• The Korean Journal of Rheology
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• v.8 no.3_4
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• pp.207-214
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• 1996

사출성형은 많은 장점과 유용성에도 불구하고 싱크마크나 휨과 같은 변형문제를 피 하기 어렵다. 이것은 성형품의 부위별 온도분포 및 냉각속도 차이에 의한 잔류응력에 기인 하는 것으로 구조가 복잡하거나 크기가 쿤 경우에 더욱 더 문제가 되기 쉽다. 이와 같은 문 제를 해결하기 위하여 성형품의 내부에 기포를 형성시켜 수지의 수축분을 기포의 성장으로 보상하여 주는 가스사출성형이 개발되어 많이 활용되고 있는 실정이다. 한편 일반 가스성형 과 달리 수지를 완전히 채운후 저압의 공기를 이용하여 기포를 발생시켜 수지의 체적수축분 을 보상해주는 PFP성형기술은 가스사출의 나점인 공기의 유동조절문제를 해결하고 비용이 저렴한 등의 잇점을 가지고 있다. 이 과정은 가스성형공정의 2차 침투과정과 매우 유사하나 아직까지 이에대한 이해나 연구는 매우 부족한 실정이다 본 연구는 기포의 성장이 수지의 체적수축에 의한 것이라는 가정에 근거하여 기포성장길이에 관한 모델링을 수행한 것이다. 실험결과와의 비교를 통하여 기본 가정에 대한 타당성을 검증하고 여러 인자들의 영향을 살 펴보았다. 본 연구는 PFP성형공정에 대한 이해를 증진시켜 금형설계 및 성형조건 설정에 대한 가이드라인을 제시하며 아울러 PFP공정에 대한 보다 체계적인 이해 및 일반가스성형 의 2차 침투과정 등의 관련 현상에 대한 이해 및 연구에 도움이 될것으로 기대된다.

• Transactions of the Korean Society of Automotive Engineers
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• v.21 no.3
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• pp.98-104
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• 2013

The effect of the tool-sheet interaction on formability enhancement in electromagnetic forming is investigated using FEM. A free bulging and a conical forming die with 0.7mm AL1050 sheet are used to evaluate damage evolution based on Gurson-Tvergaard-Needleman plasticity material model. The impact between the tool and sheet results in complex stress states including compressive hydrostatic stresses, which leads to a suppression of void growth and restrain ascending void volume fraction of the sheet. Therefore, the damage suppression due to the tool-sheet interaction can be the main factor contributing to the increased formability in the electromagnetic forming process.

• Journal of the Microelectronics and Packaging Society
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• v.31 no.1
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• pp.35-42
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• 2024

Recently, with the miniaturization and high integration of semiconductor chips, the bump bridge phenomenon caused by fine pitches is drawing attention as a problem. Accordingly, Cu pillar bump, which can minimize the bump bridge phenomenon, is widely applied in the semiconductor package industry for fine pitch applications. When exposed to a high-temperature environment, the thickness of the intermetallic compound (IMC) formed at the joint interface increases, and at the same time, Kirkendall void is formed and grown inside some IMC/Cu and IMC interfaces. Therefore, it is important to control the excessive growth of IMC and the formation and growth of Kirkendall voids because they weaken the mechanical reliability of the joints. Therefore, in this study, isothermal aging evaluation of Cu pillar bump joints with a CS (Cu+ Sn-1.8Ag Solder) structure was performed and the corresponding results was reported.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.21 no.7
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• pp.1021-1029
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• 1997

In metalforming, ductile fracture criteria have been used for the purpose of predicting fracture occurrence in the stage of process design prior to manufacturing. In the present investigation, some of popular criteria are reviewed to find the most suitable one among them. As a result, it is found that the modified Cockroft and Latham criterion is better than others. The reasons are: it agrees with Roy's and McClintock's void growth models, it is more general than Oyane's and Kuhn's criteria, and it predicts fractures in compression as well as in tension well. However, it is also found that the criterion is incapable of predicting fractures in torsion.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2003.05a
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• pp.254-257
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• 2003

The modified yield function of Gologanu-Leblond-Devaux in conjunction with the Barlat and Lian's yield criterion is studied to clarify the plastic deformation characteristic of voided anisotropic sheet metals. The void growth of an anisotropic sheet under biaxial tensile loading and damage effect of void growth on forming limits of sheet metals are investigated. Also, the shape parameter defining non-spherical(prolate ellipsoidal) voids with initially random orientations is introduced in M-K model. The predicted forming limits are compared with the published experimental data.

