• Journal of the Microelectronics and Packaging Society
• /
• v.13 no.2 s.39
• /
• pp.9-13
• /
• 2006

The copper lines in COF are usually fabricated by subtractive method. As the width of lines are smaller, the subtractive method has a lateral etching problems. In semi-additive method, copper lines are fabricated by lithographic technique followed by electroplating method. Fine line patterns of $10-40{\mu}m$ were used for this study. Two different types of thick photoresist, AZ4620 and PMER900, were employed for PR mold. Copper lines were fabricated by electroplating method. The crack were found in fine copper lines due to high residual stress when normal copper electroplating bath were used. The via filling copper electroplating bath were replaced the normal electroplating bath and then cracks were not found in the fine copper lines. During substrate etching, the lateral etching of copper lines were not occurred.

• Journal of Electrochemical Science and Technology
• /
• v.7 no.3
• /
• pp.234-240
• /
• 2016

The effect of initial electrolyte loading (IEL) on cell performance in a coin-type molten carbonate fuel cell (MCFC) was investigated in this work. Since the material of MCFC depends on the manufacturer, optimisation requires experimental investigation. In total, four IEL values, 1.5, 2.0, 3.0, and 4.0 g, were used, corresponding to a pore filling ratio (PFR) of 38, 51, 77, and 102%, respectively. The cell performance with respect to the PFR was analysed via steady-state polarisation, step-chronopotentiomtery, and impedance methods. The electrochemical analyses revealed that internal resistance and overpotential of the cell decreased with increasing PFR, and a large overpotential was observed when the PFR was 102%, probably due to the flooding phenomenon. After operation, cross-section of the cell was analysed via surface analysis of SEM and EDS methods, and the remaining electrolyte was estimated by dissolution of the cell in 10 wt% acetic acid. A linear relationship between IEL and the weight reduction ratio by dissolution was obtained. Thus, the remaining amount of electrolyte could be measured after operation. The results of SEM and EDS showed that a PFR of 38 and 102% showed a lack and flooding of electrolytes at the cell, respectively, which led to a large overpotential. This work reports that MCFC performance is allowed only in the narrow range of PFR.

• Journal of the Microelectronics and Packaging Society
• /
• v.22 no.4
• /
• pp.7-14
• /
• 2015

Research and application of three dimensional packaging technology in electronics have been increasing according to the trend of high density, high capacity and light weight in electronics. In this paper, TSV fabrication and research trend in three dimensional packaging are reported. Low alpha solder bumping which can solve the soft error problem in electronics is also introduced. In detail, this paper includes fabrication of TSV, functional layers deposition, Cu filling in TSV by electroplating using PPR (periodic pulse reverse) and 3 step PPR processes, and low alpha solder bumping on TSV by solder ball. TSV and low alpha solder bumping technologies need more studies and improvements, and the drawbacks of three dimensional packaging can be solved gradually through continuous attentions and researches.

• Structural Engineering and Mechanics
• /
• v.55 no.5
• /
• pp.979-999
• /
• 2015

This paper proposes a novel reliability analysis method which computes reliability index, most probable point and probability of failure of uncertain systems more efficiently and accurately with compared to Monte Carlo, first-order reliability and response surface methods. It consists of Initial and Simulation steps. In Initial step, a number of space-filling designs are selected throughout the variables space, and then in Simulation step, performances of most of samples are estimated via interpolation using the space-filling designs, and only for a small number of the samples actual performance function is used for evaluation. In better words, doing so, we use a simple interpolation function called "reduced" function instead of the actual expensive-to-evaluate performance function of the system to evaluate most of samples. By using such a reduced function, total number of evaluations of actual performance is significantly reduced; hence, the method can be called Reduced Function Evaluations method. Reliabilities of six examples including series and parallel systems with multiple failure modes with truncated and/or non-truncated random variables are analyzed to demonstrate efficiency, accuracy and robustness of proposed method. In addition, a reliability-based design optimization algorithm is proposed and an example is solved to show its good performance.

