• 전자통신동향분석
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• 제35권4호
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• pp.1-10
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• 2020

Since the 1960s, semiconductor packaging technology has developed into electrical joining techniques using lead frames or C4 bumps using tin-lead solder compositions based on traditional reflow processes. To meet the demands of a highly integrated semiconductor device, high reliability, high productivity, and an eco-friendly simplified process, packaging technology was required to use new materials and processes such as lead-free solder, epoxy-based non cleaning interconnection material, and laser based high-speed processes. For next generation semiconductor packaging, the study status of two epoxy-based interconnection materials such as fluxing and hybrid underfills along with a laser-assisted bonding process were introduced for fine pitch semiconductor applications. The fluxing underfill is a solvent-free and non-washing epoxy-based material, which combines the underfill role and fluxing function of the Surface Mounting Technology (SMT) process. The hybrid underfill is a mixture of the above fluxing underfill and lead-free solder powder. For low-heat-resistant substrate applications such as polyethylene terephthalate (PET) and high productivity, laser-assisted bonding technology is introduced with two epoxy-based underfill materials. Fluxing and hybrid underfills as next-generation semiconductor packaging materials along with laser-assisted bonding as a new process are expected to play an active role in next-generation large displays and Augmented Reality (AR) and Virtual Reality (VR) markets.

• The Journal of Advanced Prosthodontics
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• 제15권5호
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• pp.271-280
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• 2023

PURPOSE. This in vitro study aimed to compare the accuracy of the conventional facebow system and the newly developed POP (PNUD (Pusan National University Dental School) Occlusal Plane) bow system for occlusal plane transfer in asymmetric ear position. MATERIALS AND METHODS. Two dentists participated in this study, one was categorized as Experimenter 1 and the other as Experimenter 2 based on their clinical experience with the facebow (1F, 2F) and POP bow (1P, 2P) systems. The vertical height difference between the two ears of the phantom model was set to 3 mm. Experimenter 1 and Experimenter 2 performed the facebow and POP bow systems on the phantom model 10 times each, and the transfer accuracy was analyzed. The accuracy was evaluated by measuring the angle between the reference virtual plane (RVP) of the phantom model and the experimental virtual plane (EVP) of the upper mounting plate through digital superimposition. All data were statistically analyzed using a paired t-test (P < .05). RESULTS. Regardless of clinical experience, the POP bow system (0.53° ± 0.30 (1P) and 0.19° ± 0.18 (2P) for Experimenter 1 and 2, respectively) was significantly more accurate than the facebow system (1.88° ± 0.50 (1F) and 1.34° ± 0.25 (2F), respectively) in the frontal view (P < .05). In the sagittal view, no significant differences were found between the POP bow system (0.92° ± 0.50 (1P) and 0.73° ± 0.42 (2P) for Experimenter 1 and 2, respectively) and the facebow system (0.82° ± 0.49 (1F) and 0.60° ± 0.39 (2F), respectively), regardless of clinical experience (P > .05). CONCLUSION. In cases of asymmetric ear position, the POP bow system may transfer occlusal plane information more accurately than the facebow system in the frontal view, regardless of clinical experience.

• 한국안광학회지
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• 제19권3호
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• pp.339-344
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• 2014

목적: 본 연구는 BS 프리즘의 반사면을 이용한 주야 조준경의 개발에 관한 것이다. 방법: BS(beam splitting) 프리즘의 반사면의 상하에 도트시표발생부와 LCD 패널을 배치하고, BS 프리즘 전방에는 doublet 형태로 설계된 반사경을 배치하였다. 이렇게 함으로서 도트시표 발생부에서의 도트시표 허상을 관찰자 쪽에 결상시키도록 하는 기능, 외부 목표물 주변부의 정보는 관찰자에게 1배로 보이도록 하는 기능과 LCD 패널의 영상을 직접 관찰자가 볼 수 있게 하는 기능을 가진 새로운 형태의 BS 프리즘을 이용한 주야 조준경을 개발하였다. 결과: BS 프리즘의 반사면이 도트 시표를 반사시키는 도트사이트로서의 역할과 LCD 패널에 디스플레이된 야간 열영상을 관찰자가 관찰할 수 있도록 하는 반사 광학계 역할을 하도록 함으로써 주간에는 도트사이트로서 주간조준경 기능을, 야간에는 열영상 디스플레이 장치로서 야간조준경 기능을 하는 주야 조준경 장치를 개발하였다. 결론: 본 연구에서 우리는 기존의 도트사이트와 기존의 야간조준경을 BS 프리즘을 이용하여 결합함으로서 선택적으로 주야 조준경 역할을 할 수 있는 주야 조준경을 개발하였다. 이렇게 함으로써 우리는 기존의 도트사이트와 야간조준경의 착탈식 조합보다 사격의 신속성을 더욱 높일 수 있으며 총기류에의 장착에 있어서 보다 편리함을 제공해주는 새로운 형태의 BS 프리즘을 이용한 주야 조준경을 설계 개발할 수 있었다.