• Proceedings of the KSME Conference
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• 2008.11a
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• pp.1295-1300
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• 2008

During the manufacturing and the service life of Au-Al wire bonded electronic packages, the ball bonds experience elevated temperatures and hence accelerated thermal diffusion reactions that promote the transformation of the Au-Al phases and the IMC growth. In this paper, the IC under high temperature storage (HTS) tests at $175^{\circ}C,\;200^{\circ}C$, and $250^{\circ}C$ are meticulously investigated. Thermal exposure resulted in the IMC growth, Kirkendall void and the crack of the Au-Al phases. The crack propagation occurs resulting in the failure of the Au-Al ball bonds. As the IC was exposed at the high temperature, decreased in the lifetime.

• Journal of the Korean Ceramic Society
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• v.36 no.7
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• pp.718-724
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• 1999

Densification and grain growth behavior of bimodal size distributed alumina powder mixtures were investigated as a function of amount of coarse alumina powder. The specimens which contained coarse alumina powder for 60to 80wt% showed the highest green density. The amount of shrinkage of sintered specimen lineraly decreased with the increase of coarse alumina powder up to the content that showed the highest green density and then further addition of coarse alumina powder led to drastic decrease of shrinkage of specimen. Especially crack-like void were concurrently revealed in the sintered body with addition of coarse alumina powder above 60wt% When the sintering temperature increased up to 1650$^{\circ}C$ the amount of shrinkage of specimen linearly decreased and the grain growth were also retarded with increase of coarse lauminia powder.

• Steel and Composite Structures
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• v.18 no.3
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• pp.641-657
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• 2015

Application of reduced web beam section (RWBS) as a sacrificial fuse element has become a popular research field in recent years. Weakening of beam web in these connections may cause local web buckling around the opening area which can affect cyclic behavior of connection including: maximum load carrying capacity, strength degradation rate, dissipated energy, rotation capacity, etc. In this research, effect of local web buckling on the cyclic behavior of RWBS connections is investigated using finite element modeling (FEM). For this purpose, a T-shaped moment connection which has been tested under cyclic loading by another author is used as the reference model. Fracture initiation in models is simulated using Cyclic Void Growth Model (CVGM) which is based on micro-void growth and coalescence. Included in the results are: effect of opening corner radii, opening dimensions, beam web thickness and opening reinforcement. Based on the results, local web buckling around the opening area plays a significant role on the cyclic behavior of connection and hence any parameter affecting the local web buckling will affect entire connection behavior.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.20 no.2
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• pp.75-80
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• 2006

In this paper, to detect and observation the void discharges pulse signal, AE signals and tree growth characteristics in case the high voltage is applied to a XLPE sample for a power cable. We also examined the partial discharge current pulse and AE signals with the increase of the applied voltage in XLPE insulation. The experimental results show that a branch-type tree grows in the presence of the voids, and a bush-type tree grows in the absence of the voids in both samples. A rate of tree growth increases abruptly in proportional to the deterioration time in the presence of the of the voids, but in the absence of the voids, a rate of tree growth decreases as time goes by and finally a breakdown occurs. The frequency band of AE signals that are generated from the partial discharges in a XLPE sample, one of solid dielectric materials, is about 1.0[MHz].

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.1 no.1
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• pp.26-38
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• 1991

The fundamental conditions for growing $r-6Bi_2O_3{\cdot}SiO_2$(BSO) single crystal plates by EFG(Edge-defined Film-fed Growth) method, were investigated and characterization, quality test, property measurement were performed for obtained BSO single crystal plates. The opti$\mu$ growing conditions determined in this study were as follows: ${\cdot}$temperature gradient;$24^{\circ}C/cm$ ${\cdot}$pulling rate;2.0mm/h. BSO Single crystal plates grown at the above optimum conditions did not include secondary phase or grain boundary and were confirmed as single crystals by X-ray analysis. IT was found that the single crystal plates had <100> growth direction. G defects, ie pore, void inclusion, striation, were not detected in the single crystal plate under polarizing microscope but dislocations(microscopic defect) were found and dislocation density was $5.1\times10^5/cm^2$.