• Title/Summary/Keyword: Void Time

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A Study on the Horizontal Consolidation and Permeability Characteristics of Decomposed Mudstone Soil in Pohang (이암풍화토의 횡방향압밀 및 투수특성)

  • 김영수;김기영;백영식
    • Journal of the Korean Geotechnical Society
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    • v.16 no.1
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    • pp.31-42
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    • 2000
  • Consolidation and permeability are major engineering properties of soil. In clay, coefficient of permeability and consolidation can be calculated by incremental loading consolidation test. However, it is known that the incremental loading test has several deficiencies including long testing time, non-uniform stress state, very soft clay and problem of back pressure saturation. Specially, it is not performed with horizontal consolidation test. Several methods have been proposed for obtaining reliable values of $C_v$. Among these, the square root of time-fitting method proposed by Taylor(1948) and logarithm of time-fitting method, also called Casagrande's method, are used extensively in soil engineering practice. But these methods are not amenable for the absence of initial linear portion and have the difficulties involved in distinguishing secondary compression from primary compression. Rowecell consolidation tests were carried out in this study with different trimming axis and sample size. The results were compared with those of other methods; Casagrande,$Taylor,\; Casagrande,\; Hyperbolic,\; \delta/t-logt$. From the results, we explained a relationship between horizontal coefficient of permeability and void ratio was obtained. Finally, the directly measured horizontal coefficient of permeability obtained by using the Rowecell was compared with the permeability derived indirectly from the consolidation test result.

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Soil Water Characteristic Curve Using Volumetric Pressure Plate Extractor Incorporated with TDR System (TDR 측정시스템이 도입된 압력판 추출 시험기를 이용한 흙-함수특성곡선 연구)

  • Jung, Young-Seok;Sa, Hee-Dong;Kang, Seonghun;Oh, Se-Boong;Lee, Jong-Sub
    • Journal of the Korean Geotechnical Society
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    • v.31 no.8
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    • pp.17-28
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    • 2015
  • The purpose of this study is to measure the volumetric water content of unsaturated soils during drying and wetting process by using volumetric pressure plate extractor (VPPE) incorporated with time domain reflectometry (TDR). The VPPE consists of a pressure cell, a pressure regulator, a burette system and a TDR probe. Two samples with different initial void ratios were prepared in the pressure cell, and the air pressure at the range of 0.1 kPa - 50 kPa was applied to adjust the matric suction by the pressure regulator. The burette system was used to measure the volumetric water content change of the sample according to the matric suction. In addition, the TDR probe, installed in the cell, was used to evaluate the dielectric constant from the reflected signal of the electromagnetic wave at the probe. The volumetric water content of specimen was estimated by the empirical equation between the volumetric water content and dielectric constant, which was calibrated with the Jumunjin sand. The test results show that the volumetric water content calculated by TDR probe is strongly correlated to the measured value by burette system. The hysteresis occurs during drying and wetting process. Furthermore, the degree of hysteresis reduces in the repeated process. This study suggests that TDR may be effectively used to evaluate the water content soil for the determination of water characteristic curve of unsaturated soils.

High Speed Direct Bonding of Silicon Wafer Using Atmospheric Pressure Plasma (상압 플라즈마를 이용한 고속 실리콘 웨이퍼 직접접합 공정)

  • Cha, Yong-Won;Park, Sang-Su;Shin, Ho-Jun;Kim, Yong Taek;Lee, Jung Hoon;Suh, Il Woong;Choa, Sung-Hoon
    • Journal of the Microelectronics and Packaging Society
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    • v.22 no.3
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    • pp.31-38
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    • 2015
  • In order to achieve a high speed and high quality silicon wafer bonding, the room-temperature direct bonding using atmospheric pressure plasma and sprayed water vapor was developed. Effects of different plasma fabrication parameters, such as flow rate of $N_2$ gas, flow rate of CDA (clear dry air), gap between the plasma head and wafer surface, and plasma applied voltage, on plasma activation were investigated using the measurements of the contact angle. Influences of the annealing temperature and the annealing time on bonding strength were also investigated. The bonding strength of the bonded wafers was measured using a crack opening method. The optimized condition for the highest bonding strength was an annealing temperature of $400^{\circ}C$ and an annealing time of 2 hours. For the plasma activation conditions, the highest bonding strength was achieved at the plasma scan speed of 30 mm/sec and the number of plasma treatment of 4 times. After optimization of the plasma activation conditions and annealing conditions, the direct bonding of the silicon wafers was performed. The infrared transmission image and the cross sectional image of bonded interface indicated that there is no void and defects on the bonded wafers. The bonded wafer exhibited a bonding strength of average $2.3J/m^2$.