• Proceedings of the International Microelectronics And Packaging Society Conference
• /
• 2003.09a
• /
• pp.261-278
• /
• 2003

Concepts.Wafer-Level Chip-Scale Concept with Handling Substrate.Low Accuracy Placement Layout with Isolation Trench.Possible Pitch of Interconnections down to $10{\mu}{\textrm}{m}$ (Sn-Grains).Wafer-to-Wafer Equipment Adjustment Accuracy meets this Request of Alignment Accuracy (+/-1.5 ${\mu}{\textrm}{m}$).Adjustment Accuracy of High-Speed Chip-to-Wafer Placement Equipment starts to meet this request.Face-to-Face Modular / SLID with Flipped Device Orientation.interchip Via / SLID with Non-Flipped Orientation SLID Technology Features.Demonstration with Copper / Tin-Alloy (SLID) and W-InterChip Vias (ICV).Combination of reliable processes for advanced concept - Filling of vias with W as standard wafer process sequence.No plug filling on stack level necessary.Simultanious formation of electrical and mechanical connection.No need for underfiller: large area contacts replace underfiller.Cu / Sn SLID layers $\leq$ $10{\mu}{\textrm}{m}$ in total are possible Electrical Results.Measurements of Three Layer Stacks on Daisy Chains with 240 Elements.2.5 Ohms per Chain Element.Contribution of Soldering Metal only in the Range of Milliohms.Soldering Contact Resistance ($0.43\Omega$) dominated by Contact Resistance of Barrier and Seed Layer.Tungsten Pin Contribution in the Range of 1 Ohm

• Membrane Journal
• /
• v.26 no.4
• /
• pp.310-317
• /
• 2016

Lithium ion secondary battery (LISB) is an energy conversion system operated via charging-discharging cycle based on Lithium ion migration. LISB has a lot of advantages such as high energy density, low self-discharge rate, and a relatively high lifetime. Recently, increasing demands of electric vehicles have been encouraging the development of LISB with high capacity. Unfortunately, it causes some critical safety issues. It includes dendrite formation on negative electrode, resulting in electric shortage problems and battery explosion. Also, the elevated temperatures occurred during the LISB operation induces thermal shrinkage of polyolefin (e.g., polyethylene and polypropylene) separators. Consequently, the low thermal stability leads to decay of LISB performances and the reduction of lifetime. In this study, sulfonated poly (arylene ether sulfone) (SPAES) random copolymers were used as key materials to prepare polyolefin pore-filling separator. The resulting separators were evaluated in the term of metal ion chelation capability associated with dendrite formation, $Li^+$ ion conductivity and thermal durability.

• Advances in nano research
• /
• v.15 no.4
• /
• pp.339-353
• /
• 2023

This work aims to present a solution for the buckling behavior of perforated nano/microbeams with deformable boundary conditions using nonlocal strain gradient theory (NLSGT). For the first time, a solution that can provide buckling loads based on the non-local and strain gradient effects of perforated nanostructures on an elastic foundation, while taking into account both deformable and rigid boundary conditions. Stokes' transformation and Fourier series are used to realize this aim and determine the buckling loads under various boundary conditions. We employ the NLSGT to account for size-dependent effects and utilize the Winkler model to formulate the elastic foundation. The buckling behavior of the perforated nano/microbeams restrained with lateral springs at both ends is studied for various parameters such as the number of holes, the length and filling ratio of the perforated beam, the internal length, the nonlocal parameter and the dimensionless foundation parameter. Our results indicate that the number of holes and filling ratio significantly affect the buckling response of perforated nano/microbeams. Increasing the filling ratio increases buckling loads, while increasing the number of holes decreases buckling loads. The effects of the non-local and internal length parameters on the buckling behavior of the perforated nano/microbeams are also discussed. These material length parameters have opposite effects on the variation of buckling loads. This study presents an effective eigenvalue solution based on Stokes' transformation and Fourier series of the restrained nano/microbeams under the effects of elastic medium, perforation parameters, deformable boundaries and nonlocal strain gradient elasticity for the first time.

