학회 2003년도 하계종합학술대회 논문집 II
    • /
    • pp.707-710
    • /
    • 2003
  • 10nm 이하의 두께를 갖는 얇은 SOI 층 위에서 우수한 동작 특성을 보이는 Fully-Depleted SOI nMOSFET 을 제작하였다. 게이트의 길이가 큰 경우에는 SOI 층이 얇지 않아도 좋은 특성을 보이지만, 게이트 길이가 100nm 이하에서는 Short Channel Effect 에 의한 특성 열화 때문에 SOI thin body 의 두께가 게이트 길이에 따라 같이 얇아져야 한다. [1] 100nm 게이트 길이 SOI-NMOSFET에서 10nm 이하 body 두께에 따라 Vth는 조금 상승했고, Subthreshold slope은 조금 개선되는 특성을 보였다. 또한, 45nm 게이트 길이와 3nm 로 추정되는 body 두께를 갖는 nMOSFET 에서 우수한 I-V 동작 특성을 얻었다.

  • PDF