Studies on Cu Dual-damascene Processes for Fabrication of Sub-0.2${\mu}m$ Multi-level Interconnects (Sub-0.2${\mu}m$ 다층 금속배선 제작을 위한 Cu Dual-dmascene공정 연구)

  • Chae, Yeon-Sik;Kim, Dong-Il;Youn, Kwan-Ki;Kim, Il-Hyeong;Rhee, Jin-Koo;Park, Jang-Hwan
    • Journal of the Korean Institute of Telematics and Electronics D
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    • v.36D no.12
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    • pp.37-42
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    • 1999
  • In this paper, some of main processes for the next generation integrated circuits, such as Cu damascene process using CMP, electron beam lithography, $SiO_2$ CVD and RIE, Ti/Cu-CVD were carried cut and then, two level Cu interconnects were accomplished. In the results of CMP unit processes, a 4,635 ${\AA}$/min of removal rate, a selectivity of Cu : $SiO_2$ of 150:1, a uniformity of 4.0% are obtained under process conditions of a head pressure of 4 PSI, table and head speed of 25rpm, a oscillation distance of 40 mm, and a slurry flow rate of 40 ml/min. Also 0.18 ${\mu}m\;SiO_2$ via-line patterns are fabricated using 1000 ${\mu}C/cm^2$ dose, 6 minute and 30 second development time and 1 minute and 30 second etching time. And finally sub-0.2 ${\mu}$ twolevel metal interconnects using the developed processes were fabricated and the problems of multilevel interconnects are discussed.

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Growth of Nanocrystalline Diamond on W and Ti Films (W 및 Ti 박막 위에서 나노결정질 다이아몬드의 성장 거동)

  • Park, Dong-Bae;Myung, Jae-Woo;Na, Bong-Kwon;Kang, Chan Hyoung
    • Journal of the Korean institute of surface engineering
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    • v.46 no.4
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    • pp.145-152
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    • 2013
  • The growth behavior of nanocrystalline diamond (NCD) film has been studied for three different substrates, i.e. bare Si wafer, 1 ${\mu}m$ thick W and Ti films deposited on Si wafer by DC sputter. The surface roughness values of the substrates measured by AFM were Si < W < Ti. After ultrasonic seeding treatment using nanometer sized diamond powder, surface roughness remained as Si < W < Ti. The contact angles of the substrates were Si ($56^{\circ}$) > W ($31^{\circ}$) > Ti ($0^{\circ}$). During deposition in the microwave plasma CVD system, NCD particles were formed and evolved to film. For the first 0.5h, the values of NCD particle density were measured as Si < W < Ti. Since the energy barrier for heterogeneous nucleation is proportional to the contact angle of the substrate, the initial nucleus or particle densities are believed to be Si < W < Ti. Meanwhile, the NCD growth rate up to 2 h was W > Si > Ti. In the case of W substrate, NCD particles were coalesced and evolved to the film in the short time of 0.5 h, which could be attributed to the fact that the diffusion of carbon species on W substrate was fast. The slower diffusion of carbon on Si substrate is believed to be the reason for slower film growth than on W substrate. The surface of Ti substrate was observed as a vertically aligned needle shape. The NCD particle formed on the top of a Ti needle should be coalesced with the particle on the nearby needle by carbon diffusion. In this case, the diffusion length is longer than that of Si or W substrate which shows a relatively flat surface. This results in a slow growth rate of NCD on Ti substrate. As deposition time is prolonged, NCD particles grow with carbon species attached from the plasma and coalesce with nearby particles, leaving many voids in NCD/Ti interface. The low adhesion of NCD films on Ti substrate is related to the void structure of NCD/Ti interface.

A Study on the Surface Phenomena of Re-creational Gilt Layer by Conditions of Heat Treatment (열처리 조건에 따른 재현 도금층의 표면현상 연구)

  • Yang, Seok-Woo;Kim, Soo-Ki
    • Journal of Conservation Science
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    • v.28 no.1
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    • pp.29-37
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    • 2012
  • This study discusses a mercury amalgam gilding technique and examines how the color, surface and section of the gilt layer changes as the condition of heat treatment with mercury amalgam gilt object is changed. Some previous studies have mentioned reasons for various colors on gilt bronze artifacts depending on gilding manufacture and environment. However, reason for reddish color with gold on the artifacts' surface brought on high temperature corrosion has yet to be discussed and analyzed. A methodology was found in representing the mercury amalgam gilding technique and heat treatment test. According to the result of the heat treatment test, in the conditions of higher temperature and longer time, the oxidized layer on the gilt layer was distributed more widely and in the part when the oxide layer was eliminated, the gilt layer with a reddish color was observed. Moreover, in the surface observation of the specimen on which yellow and reddish colors were agitated, the changing aspects of its surface condition differed by colors. When investigated the section, it was observed that the void density and size became larger. After a test, the surface components changed; the temperature of heat treatment increased, component ratio of Hg and Au decreased gradually but component ratio of Cu increased. In regard to the gilt layer, as the time was longer and the temperature became higher for the heat treatment, the component ratio of Au and Cu by layers tended to change in inverse proportion. It is concluded that gilding techniques and the burial environment can make a difference in the surface color of the gilt layer on the gilt bronze artifacts, the high temperature corrosion that occurs by heat after they are manufactured is also one of the factors that affects their surface color.