• Korean Journal of Radiology
• /
• v.22 no.3
• /
• pp.395-404
• /
• 2021

Objective: To compare the utility of computed tomography perfusion (CTP) and three different 4-point scoring systems in computed tomography angiography (CTA) in confirming brain death (BD) in patients with and without skull defects. Materials and Methods: Ninety-two patients clinically diagnosed as BD using CTA and/or CTP for confirmation were retrospectively reviewed. For the final analysis, 86 patients were included in this study. Images were re-evaluated by three radiologists according to the 4-point scoring systems that consider the vessel opacification on 1) the venous phase for both M4 segments of the middle cerebral arteries (MCAs-M4) and internal cerebral veins (ICVs) (A60-V60), 2) the arterial phase for the MCA-M4 and venous phase for the ICVs (A20-V60), 3) the venous phase for the ICVs and superior petrosal veins (ICV-SPV). The CTP images were independently reviewed. The presence of an open skull defect and stasis filling was noted. Results: Sensitivities of the ICV-SPV, A20-V60, A60-V60 scoring systems, and CTP in the diagnosis of BD were 89.5%, 82.6%, 67.4%, and 93.3%, respectively. The sensitivity of A20-V60 scoring was higher than that of A60-V60 in BD patients (p < 0.001). CTP was found to be the most sensitive method (86.5%) in patients with open skull defect (p = 0.019). Interobserver agreement was excellent in the diagnosis of BD, in assessing A20-V60, A60-V60, ICV-SPV, CTP, and good in stasis filling (κ: 0.84, 0.83, 0.83, 0.83, and 0.67, respectively). Conclusion: The sensitivity of CTA confirming brain death differs between various proposed 4-point scoring systems. Although the ICV-SPV is the most sensitive, evaluation of the SPV is challenging. Adding CTP to the routine BD CTA protocol, especially in cases with open skull defect, could increase sensitivity as a useful adjunct.

• Journal of the Korean Society of Radiology
• /
• v.12 no.6
• /
• pp.713-718
• /
• 2018

In many previous studies, monte carlo simulation is used to produce lead-free shielding sheet, and the possibility of radiation shielding capability and weight reduction is presented. But it is difficult to simulation for binder and micro-pores because of In fact it does not provide sufficient information necessary for the commercialization process. Therefore, in this paper, the results of radiation shielding capability corresponding to filling factor was presented by using the screen printing method to provide information on gel-paste required for the commercialization process. In this study, the geometric setup for evaluate of radiation shielding ability was designed to comply with IEC 61331-1:2014 and KS A 4025. In addition, radiation irradiation conditions were 100 kVp filtered with 2.0 mmAl total filtration was applied according to KS A 4021 standard. In this study, Pb $1270{\mu}m$, $BaSO_4$ $3035{\mu}m$, $Bi_2O_3$ $1849{\mu}m$ and $WO_3$ $2631{\mu}m$ were analyzed based on ten value layer. Additionally, the filling factor was analyzed as $BaSO_4$ 38.6%, $Bi_2O_3$ 27.1%, $WO_3$ 30.15%. However, in the case of applying low-temperature high-pressure molding in the future, it is expected that the radiation shielding capability can be sufficiently improved by reducing the porosity while increasing the filling factor.

• Clean Technology
• /
• v.27 no.1
• /
• pp.24-32
• /
• 2021

Unburned carbon (UC) was successfully separated from fly ash by up to 85.8% in weight via froth flotation using soybean oil as a collector. An 18 wt% yield of microceramics (CM) could be achieved by employing a hydro cyclone separator located immediately after the flotation equipment. UC and CM were tested as alternatives to weight-adding material and polymer (especially polypropylene in this study) filler, respectively. Large particles of UC were broken down into smaller ones via ball milling to have an average particle diameter of 10.2 ㎛. When crushed UC was used as an alternative to clay as a rubber weight-adding material, a somewhat lower tensile strength and elongation rate than the allowed values were unfortunately obtained. In order to satisfy the standard limits, further treatment of UC is required to enhance surface energy for more intimate bonding with rubber. CM was observed in spherical forms with an average diameter of 5 ㎛. The surface of the CM particles was modified with phenol, polyol, stearic acid, and oleic acid so that the surface modified CM could be used as a polypropylene-filling agent. The flowability was good, but due to the lack of coupling forces with polypropylene, successful impact strength and flexural strength could not be obtained. However, when mixing the surface-modified CM with 1% silane by weight, a drastic increase in both the impact strength and flexural strength were obtained.