Proceedings of the KSME Conference (대한기계학회:학술대회논문집)
- 2008.11a
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- Pages.1295-1300
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- 2008
Lifetime Estimation due to IMC(Intermetallic Compound) formation between Au wire and Al pad
Au wire와 Al pad사이의 IMC(Intermetallic Compound) 형성에 의한 수명예측
- Published : 2008.11.05
Abstract
During the manufacturing and the service life of Au-Al wire bonded electronic packages, the ball bonds experience elevated temperatures and hence accelerated thermal diffusion reactions that promote the transformation of the Au-Al phases and the IMC growth. In this paper, the IC under high temperature storage (HTS) tests at
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