Interfacial and Mechanical Properties of Sn-57Bi-1Ag Solder Joint with Various Conditions of a Laser Bonding Process (다양한 레이저 접합 공정 조건에 따른 Sn-57Bi-1Ag 솔더 접합부의 계면 및 기계적 특성)

  • Ahn, Byeongjin;Cheon, Gyeong-Yeong;Kim, Jahyeon;Kim, Jungsoo;Kim, Min-Su;Yoo, Sehoon;Park, Young-Bae;Ko, Yong-Ho
    • Journal of the Microelectronics and Packaging Society
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    • v.28 no.2
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    • pp.65-70
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    • 2021
  • In this study, interfacial properties and mechanical properties of joints were reported after Cu pads finished with organic solderability preservative (OSP) on flame retardant-4 (FR-4) printed circuit board (PCB) and electronic components were joined with a Sn-57Bi-1Ag solder paste by using a laser bonding process. The laser bonding process was performed under various bonding conditions with changing a laser power and a bonding time and effects of bonding conditions on interfacial and mechanical properties of joints were analyzed. In order to apply for industry, properties of bonding joints using a reflow bonding process which are widely used were compared. When the laser bonding process were performed, we observed that Cu6Sn5 intermetallic compounds (IMCs) were fully formed at the interface although the bonding times were very short about 2 and 3 s. Furthermore, void formations of the joints by using the laser bonding process were suppressed at the joints with comparing to the reflow bonding process and shear strengths of bonding joints were higher than that by using the reflow bonding process. Therefore, in spite of a very short bonding time, it is expected that joints will be stably formed and have a high mechanical strength by using the laser bonding process.

Experimental analysis and modeling for predicting bistatic reverberation in the presence of artificial bubbles (인공기포 존재 환경에서의 양상태 잔향음 예측을 위한 해상 실험 분석 및 모델링 연구)

  • Yang, Wonjun;Oh, Raegeun;Bae, Ho Seuk;Son, Su-Uk;Kim, Da Sol;Choi, Jee Woong
    • The Journal of the Acoustical Society of Korea
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    • v.41 no.4
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    • pp.426-434
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    • 2022
  • Bubbles generated by various causes in the ocean are known to persist for long periods of time. Although the volume occupied by bubbles in the ocean is small, the presence of bubbles in ocean due to resonance and attenuation greatly affects the acoustic properties. Accordingly, bistatic reverberation experiment was performed in the ocean where artificial bubbles exist. A number of transducers and receivers were installed on 6 buoys arranged in a hexagonal shape, and blowing agents were dropped in the center of the buoy to generate bubbles. For reverberation modeling that reflects acoustic characteristics changed by bubbles, the spatial distribution of bubbles was estimated using video data and received signals. A measurement-based bubble spectral shape was used, and it was assumed that the bubble density within the spatial distribution of the estimated bubble was the same. As a result, it was confirmed that the bubble reverberation was simulated in a time similar to the measured data regardless of the bubble density, and the bubble reverberation level similar to the measured data was simulated at a void fraction of about 10-7 ~ 10-6.8.

An Experimental Study for Characteristics Evaluation of Cement Mortar Using Infrared Thermography Technique (적외선 화상기법을 이용한 시멘트 모르타르 특성의 실험적 평가)

  • Kwon, Seung-Jun;Maria, Q. Feng
    • KSCE Journal of Civil and Environmental Engineering Research
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    • v.30 no.1A
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    • pp.53-59
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    • 2010
  • Recently, NDTs (Non-Destructive Techniques) using infrared camera are widely studied for detection of damage and void in RC (reinforced concrete) structures and they are also considered as an effective techniques for maintenance of infrastructures. The temperature on concrete surface depends on material and thermal properties such as specific heat, thermal conductivity, and thermal diffusion coefficient. Different porosity on cement mortar due to different mixture proportions can show different heat behavior in cooling stage. The porosity can affect physical and durability properties like strength and chloride diffusion coefficient as well. In this paper, active thermography which uses flash for heat induction is utilized and thermal characteristics on surface are evaluated. Samples of cement mortar with W/C (water to cement ratio) of 0.55 and 0.65 are prepared and physical properties like porosity, compressive strength, and chloride diffusion coefficient are evaluated. Then infrared thermography technique is carried out in a constant room condition (temperature $20{\sim}22^{\circ}C$ and relative humidity 55-60%). The mortar samples with higher porosity shows higher residual temperature at the cooling stage and also shows reduced critical time which shows constant temperature due to back wall effect. Furthermore, simple equation for critical time of back wall effect is suggested with porosity and experimental constants. These characteristics indicate the applicability of infrared thermography as an NDT for quality assessment of cement based composite like concrete. Physical properties and thermal behavior in cement mortar with different porosity are analyzed in discussed in this paper.

A Study on Actual Usage of Information Systems: Focusing on System Quality of Mobile Service (정보시스템의 실제 이용에 대한 연구: 모바일 서비스 시스템 품질을 중심으로)

  • Cho, Woo-Chul;Kim, Kimin;Yang, Sung-Byung
    • Asia pacific journal of information systems
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    • v.24 no.4
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    • pp.611-635
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    • 2014
  • Information systems (IS) have become ubiquitous and changed every aspect of how people live their lives. While some IS have been successfully adopted and widely used, others have failed to be adopted and crowded out in spite of remarkable progress in technologies. Both the technology acceptance model (TAM) and the IS Success Model (ISSM), among many others, have contributed to explain the reasons of success as well as failure in IS adoption and usage. While the TAM suggests that intention to use and perceived usefulness lead to actual IS usage, the ISSM indicates that information quality, system quality, and service quality affect IS usage and user satisfaction. Upon literature review, however, we found a significant void in theoretical development and its applications that employ either of the two models, and we raise research questions. First of all, in spite of the causal relationship between intention to use and actual usage, in most previous studies, only intention to use was employed as a dependent variable without overt explaining its relationship with actual usage. Moreover, even in a few studies that employed actual IS usage as a dependent variable, the degree of actual usage was measured based on users' perceptual responses to survey questionnaires. However, the measurement of actual usage based on survey responses might not be 'actual' usage in a strict sense that responders' perception may be distorted due to their selective perceptions or stereotypes. By the same token, the degree of system quality that IS users perceive might not be 'real' quality as well. This study seeks to fill this void by measuring the variables of actual usage and system quality using 'fact' data such as system logs and specifications of users' information and communications technology (ICT) devices. More specifically, we propose an integrated research model that bring together the TAM and the ISSM. The integrated model is composed of both the variables that are to be measured using fact as well as survey data. By employing the integrated model, we expect to reveal the difference between real and perceived degree of system quality, and to investigate the relationship between the perception-based measure of intention to use and the fact-based measure of actual usage. Furthermore, we also aim to add empirical findings on the general research question: what factors influence actual IS usage and how? In order to address the research question and to examine the research model, we selected a mobile campus application (MCA). We collected both fact data and survey data. For fact data, we retrieved them from the system logs such information as menu usage counts, user's device performance, display size, and operating system revision version number. At the same time, we conducted a survey among university students who use an MCA, and collected 180 valid responses. A partial least square (PLS) method was employed to validate our research model. Among nine hypotheses developed, we found five were supported while four were not. In detail, the relationships between (1) perceived system quality and perceived usefulness, (2) perceived system quality and perceived intention to use, (3) perceived usefulness and perceived intention to use, (4) quality of device platform and actual IS usage, and (5) perceived intention to use and actual IS usage were found to be significant. In comparison, the relationships between (1) quality of device platform and perceived system quality, (2) quality of device platform and perceived usefulness, (3) quality of device platform and perceived intention to use, and (4) perceived system quality and actual IS usage were not significant. The results of the study reveal notable differences from those of previous studies. First, although perceived intention to use shows a positive effect on actual IS usage, its explanatory power is very weak ($R^2$=0.064). Second, fact-based system quality (quality of user's device platform) shows a direct impact on actual IS usage without the mediating role of intention to use. Lastly, the relationships between perceived system quality (perception-based system quality) and other constructs show completely different results from those between quality of device platform (fact-based system quality) and other constructs. In the post-hoc analysis, IS users' past behavior was additionally included in the research model to further investigate the cause of such a low explanatory power of actual IS usage. The results show that past IS usage has a strong positive effect on current IS usage while intention to use does not have, implying that IS usage has already become a habitual behavior. This study provides the following several implications. First, we verify that fact-based data (i.e., system logs of real usage records) are more likely to reflect IS users' actual usage than perception-based data. In addition, by identifying the direct impact of quality of device platform on actual IS usage (without any mediating roles of attitude or intention), this study triggers further research on other potential factors that may directly influence actual IS usage. Furthermore, the results of the study provide practical strategic implications that organizations equipped with high-quality systems may directly expect high level of system usage.